公开(公告)号：US5785789A

公开(公告)日：1998-07-28

申请号：US344793

申请日：1994-11-23

Applicant: Gerald Gagnon ,  Richard Alwyn Barnett ,  James Anthony Apruzzi

Inventor： Gerald Gagnon ,  Richard Alwyn Barnett ,  James Anthony Apruzzi

IPC: B32B27/04 ,  B32B27/20 ,  H05K1/03 ,  H05K3/02 ,  B32B31/00

CPC classification number: B32B27/04 ,  B32B27/20 ,  B32B37/26 ,  H05K1/0373 ,  B32B2305/30 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0254 ,  H05K2203/0152 ,  H05K3/022

Abstract: Disclosed are multilayer electrical structures comprising a discrete, partially-cured, microsphere-filled resin layer, and a method for fabricating such multilayer electrical structures using a carrier member to support and introduce the microsphere-filled resin layer.

Abstract translation: 公开了包括分立的部分固化的微球填充树脂层的多层电结构，以及使用载体构件来制造这种多层电结构以支撑和引入微球填充树脂层的方法。