公开(公告)号：US07746657B2

公开(公告)日：2010-06-29

申请号：US12075375

申请日：2008-03-11

Applicant: Dorin Oprea ,  Steven Driediger

Inventor： Dorin Oprea ,  Steven Driediger

IPC: H05K7/00

CPC classification number: H05K1/0218 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/10121

Abstract: The present invention is a specially designed PCB that allows XFP compliant transceiver modules and EMI gaskets to be used in a manner specified in the XFP standard and results in an integrated solution that is compliant with the XFP standard. Various geometric features are incorporated into the PCB to achieve improvements that in combination result in an integrated solution meeting the XFP standard. Some of these improved features include: specific thickness of prepreg and other layering of the PCB, specific spacing, dimensions and weights for certain components of the PCB, an opening on the first layer XFP cage ground shield connecting to the EMI gasket, guard ground traces in the second layer surrounding the differential pair signal traces, openings in the copper of the third layer beneath the XFP cage ground shield and XFP connector pads, and ground vias at the XFP connector and PHY connector pads.

Abstract translation: 本发明是专门设计的PCB，其允许以XFP标准中规定的方式使用符合XFP标准的收发器模块和EMI垫片，并产生符合XFP标准的集成解决方案。 各种几何特征被并入到PCB中以实现改进，其结合形成满足XFP标准的集成解决方案。 其中一些改进的特征包括：预浸料坯的特定厚度和PCB的其他分层，PCB的某些部件的特定间距，尺寸和重量，第一层上的开口XFP笼式接地屏蔽层连接到EMI垫片，保护接地迹线 在围绕差分对信号迹线的第二层中，XFP笼式接地屏蔽和XFP连接器焊盘下方第三层铜的开口，以及XFP连接器和PHY连接器焊盘处的接地通孔。

公开(公告)号：US20090229859A1

公开(公告)日：2009-09-17

申请号：US12075375

申请日：2008-03-11

Applicant: Dorin Oprea ,  Steven Driediger

Inventor： Dorin Oprea ,  Steven Driediger

IPC: H05K1/00

CPC classification number: H05K1/0218 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/10121

Abstract: The present invention is a specially designed PCB that allows XFP compliant transceiver modules and EMI gaskets to be used in a manner specified in the XFP standard and results in an integrated solution that is compliant with the XFP standard. Various geometric features are incorporated into the PCB to achieve improvements that in combination result in an integrated solution meeting the XFP standard. Some of these improved features include: specific thickness of prepreg and other layering of the PCB, specific spacing, dimensions and weights for certain components of the PCB, an opening on the first layer XFP cage ground shield connecting to the EMI gasket, guard ground traces in the second layer surrounding the differential pair signal traces, openings in the copper of the third layer beneath the XFP cage ground shield and XFP connector pads, and ground vias at the XFP connector and PHY connector pads.

Abstract translation: 本发明是专门设计的PCB，其允许以XFP标准中规定的方式使用符合XFP标准的收发器模块和EMI垫片，并产生符合XFP标准的集成解决方案。 各种几何特征被并入到PCB中以实现改进，其结合形成满足XFP标准的集成解决方案。 其中一些改进的特征包括：预浸料坯的特定厚度和PCB的其他分层，PCB的某些部件的特定间距，尺寸和重量，第一层上的开口XFP笼式接地屏蔽层连接到EMI垫片，保护接地迹线 在围绕差分对信号迹线的第二层中，XFP笼式接地屏蔽和XFP连接器焊盘下方第三层铜的开口，以及XFP连接器和PHY连接器焊盘处的接地通孔。

公开(公告)号：US20130166357A1

公开(公告)日：2013-06-27

申请号：US13332761

申请日：2011-12-21

Applicant: Holger Eggs ,  Matthias Allgaier ,  Wolfgang Faisst ,  Thorsten Liebermann ,  Alexandru Dorin Oprea ,  Thorsten Sandfuchs ,  Stefan Wenzel

Inventor： Holger Eggs ,  Matthias Allgaier ,  Wolfgang Faisst ,  Thorsten Liebermann ,  Alexandru Dorin Oprea ,  Thorsten Sandfuchs ,  Stefan Wenzel

IPC: G06Q10/06

CPC classification number: G06Q10/06 ,  G06Q30/01

Abstract: A system may include determination of a business configuration of one or more tenants of a business application platform, determination of metadata of business applications associated with the business application platform, reception of a request from a user of the business application platform for one or more recommended business applications, and application of one or more filters to a set of business applications based on the business configuration and the metadata to determine a recommended business application from the set of business applications.

Abstract translation: 系统可以包括确定业务应用平台的一个或多个租户的业务配置，确定与业务应用平台相关联的业务应用的元数据，从业务应用平台的用户接收对一个或多个推荐的 业务应用程序，以及基于业务配置和元数据将一个或多个过滤器应用于一组业务应用程序，以从该组业务应用程序确定推荐的业务应用程序。