公开(公告)号：US08436636B2

公开(公告)日：2013-05-07

申请号：US11545958

申请日：2006-10-10

Applicant: Amir Salehi ,  Reese Cutler ,  David Reha

Inventor： Amir Salehi ,  Reese Cutler ,  David Reha

IPC: G01R31/28 ,  G01R31/26

CPC classification number: G01R31/2818 ,  G01R31/2808 ,  H05K1/0268 ,  H05K3/403 ,  H05K2201/09181

Abstract: Methods and apparatuses for testing circuit boards having side mounted test pads are described here.In one aspect of the invention, a test method includes applying test probes to test pads located on at least one side plane of a circuit board. The test method further includes testing components of the circuit board by applying electrical signals to the test pads that are each coupled to at least one of a plurality of conductive members coupled to the circuit board.

Abstract translation: 这里描述了用于测试具有侧面安装的测试焊盘的电路板的方法和装置。 在本发明的一个方面，测试方法包括将测试探针应用于位于电路板的至少一个侧面上的测试焊盘。 测试方法还包括通过将电信号施加到测试焊盘来测试电路板的组件，每个耦合到耦合到电路板的多个导电构件中的至少一个。

公开(公告)号：US20080084225A1

公开(公告)日：2008-04-10

申请号：US11545958

申请日：2006-10-10

Applicant: Amir Salehi ,  Reese Cutler ,  David Reha

Inventor： Amir Salehi ,  Reese Cutler ,  David Reha

IPC: G01R31/02

CPC classification number: G01R31/2818 ,  G01R31/2808 ,  H05K1/0268 ,  H05K3/403 ,  H05K2201/09181

Abstract: Methods and apparatuses for testing circuit boards having side mounted test pads are described here.In one aspect of the invention, a test method includes applying test probes to test pads located on at least one side plane of a circuit board. The test method further includes testing components of the circuit board by applying electrical signals to the test pads that are each coupled to at least one of a plurality of conductive members coupled to the circuit board.

Abstract translation: 这里描述了用于测试具有侧面安装的测试焊盘的电路板的方法和装置。 在本发明的一个方面，测试方法包括将测试探针应用于位于电路板的至少一个侧面上的测试焊盘。 测试方法还包括通过将电信号施加到测试焊盘来测试电路板的组件，每个耦合到耦合到电路板的多个导电构件中的至少一个。