公开(公告)号：US07135758B2

公开(公告)日：2006-11-14

申请号：US10774955

申请日：2004-02-09

Applicant: Damion T. Searls ,  Weston C. Roth ,  James Daniel Jackson

Inventor： Damion T. Searls ,  Weston C. Roth ,  James Daniel Jackson

IPC: H01L23/58

CPC classification number: H01L24/81 ,  H01L23/642 ,  H01L24/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/145 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10S257/924 ,  Y10S438/957

Abstract: A system to package high performance microelectronic devices, such as processors, responds to component transients. In one embodiment, the system includes a decoupling capacitor that is disposed between a Vcc electrical bump and a Vss electrical bump. The decoupling capacitor has Vcc and Vss terminals. The Vcc and Vss terminals share electrical pads with the Vcc electrical bump and the Vss electrical bump. A simple current loop is created that improves the power delivery for the system.

公开(公告)号：US06627822B2

公开(公告)日：2003-09-30

申请号：US09893307

申请日：2001-06-27

Applicant: James Daniel Jackson ,  Terrance J. Dishongh ,  Damion T. Searls

Inventor： James Daniel Jackson ,  Terrance J. Dishongh ,  Damion T. Searls

IPC: H05K116

CPC classification number: H05K3/3415 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2224/05599

Abstract: A electronic assembly is disclosed and claimed. The electronic assembly includes a first substrate and a second substrate. A plurality of power connections are coupled between the first substrate and the second substrate and a multiplicity of signal connections separate from the plurality of power connections are also coupled between the first substrate and the second substrate. Each of the plurality of power connections have a substantially different size and shape compared to each of the multiplicity of signal connections.

Abstract translation: 公开并要求保护电子组件。 电子组件包括第一基板和第二基板。 多个电源连接耦合在第一基板和第二基板之间，并且与多个电源连接分离的多个信号连接也耦合在第一基板和第二基板之间。 与多个信号连接中的每一个相比，多个电源连接中的每一个具有基本上不同的大小和形状。

公开(公告)号：US06856016B2

公开(公告)日：2005-02-15

申请号：US10187513

申请日：2002-07-02

Applicant: Damion T. Searls ,  Terrance J. Dishongh ,  James Daniel Jackson

Inventor： Damion T. Searls ,  Terrance J. Dishongh ,  James Daniel Jackson

IPC: H01L23/433 ,  H01L23/10 ,  F28F7/00 ,  H01L23/26 ,  H01L23/34 ,  H05K7/20

CPC classification number: H01L23/433 ,  B82Y10/00 ,  H01L23/373 ,  H01L2924/0002 ,  Y10S977/833 ,  H01L2924/00

Abstract: An embodiment of the present invention described and shown in the specification and drawings is a process and a package for facilitating cooling and grounding of a semiconductor die using carbon nanotubes in a thermal interface layer between the die and a thermal management aid. The embodiments that are disclosed have the carbon nanotubes positioned and sized to utilize their high thermal and electrical conductance to facilitate the flow of heat and current to the thermal management aid. One embodiment disclosed has the carbon nanotubes mixed with a paste matrix before being applied. Another disclosed embodiment has the carbon nanotubes grown on the surface of the semiconductor die.

Abstract translation: 在说明书和附图中描述和示出的本发明的实施例是用于在模具和热管理辅助器之间的热界面层中使用碳纳米管促进半导体管芯的冷却和接地的方法和封装。 所公开的实施例具有碳纳米管的定位和尺寸以利用其高的热和电导率来促进热和电流流向热管理辅助装置。 所公开的一个实施例在施加之前碳纳米管与糊状基质混合。 另一个公开的实施例具有在半导体管芯的表面上生长的碳纳米管。

公开(公告)号：US06713871B2

公开(公告)日：2004-03-30

申请号：US10152524

申请日：2002-05-21

Applicant: Damion T. Searls ,  Weston C. Roth ,  James Daniel Jackson

Inventor： Damion T. Searls ,  Weston C. Roth ,  James Daniel Jackson

IPC: H01L2352

CPC classification number: H01L24/81 ,  H01L23/642 ,  H01L24/16 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/145 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10S257/924 ,  Y10S438/957

Abstract: A system to package high performance microelectronic devices, such as processors, responds to component transients. In one embodiment, the system includes a decoupling capacitor that is disposed between a Vcc electrical bump and a Vss electrical bump. The decoupling capacitor has Vcc and Vss terminals. The Vcc and Vss terminals share electrical pads with the Vcc electrical bump and the Vss electrical bump. A simple current loop is created that improves the power delivery for the system.

Abstract translation: 封装高性能微电子器件（例如处理器）的系统响应元件瞬变。 在一个实施例中，该系统包括设置在Vcc电凸起和Vss电凸起之间的去耦电容器。 去耦电容器具有Vcc和Vss端子。 Vcc和Vss端子与Vcc电气凸块和Vss电气凸块共享电气垫。 创建一个简单的电流循环，可以改善系统的功率传递。