公开(公告)号：US20130118779A1

公开(公告)日：2013-05-16

申请号：US13416029

申请日：2012-03-09

Applicant: Duke Kyu LEE ,  Chang Min IM ,  Sang Bum SIM ,  Yun Kee CHO ,  Hyun-Soo JEON

Inventor： Duke Kyu LEE ,  Chang Min IM ,  Sang Bum SIM ,  Yun Kee CHO ,  Hyun-Soo JEON

IPC: H05K1/02 ,  H05K3/22

CPC classification number: H05K1/11 ,  H05K3/22 ,  H05K2201/09881 ,  H05K2203/025

Abstract: A clearance filling PCB includes pin contact units on a surface of the external layer of the PCB and clearance filling units formed by molding a clearance between the pin contact units and polishing an insulating layer so that the height of the insulating layer becomes equal to the height of the pin contact units in order to prevent the sliding of a fine pitch circuit with a pin and induce accurate contact between the fine pitch circuit and the pin, and a method of manufacturing the same. The height of the insulating layer is made equal to the height of the pin contact units by molding the clearance between the pin contact units on the surface of the external layer of the PCB, and the sliding of a fine pitch circuit, requiring contacts, with a pin can be prevented.

Abstract translation: 间隙填充PCB包括在PCB的外层的表面上的销接触单元和通过在引脚接触单元之间模制间隙并抛光绝缘层而形成的间隙填充单元，使得绝缘层的高度等于高度 的引脚接触单元及其制造方法，以防止精细间距电路与引脚的滑动并引起精细间距电路和引脚之间的精确接触。 绝缘层的高度通过模制PCB的外部层的表面上的引脚接触单元之间的间隙和需要触点的细间距电路的滑动而使引脚接触单元的高度等于 可以防止引脚。