公开(公告)号：US06741778B1

公开(公告)日：2004-05-25

申请号：US09578216

申请日：2000-05-23

Applicant: Benson Chan ,  Richard R. Hall ,  How Tzu Lin ,  John H. Sherman

Inventor： Benson Chan ,  Richard R. Hall ,  How Tzu Lin ,  John H. Sherman

IPC: G02B626

CPC classification number: G02B6/4232 ,  G02B6/421 ,  G02B6/4231 ,  G02B6/4236 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4249 ,  G02B6/426

Abstract: Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

Abstract translation: 光学封装及其制造方法，其中有源光学器件可相对于衬底和耦合器定位。 该结构包括具有电接触焊盘和具有用于至少一个光纤的精确对准的通孔的对准焊盘的衬底。 光纤由具有相对于衬底和光纤中的通孔精确定位的对准引脚的壳体或耦合器支撑。 与第一裸片表面上的一个或多个有源光学元件和第二裸片表面上的电接触的裸片或有源光学器件与衬底和有源光学元件的电焊盘对准。 该方法包括将对准针磨成金属垫并一次研磨光纤的步骤，然后通过使用导电粘合剂液体的表面张力来对准有源光学器件和光纤。 然后粘合纤维。

公开(公告)号：US06234687B1

公开(公告)日：2001-05-22

申请号：US09384094

申请日：1999-08-27

Applicant: Richard R. Hall ,  How Tzu Lin

Inventor： Richard R. Hall ,  How Tzu Lin

IPC: G02B636

CPC classification number: G02B6/4231 ,  G02B6/421 ,  G02B6/423

Abstract: An assembly is described that consists of a gallium arsenide die chip and a fiber optic coupler bonded together about their respective mating surfaces. The chip includes laser light emitters. The fiber optic coupler has fiber optic light transmitters that require precise alignment with the laser light emitters of the chip about their mating surfaces. After alignment of the emitting/receiving and transmitting elements, the mating surfaces of the chip and coupler are bonded together.

Abstract translation: 描述了由砷化镓晶片芯片和耦合在其各自配合表面上的光纤耦合器组成的组件。 该芯片包括激光发射器。 光纤耦合器具有光纤光发射器，其需要与芯片的激光发射器精确对准其配合表面。 在发射/接收和发射元件对准之后，芯片和耦合器的配合表面结合在一起。

公开(公告)号：US07084496B2

公开(公告)日：2006-08-01

申请号：US10757206

申请日：2004-01-14

Applicant: Alan F. Benner ,  How Tzu Lin ,  Frank L. Pompeo ,  Subhash L. Shinde

Inventor： Alan F. Benner ,  How Tzu Lin ,  Frank L. Pompeo ,  Subhash L. Shinde

IPC: H01L23/04 ,  H01L23/10 ,  H01L23/12 ,  H01L23/34 ,  G02B6/42

CPC classification number: G02B6/4249 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4231 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: An optoelectronic assembly for an electronic system includes a transparent substrate having a first surface and an opposite second surface, the transparent substrate being thermally conductive and being metallized on the surface. A support electronic chip set is configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions and is bonded to the second surface of the transparent substrate. A first substrate having a first surface and an opposite second surface, is in communication with the transparent substrate via the metallized second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set; and an optical signaling medium defined with one end having an optical fiber array aligned with the optoelectronic transducer is substantially normal to the first surface of the transparent substrate, wherein an electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via the metallized second surface of the transparent substrate, and wherein the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.

Abstract translation: 一种用于电子系统的光电组件包括具有第一表面和相对的第二表面的透明衬底，该透明衬底是导热的并且在表面上被金属化。 支持电子芯片组被配置用于提供复用，解复用，编码，解码和光电转换器驱动和接收功能中的至少一个，并且被结合到透明基板的第二表面。 具有第一表面和相对的第二表面的第一基板经由金属化的第二表面和其间的支撑芯片与透明基板连通。 第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。 光电子传感器与支持电子芯片组进行信号通信; 并且限定有具有与光电换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面，其中来自支撑电子芯片组的电信号通过金属化的 所述透明基板的第二表面，并且其中所述支撑电子芯片组和所述光电转换器共享用于冷却的公共热路径。

公开(公告)号：US06814503B2

公开(公告)日：2004-11-09

申请号：US10215175

申请日：2002-08-07

Applicant: Richard R. Hall ,  How Tzu Lin ,  Candido C. Tiberia

Inventor： Richard R. Hall ,  How Tzu Lin ,  Candido C. Tiberia

IPC: G02B636

CPC classification number: G02B6/4225 ,  G02B6/4226

Abstract: A method and apparatus are disclosed for aligning an array of light transmitting elements to an array of photosensitive detectors. The array is adjusted along three axes. Any element (a coupled transmitting and detecting unit of the array) can be selected as the center of rotation. Small angular correction is made about the selected element by differentially moving the array in two axes, using adjustment tools. Alignment is accomplished by performing translational movement in the horizontal X and Y axes until a signal is detected. A rotational correction about the selected element is performed by moving one of a pair of adjustment devices until maximum light intensity is achieved for the end elements. Next, the array is scanned for the weakest performing element in the array. The alignment procedure is repeated until the performance of all of the elements in the array fall within a pre-established specification range.

公开(公告)号：US06580494B1

公开(公告)日：2003-06-17

申请号：US10198383

申请日：2002-07-16

Applicant: Richard Ronald Hall ,  Robert Lee Lewis ,  How Tzu Lin ,  Peter M. Nichols ,  Robert David Sebesta

Inventor： Richard Ronald Hall ,  Robert Lee Lewis ,  How Tzu Lin ,  Peter M. Nichols ,  Robert David Sebesta

IPC: G03B2752

CPC classification number: G03F9/7003 ,  G03F7/70258 ,  G03F9/00

Abstract: A photolithography imaging system and method that performs the tasks of mask alignment, panel recognition, establishing position offsets and adjusting mask rotation for accurate overlay imaging of the mask onto the panel, and correctly adjusting image magnification or reduction to properly size each stepped image to the panel distortion. This invention applies more directly to substrate panels whose dimensional stability is found difficult to control, repeatedly. More specifically, it applies to panels whose X axis distortion factor varies greatly from its Y axis distortion factor and the average adjustment of the image magnification or reduction does not satisfy tight registration requirements. What is new is that the calculation of the magnification or reduction adjustment is based on the mask image dimensions.

Abstract translation: 一种光刻成像系统和方法，其执行掩模对准，面板识别，建立位置偏移和调整掩模旋转的任务，以将掩模精确地叠加到面板上，并且正确地调整图像放大率或缩小以将每个步进图像适当地调整为 面板扭曲。 本发明更直接地应用于其尺寸稳定性难以控制的衬底面板。 更具体地说，它适用于其X轴失真因子从其Y轴失真因子变化很大的面板，并且图像放大或缩小的平均调整不满足严格的配准要求。 什么是新的是放大或缩小调整的计算是基于掩模图像尺寸。

公开(公告)号：US06454469B1

公开(公告)日：2002-09-24

申请号：US09343071

申请日：1999-06-29

Applicant: Richard R. Hall ,  How Tzu Lin

Inventor： Richard R. Hall ,  How Tzu Lin

IPC: G02B626

CPC classification number: G02B6/4249 ,  G02B6/421 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/424 ,  G02B6/4269 ,  G02B6/4286

Abstract: An optical coupling assembly is described that optically aligns an opto-electronic device, such as a Vertical Cavity Surface Emitting Laser (VCSEL) chip, with a fiber optic coupler upon a heatsink substrate. The assembly has a number of biasing elements that acts against the coupler to provide contact with mating surfaces. Adjustment devices, such as screws, acting against the coupler and biasing elements, are adjusted until the fiber optic transmitting elements of the coupler align with the opto-electronic device light emitting elements. Photodetectors disposed upon a distal end of the coupler receive the light from the opto-electronic device, and provide a mechanism to detect optimum alignment.

Abstract translation: 描述了一种光耦合组件，其将诸如垂直腔面发射激光（VCSEL）芯片的光电器件与光纤耦合器光学对准在散热衬底上。 该组件具有多个偏置元件，该元件作用于联接器以提供与配合表面的接触。 调整作用于耦合器和偏置元件的诸如螺钉的调节装置，直到耦合器的光纤传输元件与光电器件发光元件对准。 设置在耦合器的远端的光电检测器接收来自光电子器件的光，并提供检测最佳对准的机构。

公开(公告)号：US07544527B2

公开(公告)日：2009-06-09

申请号：US11279276

申请日：2006-04-11

Applicant: Alan F. Benner ,  How Tzu Lin ,  Frank L. Pompeo ,  Subhash L. Shinde

Inventor： Alan F. Benner ,  How Tzu Lin ,  Frank L. Pompeo ,  Subhash L. Shinde

IPC: H01L21/00 ,  G02B6/12 ,  G02B6/30 ,  G02B6/36 ,  G02B6/04

CPC classification number: G02B6/4249 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4231 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is bonded to the transparent substrate. A first substrate is in communication with the transparent substrate via the second surface and support chip set therebetween. A second substrate is in communication with the second surface of the first substrate and is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support chip set, and an optical signaling medium having one end with an optical fiber array aligned with the transducer is substantially normal to the first surface of the transparent substrate. The support chip set and the transducer share a common thermal path for cooling.

Abstract translation: 用于电子系统的光电组件包括具有第一表面和相对的第二表面的导热金属化透明基板。 支撑芯片组结合到透明基板上。 第一基板经由第二表面与透明基板连通，并且其间设置有支撑芯片。 第二基板与第一基板的第二表面连通并且被配置用于安装数据处理，数据切换和数据存储芯片中的至少一个。 光电子传感器与支持芯片组进行信号通信，并且具有与换能器对准的光纤阵列的一端的光信号介质基本上垂直于透明基板的第一表面。 支撑芯片组和传感器共享一个共同的冷却路径。

公开(公告)号：US07128472B2

公开(公告)日：2006-10-31

申请号：US10631933

申请日：2003-07-31

Applicant: Alan F. Benner ,  Evan G. Colgan ,  How Tzu Lin ,  John H. Magerlein ,  Frank L. Pompeo ,  Subhash L. Shinde ,  Daniel J. Stigliani, Jr.

Inventor： Alan F. Benner ,  Evan G. Colgan ,  How Tzu Lin ,  John H. Magerlein ,  Frank L. Pompeo ,  Subhash L. Shinde ,  Daniel J. Stigliani, Jr.

IPC: G02B6/42 ,  G02B6/36 ,  G02B6/43

CPC classification number: G02B6/4201 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

Abstract: An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.

Abstract translation: 用于计算机系统的光电组件包括电子芯片，基板，电信号介质，光电转换器和光耦合引导件。 电子芯片与基板通信，该基板与电信号介质的第一端连通。 电信令介质的第二端与光电换能器通信，并且包括用于使光信号介质与光电换能器对准的光耦合引导件。 来自电子芯片的电信号通过衬底和电信令介质传送到光电换能器。 光学传感器和电子芯片共享共同的散热器，并且完成与其他电子芯片组的通信，而不需要通过第二级电气封装进行通信。

公开(公告)号：US06580491B2

公开(公告)日：2003-06-17

申请号：US09749044

申请日：2000-12-26

Applicant: Richard Ronald Hall ,  Robert Lee Lewis ,  How Tzu Lin ,  Peter Michael Nichols ,  Robert David Sebesta

Inventor： Richard Ronald Hall ,  Robert Lee Lewis ,  How Tzu Lin ,  Peter Michael Nichols ,  Robert David Sebesta

IPC: G03B2768

CPC classification number: G03F7/70466 ,  G03F7/70258 ,  G03F9/00 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0082 ,  H05K2201/09918

Abstract: Apparatus and method for compensating for distortion of the substrate of a printed circuit workpiece that involves performing two tasks. First, a mask that carries functional circuit features and alignment features is positioned rotatably so that the mask alignment features, when projected onto a table that holds the printed circuit workpiece, will be on a line extending parallel to one of two orthogonal axes of the table. Second, the spacing of alignment features on the printed circuit workpiece is determined and this determination is a measure of the distortion of the printed circuit workpiece substrate. A lens through which the mask image is projected is moved to adjust the magnification of the image in accordance with the measured distortion of the substrate of the printed circuit workpiece.

公开(公告)号：US06471419B1

公开(公告)日：2002-10-29

申请号：US09327783

申请日：1999-06-07

Applicant: Richard R. Hall ,  How Tzu Lin ,  Candido C. Tiberia

Inventor： Richard R. Hall ,  How Tzu Lin ,  Candido C. Tiberia

IPC: G02B636

CPC classification number: G02B6/4225 ,  G02B6/4226

Abstract: A method and apparatus are disclosed for aligning an array of light transmitting elements to an array of photosensitive detectors. The array is adjusted along three axes. Any element (a coupled transmitting and detecting unit of the array) can be selected as the center of rotation. Small angular correction is made about the selected element by differentially moving the array in two axes, using adjustment tools. Alignment is accomplished by performing translational movement in the horizontal X and Y axes until a signal is detected. A rotational correction about the selected element is performed by moving one of a pair of adjustment devices until maximum light intensity is achieved for the end elements. Next, the array is scanned for the weakest performing element in the array. The alignment procedure is repeated until the performance of all of the elements in the array fall within a pre-established specification range.