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公开(公告)号：US12185456B2
公开(公告)日：2024-12-31
申请号：US17564225
申请日：2021-12-29
Applicant: First Hi-tec Enterprise Co., Ltd. , NEXCOM International Co., Ltd. , Industrial Technology Research Institute
Inventor： Min-Lin Lee , Sheng-Che Hung , Ching-Shan Chang , Ying-Tsuen Liou
IPC: H05K1/02 , H01R12/73 , H01R13/6461 , H05K3/42 , H01R12/77 , H01R12/78 , H01R12/81 , H01R13/26 , H01R13/6471 , H01R13/648 , H01R13/658 , H01R13/6581 , H01R13/6585 , H05K3/46
Abstract: A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.
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公开(公告)号：US20190148300A1
公开(公告)日：2019-05-16
申请号：US16052641
申请日：2018-08-02
Applicant: Industrial Technology Research Institute , First Hi-tec Enterprise Co.,Ltd. , NEXCOM International Co., Ltd.
Inventor： Sheng-Che Hung , Min-Lin Lee , Ching-Shan Chang , Hung-I Liu
IPC: H01L23/538 , H01L23/00 , H01L23/522
Abstract: A circuit substrate includes a dielectric layer, a first conductive structure and a second conductive structure. The first conductive structure includes a first conductive circuit and a first conductive via. The first conductive circuit is disposed on the dielectric layer. The first conductive via is disposed in the dielectric layer, and the first conductive circuit is connected to the first conductive via. The second conductive structure includes a second conductive circuit and a second conductive via. The second conductive circuit is disposed in the dielectric layer, the second conductive circuit and the first conductive circuit of the first conductive structure are arranged with an interval, and the second conductive via surrounds the first conductive via with an interval. The second conductive structure has an extending portion. The extending portion protrudes toward the first conductive via and does not contact the first conductive via.
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公开(公告)号：US11877385B1
公开(公告)日：2024-01-16
申请号：US17864396
申请日：2022-07-14
Applicant: FIRST HI-TEC ENTERPRISE Co., Ltd.
Inventor： Ching-Shan Chang , Kun-Tao Tang , Tsung-Ting Tsai , Chien-Lin Chen
CPC classification number: H05K1/0228 , H05K1/025 , H05K1/111 , H05K2201/09236 , H05K2201/09545 , H05K2201/09718
Abstract: A circuit board comprises a substrate with opposite first and second sides. A pair of plated through holes (PTHs) extends along z-axis. A pair of signal traces are made on the first side of the substrate and electrically coupled to the pair of the PTHs respectively to form a differential pair. A ground metal is made on the second side of the substrate, the ground metal has a clearance made therein. The ground metal extends fully overlapping with the full signal traces to eliminate reflection noise caused by a boundary between the clearance and the metal ground.
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Patent Agency Ranking
公开(公告)号：US20230189435A1
公开(公告)日：2023-06-15
申请号：US17564225
申请日：2021-12-29
Applicant: First Hi-tec Enterprise Co.,Ltd. , NEXCOM International Co., Ltd. , Industrial Technology Research Institute
Inventor： Min-Lin Lee , Sheng-Che Hung , Ching-Shan Chang , Ying-Tsuen Liou
IPC: H05K1/02 , H01R13/6461 , H01R12/73 , H01R13/26
CPC classification number: H05K1/0278 , H01R13/6461 , H01R12/73 , H01R13/26
Abstract: A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.
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公开(公告)号：US20240023227A1
公开(公告)日：2024-01-18
申请号：US17864396
申请日：2022-07-14
Applicant: FIRST HI-TEC ENTERPRISE Co., Ltd.
Inventor： Ching-Shan CHANG , Kun-Tao TANG , Tsung-Ting TSAI , Chien-Lin CHEN
CPC classification number: H05K1/0228 , H05K1/111 , H05K2201/09236 , H05K2201/09545 , H05K2201/09718
Abstract: A circuit board comprises a substrate with opposite first and second sides. A pair of plated through holes (PTHs) extends along z-axis. A pair of signal traces are made on the first side of the substrate and electrically coupled to the pair of the PTHs respectively to form a differential pair. A ground metal is made on the second side of the substrate, the ground metal has a clearance made therein. The ground metal extends fully overlapping with the full signal traces to eliminate reflection noise caused by a boundary between the clearance and the metal ground.
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公开(公告)号：US10559534B2
公开(公告)日：2020-02-11
申请号：US16052641
申请日：2018-08-02
Applicant: Industrial Technology Research Institute , First Hi-tec Enterprise Co., Ltd. , NEXCOM International Co., Ltd.
Inventor： Sheng-Che Hung , Min-Lin Lee , Ching-Shan Chang , Hung-I Liu
IPC: H05K1/18 , H01L23/538 , H01L23/522 , H01L23/00 , H05K1/02 , H01L23/498 , H05K1/11
Abstract: A circuit substrate includes a dielectric layer, a first conductive structure and a second conductive structure. The first conductive structure includes a first conductive circuit and a first conductive via. The first conductive circuit is disposed on the dielectric layer. The first conductive via is disposed in the dielectric layer, and the first conductive circuit is connected to the first conductive via. The second conductive structure includes a second conductive circuit and a second conductive via. The second conductive circuit is disposed in the dielectric layer, the second conductive circuit and the first conductive circuit of the first conductive structure are arranged with an interval, and the second conductive via surrounds the first conductive via with an interval. The second conductive structure has an extending portion. The extending portion protrudes toward the first conductive via and does not contact the first conductive via.
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公开(公告)号：US20170273174A1
公开(公告)日：2017-09-21
申请号：US15245202
申请日：2016-08-24
Applicant: Industrial Technology Research Institute , First Hi-tec Enterprise Co.,Ltd. , NEXCOM International Co., Ltd.
Inventor： Chien-Min Hsu , Min-Lin Lee , Huey-Ru Chang , Hung-I Liu , Ching-shan Chang
CPC classification number: H05K1/0245 , H01P3/08 , H05K1/0251 , H05K1/111 , H05K1/115 , H05K2201/09509 , H05K2201/09545 , H05K2201/09618 , H05K2201/09627
Abstract: A multi-layer circuit structure includes a differential transmission line pair and at least one conductive pattern. The differential transmission line pair includes first and second transmission lines disposed side by side. Each of the first and second transmission lines includes first and second segments connected to each other. An spacing between the two first segments is non-fixed, and an spacing between the two second segments is fixed. A first zone is located between the two first segments, a second zone is opposite to the first zone and located outside the first segment of the first transmission line, and a third zone is opposite to the first zone and located outside the first segment of the second transmission line. The conductive pattern is coplanar with the differential transmission line pair and disposed on at least one of the first, second and third zones. The conductive pattern is electrically connected to a reference potential and electrically insulated from the differential transmission line pair.
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公开(公告)号：US10129974B2
公开(公告)日：2018-11-13
申请号：US15245202
申请日：2016-08-24
Applicant: Industrial Technology Research Institute , First Hi-tec Enterprise Co., Ltd. , NEXCOM International Co., Ltd.
Inventor： Chien-Min Hsu , Min-Lin Lee , Huey-Ru Chang , Hung-I Liu , Ching-shan Chang
Abstract: A multi-layer circuit structure includes a differential transmission line pair and at least one conductive pattern. The differential transmission line pair includes first and second transmission lines disposed side by side. Each of the first and second transmission lines includes first and second segments connected to each other. An spacing between the two first segments is non-fixed, and an spacing between the two second segments is fixed. A first zone is located between the two first segments, a second zone is opposite to the first zone and located outside the first segment of the first transmission line, and a third zone is opposite to the first zone and located outside the first segment of the second transmission line. The conductive pattern is coplanar with the differential transmission line pair and disposed on at least one of the first, second and third zones. The conductive pattern is electrically connected to a reference potential and electrically insulated from the differential transmission line pair.
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