公开(公告)号：US11906363B2

公开(公告)日：2024-02-20

申请号：US17347470

申请日：2021-06-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kouhei Takahashi ,  Naoki Tambo ,  Kunihiko Nakamura ,  Masaki Fujikane ,  Yasuyuki Naito

IPC: G01J5/22 ,  H01L31/09 ,  H01L31/20 ,  G01J5/20

CPC classification number: G01J5/22 ,  H01L31/095 ,  H01L31/20 ,  G01J2005/204

Abstract: An infrared sensor includes: a base substrate; a bolometer infrared receiver; a first beam; and a second beam. Each of the first and second beams has a connection portion connected to the base substrate and/or a member on the base substrate and a separated portion away from the base substrate, and is physically joined to the infrared receiver at the separated portion. The infrared receiver is supported by the first and second beams to be away from the base substrate. The infrared receiver includes a resistance change portion including a resistance change material the electrical resistance of which changes with temperature. The resistance change portion includes an amorphous semiconductor, and the first and second beams include a crystalline semiconductor made of the same base material as the resistance change material, and is electrically connected to the resistance change portion at the separated portion.

公开(公告)号：US09791321B2

公开(公告)日：2017-10-17

申请号：US13902529

申请日：2013-05-24

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Ken B. Cooper ,  Emmanuel Decrossas ,  John J. Gill ,  Cecile Jung-Kubiak ,  Choonsup Lee ,  Robert Lin ,  Imran Mehdi ,  Alejandro Peralta ,  Theodore Reck ,  Jose Siles

IPC: G01J5/20 ,  G01S7/02 ,  G01S13/88 ,  G01S13/89 ,  G01J5/00 ,  G01S7/03

CPC classification number: G01J5/20 ,  G01J2005/0077 ,  G01J2005/204 ,  G01S7/02 ,  G01S7/036 ,  G01S13/887 ,  G01S13/89

Abstract: A multi-pixel terahertz transceiver is constructed using a stack of semiconductor layers that communicate using vias defined within the semiconductor layers. By using a stack of semiconductor layers, the various electrical functions of each layer can be tested easily without having to assemble the entire transceiver. In addition, the design allows the production of a transceiver having pixels set 10 mm apart.

公开(公告)号：US20160273968A1

公开(公告)日：2016-09-22

申请号：US14658242

申请日：2015-03-16

Applicant: Vlad Joseph Novotny

Inventor： Vlad Joseph Novotny

IPC: G01J5/20 ,  H01L31/09 ,  B81C1/00 ,  H01L31/18

CPC classification number: B81C1/00285 ,  B81B2201/0207 ,  B81B2203/0109 ,  B81B2207/015 ,  B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  G01J5/024 ,  G01J5/045 ,  G01J5/24 ,  G01J2005/204 ,  H01L27/14643

Abstract: The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.

Abstract translation: 描述了具有单独密封件的悬浮微型元件阵列的架构，设计和制造。 读出集成电路与悬挂元件整体集成，用于低寄生效应和高信噪比检测其电阻变化。 单独密封的悬浮微元件阵列与包含非易失性存储器的信号处理芯片组合，具有所有元件的灵敏度校准和非功能元件之间的插值。 当微元件是红外光吸收器时，图像分析和识别被嵌入处理芯片中，以形成用于红外相机的红外成像解决方案。

公开(公告)号：US20150362763A1

公开(公告)日：2015-12-17

申请号：US14731235

申请日：2015-06-04

Applicant: Virginia D. Wheeler ,  Francis J. Kub ,  Charles R. Eddy, JR. ,  Marko J. Tadjer

Inventor： Virginia D. Wheeler ,  Francis J. Kub ,  Charles R. Eddy, JR. ,  Marko J. Tadjer

IPC: G02F1/01 ,  C23C16/455 ,  G02B1/14 ,  G02B1/18 ,  G02B1/11

CPC classification number: G01J5/20 ,  C23C16/45525 ,  G01J5/024 ,  G01J5/0275 ,  G01J5/084 ,  G01J5/0853 ,  G01J5/089 ,  G01J2005/204 ,  G02B1/10 ,  G02B1/11 ,  G02B1/14 ,  G02B1/18 ,  G02B5/003 ,  G02F1/0147 ,  H01L37/00 ,  Y10T156/10

Abstract: A smart window comprising a transparent substrate, a transparent low emittance layer on the transparent substrate, a variable emittance material layer on the substrate or transparent low emittance layer, and a protection material layer on the variable emittance material layer.

Abstract translation: 一种智能窗，包括透明基板，透明基板上的透明低辐射层，基板上的可变散射材料层或透明低辐射率层，以及可变发射体材料层上的保护材料层。

公开(公告)号：US20140239179A1

公开(公告)日：2014-08-28

申请号：US13775217

申请日：2013-02-24

Applicant: Vlad Joseph Novotny ,  Howard Woo

Inventor： Vlad Joseph Novotny ,  Howard Woo

IPC: G01J5/20 ,  H01L31/09 ,  H01L31/18

CPC classification number: G01J5/20 ,  G01J5/0225 ,  G01J5/048 ,  G01J2005/204 ,  H01L31/0203 ,  H01L31/09 ,  H01L31/18

Abstract: The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.

Abstract translation: 描述了具有单独密封件的悬浮微型元件阵列的架构，设计和制造。 读出集成电路与悬挂元件整体集成，用于低寄生效应和高信噪比检测其电阻变化。 单独密封的悬浮微元件阵列与包含非易失性存储器的信号处理芯片组合，具有所有元件的灵敏度校准和非功能元件之间的插值。 当微元件是红外光吸收器时，图像分析和识别被嵌入处理芯片中，以形成用于红外相机的红外成像解决方案。

公开(公告)号：US20120026337A1

公开(公告)日：2012-02-02

申请号：US12844124

申请日：2010-07-27

Applicant: Pierre Boulanger ,  Marcel Tremblay ,  Jim Goodland ,  Barbara Sharp ,  Farhad Mirbod ,  Theodore R. Hoelter

Inventor： Pierre Boulanger ,  Marcel Tremblay ,  Jim Goodland ,  Barbara Sharp ,  Farhad Mirbod ,  Theodore R. Hoelter

IPC: H04N5/33 ,  B23P11/00

CPC classification number: G01J5/20 ,  G01J1/0204 ,  G01J1/44 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/023 ,  G01J5/046 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/204 ,  H01L22/14 ,  H01L22/32 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14669 ,  H01L27/14687 ,  H01L27/14698 ,  H01L37/02 ,  H04N5/2251 ,  H04N5/33 ,  Y10T29/49826

Abstract: An infrared camera architecture includes, for an embodiment, an infrared detector, a substrate, a plurality of electrical components coupled to the substrate, and a pedestal made of a thermally conductive material and having a leg coupled to the substrate. The infrared detector is supported by and thermally coupled to the pedestal, with the pedestal thermally isolating the infrared detector from the plurality of electrical components.

Abstract translation: 对于一个实施例，红外线照相机结构包括红外检测器，衬底，耦合到衬底的多个电气部件，以及由导热材料制成并具有连接到衬底的腿部的基座。 红外检测器由支架支撑并热耦合到基座，基座将红外检测器与多个电气部件热隔离。

公开(公告)号：US11761820B2

公开(公告)日：2023-09-19

申请号：US17325827

申请日：2021-05-20

Applicant: LYNRED

Inventor： Nicolas Boudou ,  Alexia Gorecki

IPC: H04N5/33 ,  G01J5/02 ,  H01L27/146 ,  G01J5/0803 ,  G01J5/20 ,  G01J5/0808

CPC classification number: G01J5/0225 ,  G01J5/0803 ,  G01J5/0808 ,  G01J5/20 ,  H01L27/14621 ,  H01L27/14629 ,  H01L27/14649 ,  H04N5/33 ,  G01J2005/202 ,  G01J2005/204

Abstract: An image sensor includes on a support a plurality of first pixels and a plurality of second pixels intended to detect an infrared radiation emitted by an element of a scene. Each of the pixels includes a bolometric membrane suspended above a reflector covering the support, wherein the reflector of each of the first pixels is covered with a first dielectric layer, and the reflector of each of the second pixels is covered with a second dielectric layer differing from the first dielectric layer by its optical properties.

公开(公告)号：US20170207265A1

公开(公告)日：2017-07-20

申请号：US15400278

申请日：2017-01-06

Applicant: Ulis ,  Commissariat A L'Energie Atomique Et Aux Energies Alternatives

Inventor： Michel VILAIN ,  Jérôme FAVIER ,  Jean-Jacques YON ,  Laurent FREY

IPC: H01L27/146 ,  G01J5/20

CPC classification number: H01L27/14618 ,  G01J5/024 ,  G01J5/045 ,  G01J5/20 ,  G01J2005/204 ,  H01L27/1462 ,  H01L27/14629 ,  H01L27/14649 ,  H01L27/14685 ,  H01L27/14687

Abstract: A method of manufacturing a detector capable of detecting a wavelength range [λ8; λ14] centered on a wavelength λ10, including: forming said device on a substrate by depositing a sacrificial layer totally embedding said device; forming, on the sacrificial layer, a cap including first, second, and third optical structures transparent in said range [Δ8; λ14], the second and third optical structures having equivalent refraction indexes at wavelength λ10 respectively greater than or equal to 3.4 and smaller than or equal to 2.3; forming a vent of access to the sacrificial layer through a portion of the cap, and then applying, through the vent, an etching to totally remove the sacrificial layer.

公开(公告)号：US09513172B2

公开(公告)日：2016-12-06

申请号：US13750709

申请日：2013-01-25

Applicant: FLIR Systems, Inc.

Inventor： Gregory A. Carlson ,  Alex Matson ,  Andrew Sharpe ,  Davey Beard ,  Paul Schweikert ,  Robert Simes

IPC: G01J5/10 ,  G01J5/04 ,  H04N5/225 ,  H04N5/33 ,  G01J5/02 ,  G01J5/20 ,  G01J1/02 ,  G01J1/44 ,  H01L27/146 ,  G01J5/00

CPC classification number: G01J5/20 ,  G01J1/0204 ,  G01J1/44 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/023 ,  G01J5/046 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/204 ,  H01L22/14 ,  H01L22/32 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14669 ,  H01L27/14687 ,  H01L27/14698 ,  H01L37/02 ,  H04N5/2251 ,  H04N5/33 ,  Y10T29/49826

Abstract: An infrared detector useful in, e.g., infrared cameras, includes a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, for one or more embodiments. A generally planar window is spaced above the array, the window being substantially transparent to infrared light. A mesa is bonded to the window. The mesa has closed marginal side walls disposed between an outer periphery of a lower surface of the window and an outer periphery of the upper surface of the substrate and defines a closed cavity between the window and the array that encloses the array. A solder seal bonds the mesa to the substrate so as to seal the cavity.

Abstract translation: 用于例如红外相机的红外检测器包括具有红外检测器阵列的基板和与设置在其上表面上的阵列互连的读出集成电路，用于一个或多个实施例。 大致平面的窗口在阵列上方间隔开，窗口基本上对于红外光是透明的。 台面粘合到窗户。 台面已经封闭了边缘侧壁，其设置在窗口的下表面的外周边和基板的上表面的外周之间，并且在窗口和包围阵列的阵列之间限定了封闭的空腔。 焊接密封件将台面连接到基板以便密封空腔。

公开(公告)号：US09029773B2

公开(公告)日：2015-05-12

申请号：US13775217

申请日：2013-02-24

Applicant: Vlad Joseph Novotny ,  Howard Woo

Inventor： Vlad Joseph Novotny ,  Howard Woo

IPC: G01J5/02 ,  G01J5/20 ,  H01L31/09 ,  H01L31/18

CPC classification number: G01J5/20 ,  G01J5/0225 ,  G01J5/048 ,  G01J2005/204 ,  H01L31/0203 ,  H01L31/09 ,  H01L31/18

Abstract: The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.

Abstract translation: 描述了具有单独密封件的悬浮微型元件阵列的架构，设计和制造。 读出集成电路与悬挂元件整体集成，用于低寄生效应和高信噪比检测其电阻变化。 单独密封的悬浮微元件阵列与包含非易失性存储器的信号处理芯片组合，具有所有元件的灵敏度校准和非功能元件之间的插值。 当微元件是红外光吸收器时，图像分析和识别被嵌入处理芯片中，以形成用于红外相机的红外成像解决方案。