Ball coax interconnect
    1.
    发明申请
    Ball coax interconnect 审中-公开
    球同轴互连

    公开(公告)号:US20060226928A1

    公开(公告)日:2006-10-12

    申请号:US11101882

    申请日:2005-04-08

    Abstract: A pseudo-coaxial vertical transition (10) includes a substrate (16). A bump array is disposed in a substantially concentric bump pattern upon the substrate (16) for simulating a pseudo-coaxial vertical electromagnetic wave propagation. The bump array is formed from a centrally disposed bump (32) having a predetermined bump diameter, and a plurality of at least five ground bumps (36) substantially equi-distant and circularly disposed about the centrally disposed bump (32). The predetermined bump diameter and a bump spacing of the centrally disposed bump are determined in relation to the plurality of ground bumps and a dielectric constant of air for providing a characteristic impedance.

    Abstract translation: 伪同轴垂直过渡(10)包括衬底(16)。 凸块阵列以基本同心的凸起图案设置在基板(16)上,用于模拟伪同轴垂直电磁波传播。 凸块阵列由具有预定凸块直径的中心设置的凸块(32)形成,并且多个至少五个接地凸块(36)围绕中心设置的凸块(32)基本上相等且圆形地设置。 相对于多个接地凸起和用于提供特性阻抗的空气的介电常数来确定中心设置的凸起的预定凸起直径和凸起间距。

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