公开(公告)号：US08889999B2

公开(公告)日：2014-11-18

申请号：US13280008

申请日：2011-10-24

Applicant: Aritharan Thurairajaratnam ,  David Senk

Inventor： Aritharan Thurairajaratnam ,  David Senk

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K1/024 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09063 ,  H05K2203/0242

Abstract: A printed circuit board (PCB) stack-up has a signal via configured to transmit a signal through at least two different layers of the PCB stack-up, a reference structure that is at least a portion of a return path for the signal; and an unplated via disposed in an area surrounding the signal via. The unplated via is disposed in the area surrounding the signal via to improve the characteristic impedance of the signal via.

Abstract translation: 印刷电路板（PCB）叠层具有被配置为通过PCB堆叠的至少两个不同层传输信号的信号通道，该参考结构是用于信号的返回路径的至少一部分; 以及设置在围绕信号通孔的区域中的未电镀通孔。 未经电镀的通孔设置在信号通孔周围的区域中，以改善信号通路的特性阻抗。

公开(公告)号：US20130108118A1

公开(公告)日：2013-05-02

申请号：US13285199

申请日：2011-10-31

Applicant: Scott T. Hinaga ,  Soumya De ,  David Senk

Inventor： Scott T. Hinaga ,  Soumya De ,  David Senk

IPC: G06K9/00

CPC classification number: G06T7/0006 ,  G01B11/303 ,  G06T7/41 ,  G06T2207/10061 ,  G06T2207/30141

Abstract: In one embodiment, a method includes capturing an image of a piece of a printed circuit board (PCB) that includes at least one inner layer having a metal foil portion. The piece of the PCB includes a cross-section of the inner layer having the metal foil portion. The method also includes determining a surface roughness of the metal foil portion, wherein determining the surface roughness of the metal foil portion includes processing the image.

Abstract translation: 在一个实施例中，一种方法包括捕获包括至少一个具有金属箔部分的内层的印刷电路板（PCB）片的图像。 PCB的一部分包括具有金属箔部分的内层的横截面。 该方法还包括确定金属箔部分的表面粗糙度，其中确定金属箔部分的表面粗糙度包括处理图像。

公开(公告)号：US20130098671A1

公开(公告)日：2013-04-25

申请号：US13280008

申请日：2011-10-24

Applicant: ARITHARAN THURAIRAJARATNAM ,  DAVID SENK

Inventor： ARITHARAN THURAIRAJARATNAM ,  DAVID SENK

IPC: H05K1/11

CPC classification number: H05K1/024 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09063 ,  H05K2203/0242

Abstract: A printed circuit board (PCB) stack-up has a signal via configured to transmit a signal through at least two different layers of the PCB stack-up, a reference structure that is at least a portion of a return path for the signal; and an unplated via disposed in an area surrounding the signal via. The unplated via is disposed in the area surrounding the signal via to improve the characteristic impedance of the signal via.

Abstract translation: 印刷电路板（PCB）叠层具有被配置为通过PCB堆叠的至少两个不同层传输信号的信号通道，该参考结构是用于信号的返回路径的至少一部分; 以及设置在围绕信号通孔的区域中的未电镀通孔。 未经电镀的通孔设置在信号通孔周围的区域中，以改善信号通路的特性阻抗。