公开(公告)号：US09029773B2

公开(公告)日：2015-05-12

申请号：US13775217

申请日：2013-02-24

Applicant: Vlad Joseph Novotny ,  Howard Woo

Inventor： Vlad Joseph Novotny ,  Howard Woo

IPC: G01J5/02 ,  G01J5/20 ,  H01L31/09 ,  H01L31/18

CPC classification number: G01J5/20 ,  G01J5/0225 ,  G01J5/048 ,  G01J2005/204 ,  H01L31/0203 ,  H01L31/09 ,  H01L31/18

Abstract: The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.

Abstract translation: 描述了具有单独密封件的悬浮微型元件阵列的架构，设计和制造。 读出集成电路与悬挂元件整体集成，用于低寄生效应和高信噪比检测其电阻变化。 单独密封的悬浮微元件阵列与包含非易失性存储器的信号处理芯片组合，具有所有元件的灵敏度校准和非功能元件之间的插值。 当微元件是红外光吸收器时，图像分析和识别被嵌入处理芯片中，以形成用于红外相机的红外成像解决方案。

公开(公告)号：US20120171623A1

公开(公告)日：2012-07-05

申请号：US13418186

申请日：2012-03-12

Applicant: Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Allen Payne ,  Ye Wang ,  Howard Woo

Inventor： Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Allen Payne ,  Ye Wang ,  Howard Woo

IPC: B05D5/06 ,  G03F7/20 ,  B05D5/12

CPC classification number: G02B26/0841

Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.

Abstract translation: 一种形成光偏转装置的方法包括提供半导体衬底的一个或多个部分内包括上表面区域和多个驱动装置的半导体衬底。 上表面区域包括一个或多个图案化结构区域和至少一个开放区域，以暴露上表面区域的一部分以形成所得表面区域。 该方法还包括形成覆盖所得表面区域的平坦化材料以填充至少一个开放区域，并且使用填充材料形成上部平坦化层。 该方法还包括在小于300℃的温度下形成硅材料的厚度以保持平坦化材料的状态。

公开(公告)号：US08159740B2

公开(公告)日：2012-04-17

申请号：US12690878

申请日：2010-01-20

Applicant: Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Allen Payne ,  Ye Wang ,  Howard Woo

Inventor： Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Allen Payne ,  Ye Wang ,  Howard Woo

IPC: G02B26/08 ,  G02B26/00 ,  G02F1/29

CPC classification number: G02B26/0841

Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.

Abstract translation: 一种形成光偏转装置的方法包括提供半导体衬底的一个或多个部分内包括上表面区域和多个驱动装置的半导体衬底。 上表面区域包括一个或多个图案化结构区域和至少一个开放区域，以暴露上表面区域的一部分以形成所得表面区域。 该方法还包括形成覆盖所得表面区域的平坦化材料以填充至少一个开放区域，并且使用填充材料形成上部平坦化层。 该方法还包括在小于300℃的温度下形成硅材料的厚度以保持平坦化材料的状态。

公开(公告)号：US07453624B2

公开(公告)日：2008-11-18

申请号：US11448537

申请日：2006-06-05

Applicant: Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Allen Payne ,  Ye Wang ,  William Spencer Worley, III ,  Dongmin Chen ,  Howard Woo

Inventor： Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Allen Payne ,  Ye Wang ,  William Spencer Worley, III ,  Dongmin Chen ,  Howard Woo

IPC: G02B26/00

CPC classification number: G02B26/0841

Abstract: A display system includes a light source and a first optical system coupled to the light source and adapted to provide an illumination beam along an illumination path. The display system also includes a spatial light modulator positioned in the illumination path. The spatial light modulator includes a semiconductor substrate including a plurality of electrode devices and a hinge structure coupled to the semiconductor substrate. The hinge structure includes silicon material. The spatial light modulator also includes a mirror post coupled to the hinge structure and extending to a predetermined distance from the semiconductor substrate and a mirror plate coupled to the mirror post and overlying the plurality of electrode devices. The display system further includes a second optical system coupled to the spatial light modulator and adapted to project an image onto a projection surface.

Abstract translation: 显示系统包括光源和耦合到光源并适于沿照明路径提供照明光束的第一光学系统。 显示系统还包括位于照明路径中的空间光调制器。 空间光调制器包括包括多个电极器件和耦合到半导体衬底的铰链结构的半导体衬底。 铰链结构包括硅材料。 空间光调制器还包括耦合到铰链结构并且延伸到半导体衬底预定距离的镜柱和耦合到镜柱并且覆盖多个电极器件的镜板。 显示系统还包括耦合到空间光调制器并适于将图像投影到投影表面上的第二光学系统。

公开(公告)号：US20070097487A1

公开(公告)日：2007-05-03

申请号：US11448149

申请日：2006-06-05

Applicant: Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Payne ,  Ye Wang ,  William Worley ,  Dongmin Chen ,  Howard Woo

Inventor： Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Payne ,  Ye Wang ,  William Worley ,  Dongmin Chen ,  Howard Woo

IPC: G02B26/00

CPC classification number: G02B26/0841 ,  G02B26/008

Abstract: An optical deflection device for a display application. The optical deflection device includes a semiconductor substrate including an upper surface region and one or more electrode devices provided overlying the upper surface region. The optical deflection device also includes a hinge device including a silicon material and coupled to the upper surface region. The optical deflection device further includes a spacing defined between the upper surface region and the hinge device and a mirror structure including a post portion coupled to the hinge device and a mirror plate portion coupled to the post portion and overlying the hinge device.

Abstract translation: 一种用于显示器应用的光学偏转装置。 光偏转装置包括：半导体衬底，包括上表面区域和设置在上表面区域上的一个或多个电极器件。 光学偏转装置还包括铰链装置，其包括硅材料并且连接到上表面区域。 光学偏转装置还包括限定在上表面区域和铰链装置之间的间隔，以及反射镜结构，其包括联接到铰链装置的柱部分和耦合到柱部分并且覆盖铰链装置的镜板部分。

公开(公告)号：US09410850B2

公开(公告)日：2016-08-09

申请号：US14032205

申请日：2013-09-20

Applicant: Vlad Joseph Novotny ,  Howard Woo

Inventor： Vlad Joseph Novotny ,  Howard Woo

IPC: G01J5/24 ,  H04N5/33 ,  H04N5/3745 ,  H04N5/378 ,  H04N5/353 ,  H04N5/355 ,  H04N5/357

CPC classification number: G01J5/24 ,  H04N5/33 ,  H04N5/3535 ,  H04N5/35554 ,  H04N5/3575 ,  H04N5/37455 ,  H04N5/378

Abstract: Readout integrated circuits placed underneath the suspended sensing elements detect changes of electrical resistance of sensing elements and digitize the signals with digital to analog convertor for each element. Readout electronics provides low parasitics, high signal to noise ratio, high data rate, high dynamic range and instantaneous global readout.

Abstract translation: 放置在悬挂感应元件下方的读出集成电路检测感测元件的电阻变化，并对每个元件的数模转换器数字化信号。 读出电子提供低寄生效应，高信噪比，高数据速率，高动态范围和瞬时全局读出。

公开(公告)号：US20150085134A1

公开(公告)日：2015-03-26

申请号：US14032205

申请日：2013-09-20

Applicant: Vlad Novotny ,  Howard Woo

Inventor： Vlad Novotny ,  Howard Woo

IPC: H04N5/33 ,  H04N5/378 ,  H04N5/357 ,  H04N5/3745 ,  H04N5/353

CPC classification number: G01J5/24 ,  H04N5/33 ,  H04N5/3535 ,  H04N5/35554 ,  H04N5/3575 ,  H04N5/37455 ,  H04N5/378

Abstract: Readout integrated circuits placed below the suspended sensor elements detect changes of electrical resistance of sensor elements and digitize the signals with digital to analog convertor for each element. Readout electronics provides low parasitics, high signal to noise ratio, high data rate, high dynamic range and instantaneous global readout.

Abstract translation: 放置在悬挂传感器元件下面的读出集成电路检测传感器元件的电阻变化，并对每个元件的数模转换器进行数字化。 读出电子提供低寄生效应，高信噪比，高数据速率，高动态范围和瞬时全局读出。

公开(公告)号：US08908255B2

公开(公告)日：2014-12-09

申请号：US13418186

申请日：2012-03-12

Applicant: Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Allen Payne ,  Ye Wang ,  Howard Woo

Inventor： Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Allen Payne ,  Ye Wang ,  Howard Woo

IPC: G02B26/08 ,  G02B26/00 ,  G02F1/29

CPC classification number: G02B26/0841

Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.

Abstract translation: 一种形成光偏转装置的方法包括提供半导体衬底的一个或多个部分内包括上表面区域和多个驱动装置的半导体衬底。 上表面区域包括一个或多个图案化结构区域和至少一个开放区域，以暴露上表面区域的一部分以形成所得表面区域。 该方法还包括形成覆盖所得表面区域的平坦化材料以填充至少一个开放区域，并且使用填充材料形成上部平坦化层。 该方法还包括在小于300℃的温度下形成硅材料的厚度以保持平坦化材料的状态。

公开(公告)号：US20140239179A1

公开(公告)日：2014-08-28

申请号：US13775217

申请日：2013-02-24

Applicant: Vlad Joseph Novotny ,  Howard Woo

Inventor： Vlad Joseph Novotny ,  Howard Woo

IPC: G01J5/20 ,  H01L31/09 ,  H01L31/18

CPC classification number: G01J5/20 ,  G01J5/0225 ,  G01J5/048 ,  G01J2005/204 ,  H01L31/0203 ,  H01L31/09 ,  H01L31/18

Abstract: The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.

Abstract translation: 描述了具有单独密封件的悬浮微型元件阵列的架构，设计和制造。 读出集成电路与悬挂元件整体集成，用于低寄生效应和高信噪比检测其电阻变化。 单独密封的悬浮微元件阵列与包含非易失性存储器的信号处理芯片组合，具有所有元件的灵敏度校准和非功能元件之间的插值。 当微元件是红外光吸收器时，图像分析和识别被嵌入处理芯片中，以形成用于红外相机的红外成像解决方案。

公开(公告)号：US20100112492A1

公开(公告)日：2010-05-06

申请号：US12690878

申请日：2010-01-20

Applicant: Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Allen Payne ,  Ye Wang ,  Howard Woo

Inventor： Xiao Yang ,  Yuxiang Wang ,  Wook Ji ,  Justin Allen Payne ,  Ye Wang ,  Howard Woo

IPC: G03F7/20 ,  B05D5/06 ,  C23F1/00

CPC classification number: G02B26/0841

Abstract: A method for forming an optical deflection device includes providing a semiconductor substrate comprising an upper surface region and a plurality of drive devices within one or more portions of the semiconductor substrate. The upper surface region includes one or more patterned structure regions and at least one open region to expose a portion of the upper surface region to form a resulting surface region. The method also includes forming a planarizing material overlying the resulting surface region to fill the at least one open region and cause formation of an upper planarized layer using the fill material. The method further includes forming a thickness of silicon material at a temperature of less than 300° C. to maintain a state of the planarizing material.

Abstract translation: 一种形成光偏转装置的方法包括提供半导体衬底的一个或多个部分内包括上表面区域和多个驱动装置的半导体衬底。 上表面区域包括一个或多个图案化结构区域和至少一个开放区域，以暴露上表面区域的一部分以形成所得表面区域。 该方法还包括形成覆盖所得表面区域的平坦化材料以填充至少一个开放区域，并且使用填充材料形成上部平坦化层。 该方法还包括在小于300℃的温度下形成硅材料的厚度以保持平坦化材料的状态。