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公开(公告)号:US3932563A
公开(公告)日:1976-01-13
申请号:US509228
申请日:1974-09-25
Applicant: Frederico Argurio , Mario Borsatti , William James Busby
Inventor: Frederico Argurio , Mario Borsatti , William James Busby
IPC: B65D65/02 , C08K5/103 , C08L7/00 , C08L21/00 , C08L23/00 , C08L23/08 , C08L23/20 , C08L31/04 , C08L67/00 , C08L101/00 , C09J7/00
CPC classification number: C09J7/00 , C08K5/103 , C08L23/0853 , C08L23/20
Abstract: Compositions suitable for fabricating into a self-sealing film comprise (i) 90-99.95 wt.% of a copolymer of ethylene and a vinyl (or hydrocarbyl substituted vinyl) ester of a C.sub.1 -C.sub.30 monocarboxylic acid, (ii) either 0.05 to 10 wt.% of a hydrocarbon resin, or 0.05 to 5 wt.% of polybutylene or polyisobutylene, or a combination of 0.05 to 10 wt.% of the hydrocarbon resin and 0.05 to 5 wt.% of polybutylene or polyisobutylene, provided the combined weight of the hydrocarbon resin and polybutylene or polyisobutylene is not more than 10 wt.% and (iii) 0.01 to 3.0% by weight based on the combined weight of (i) and (ii) of a partial carboxylic acid ester of a polyol, e.g. sorbitan monolaurate.
Abstract translation: 适用于制造自密封膜的组合物包括(i)90-99.95重量%的乙烯和C1-C30单羧酸的乙烯基(或烃基取代的乙烯基)酯的共聚物,(ii)0.05至10 烃树脂的重量%,或0.05-5重量%的聚丁烯或聚异丁烯,或0.05至10重量%的烃树脂和0.05至5重量%的聚丁烯或聚异丁烯的组合,条件是组合重量 的烃树脂和聚丁烯或聚异丁烯的含量不超过10重量%,和(iii)基于多元醇的部分羧酸酯的组合重量(i)和(ii)的0.01至3.0重量%,例如 脱水山梨糖醇单月桂酸酯。
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公开(公告)号:US4022850A
公开(公告)日:1977-05-10
申请号:US586641
申请日:1975-06-13
Applicant: David Andrew Booth , William James Busby , Jean Paul Loree
Inventor: David Andrew Booth , William James Busby , Jean Paul Loree
CPC classification number: C08L23/0853 , C08L2205/02 , C08L23/22 , C08L2310/00
Abstract: A transparent self-sealing film suitable for packaging is made from a composition comprising (i) 90 to 99.95 wt. % of a copolymer of ethylene and a vinyl (or hydrocarbyl substituted vinyl) ester of a C.sub.1 -C.sub.30 monocarboxylic acid (vinyl acetate) containing at least 89 wt. % (e.g., 91 to 95 wt. %) of ethylene and (ii) either 0.05 to 10 wt. % of a hydrocarbon resin, or 0.05 to 5 wt. % of liquid polyisobutylene or liquid polybutylene (MW 30,000 to 50,000) or a combination of 0.05 to 10 wt. % of the hydrocarbon resin and 0.05 to 5 wt. % of polyisobutylene or polybutylene, provided the combined weight of hydrocarbon resin and polyisobutylene or polybutylene is not more than 10 wt. %.
Abstract translation: 适用于包装的透明自密封膜由包含(i)90至99.95wt。 %的乙烯与乙烯基(或烃基取代的乙烯基)酯的共聚物的含量至少为89重量%的C1-C30单羧酸(乙酸乙烯酯) %(例如,91至95重量%)的乙烯和(ii)0.05至10重量% %的烃树脂,或0.05〜5wt。 %的液体聚异丁烯或液体聚丁烯(MW 30,000至50,000)或0.05至10wt。 %的烃树脂和0.05〜5wt。 %的聚异丁烯或聚丁烯,只要烃树脂和聚异丁烯或聚丁烯的总重量不超过10wt。 %。
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公开(公告)号:US20070010111A1
公开(公告)日:2007-01-11
申请号:US11521158
申请日:2006-09-14
Applicant: William Brodsky , James Busby , Bruce Chamberlin , Mitchell Ferrill , Robin Susko , James Wilcox
Inventor: William Brodsky , James Busby , Bruce Chamberlin , Mitchell Ferrill , Robin Susko , James Wilcox
IPC: H01R12/00
CPC classification number: H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/0501 , H01L2224/05011 , H01L2224/05026 , H01L2224/05548 , H01L2224/056 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/30107 , H01R4/01 , H01R12/52 , H05K3/325 , H05K2201/068 , H05K2201/209 , H05K2203/1105 , H01L2224/05099
Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.
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公开(公告)号:US20060205273A1
公开(公告)日:2006-09-14
申请号:US10906810
申请日:2005-03-08
Applicant: William Brodsky , James Busby , Bruce Chamberlin , Mitchell Ferrill , Robin Susko , James Wilcox
Inventor: William Brodsky , James Busby , Bruce Chamberlin , Mitchell Ferrill , Robin Susko , James Wilcox
IPC: H01R13/40
CPC classification number: H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/0501 , H01L2224/05011 , H01L2224/05026 , H01L2224/05548 , H01L2224/056 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2924/00014 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/12044 , H01L2924/14 , H01L2924/30107 , H01R4/01 , H01R12/52 , H05K3/325 , H05K2201/068 , H05K2201/209 , H05K2203/1105 , H01L2224/05099
Abstract: A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.
Abstract translation: 公开了一种用于形成用于半导体封装的可移除互连的方法和结构,其中连接器适于在经受温度变化时从第一形状重复地变为第二形状,并且在不受影响时重复地返回到第一形状 到温度变化。 当连接器处于其第二形状时,连接器可以断开,并且当连接器处于其第一形状时连接器不能断开。
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