公开(公告)号：US20070206109A1

公开(公告)日：2007-09-06

申请号：US11367867

申请日：2006-03-02

Applicant: Hsiu wen Tu ,  Mon nan Ho ,  Jason Chuang ,  Chen pin Peng ,  Chung hsien Hsin ,  Wei Chang

Inventor： Hsiu wen Tu ,  Mon nan Ho ,  Jason Chuang ,  Chen pin Peng ,  Chung hsien Hsin ,  Wei Chang

IPC: H04N5/225

CPC classification number: H04N5/2251

Abstract: An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.

Abstract translation: 具有排气孔的图像传感器模块包括具有上表面和下表面的基板。 芯片安装在基板的上表面上。 多个导线将芯片电连接到基板的上表面。 在基材的上表面上涂布粘附层。 透镜支架通过粘合胶安装在基板的上表面上，并形成有顶壁，侧壁和内螺纹，其中顶壁形成有排气孔。 镜筒形成有螺纹拧在透镜架的内螺纹上的外螺纹。 并且在透镜保持器的空气逸出孔内填充填充的胶水。

公开(公告)号：US06874227B2

公开(公告)日：2005-04-05

申请号：US10454649

申请日：2003-06-03

Applicant: Chung Hsien Hsin ,  Hsiu-Wen Tu ,  Jason Chuang ,  Irving You

Inventor： Chung Hsien Hsin ,  Hsiu-Wen Tu ,  Jason Chuang ,  Irving You

IPC: G01R1/00 ,  H01L27/146 ,  H05K3/30

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49169 ,  H01L2924/00014

Abstract: A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.

Abstract translation: 包装图像传感器的方法包括以下步骤：提供具有上表面和下表面的基底; 将框架层安装到基板的上表面以与基板一起形成室; 将光敏芯片安装到基板的上表面和室内，并将感光芯片电连接到基板上; 在其间施加B阶粘合剂将透明层安装到框架层; 预烘烤B阶粘合剂以将透明层稍微粘附到框架层; 测试图像传感器以确定图像传感器是否通过或失败; 并且对通过的图像传感器进行后烘烤以完全固化B级粘合剂，使得透明层牢固地粘附到框架层。

公开(公告)号：US06590269B1

公开(公告)日：2003-07-08

申请号：US10114201

申请日：2002-04-01

Applicant: Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

Inventor： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

IPC: H01L310203

CPC classification number: H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.

Abstract translation: 用于感光芯片的封装结构包括具有上表面和下表面的基片和具有第一表面和第二表面的框架层。 框架层通过注射成型形成在基板上，第一表面接触上表面。 在基板和框架层之间形成空腔。 第二表面形成有凹部，其中形成有具有适当高度的多个凸起。 框架层通过注射成型直接形成在基板上。 封装结构还包括布置在空腔内的感光芯片，用于将基板连接到感光芯片的多根导线以及搁置在凹陷内的凸起上的透明层。 因此，可以提高收率并且可以促进制造过程。

公开(公告)号：US07554599B2

公开(公告)日：2009-06-30

申请号：US11367867

申请日：2006-03-02

Applicant: Hsiu wen Tu ,  Mon nan Ho ,  Jason Chuang ,  Chen pin Peng ,  Chung hsien Hsin ,  Wei Chang

Inventor： Hsiu wen Tu ,  Mon nan Ho ,  Jason Chuang ,  Chen pin Peng ,  Chung hsien Hsin ,  Wei Chang

IPC: H04N5/225

CPC classification number: H04N5/2251

Abstract: An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.

Abstract translation: 具有排气孔的图像传感器模块包括具有上表面和下表面的基板。 芯片安装在基板的上表面上。 多个导线将芯片电连接到基板的上表面。 在基材的上表面上涂布粘附层。 透镜支架通过粘合胶安装在基板的上表面上，并形成有顶壁，侧壁和内螺纹，其中顶壁形成有排气孔。 镜筒形成有螺纹拧在透镜架的内螺纹上的外螺纹。 并且在透镜保持器的空气逸出孔内填充填充的胶水。

公开(公告)号：US20080067334A1

公开(公告)日：2008-03-20

申请号：US11986227

申请日：2007-11-19

Applicant: Jason Chuang ,  Mon Nan Ho ,  Hsiu Wen Tu ,  Chen Pin Peng ,  Chung Hsien Hsin ,  Wei Chang

Inventor： Jason Chuang ,  Mon Nan Ho ,  Hsiu Wen Tu ,  Chen Pin Peng ,  Chung Hsien Hsin ,  Wei Chang

IPC: H01J5/02 ,  H01L21/64

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.

Abstract translation: 图像传感器封装结构包括基板，芯片，多根导线和框架层。 基板具有形成有第一电极的上表面和形成有与第一电极电连接的第二电极的下表面。 芯片具有传感器区域和位于芯片的传感器区域侧的多个接合焊盘，并且安装在基板的上表面上。 多个导线将芯片的焊盘电连接到基板的第一电极。 框架层插入透明层，并且布置在基板的上表面上以覆盖芯片。

公开(公告)号：US20070241272A1

公开(公告)日：2007-10-18

申请号：US11404730

申请日：2006-04-14

Applicant: Jason Chuang ,  Mon Ho ,  Hsiu Tu ,  Chen Pin Peng ,  Chung Hsin ,  Wei Chang

Inventor： Jason Chuang ,  Mon Ho ,  Hsiu Tu ,  Chen Pin Peng ,  Chung Hsin ,  Wei Chang

IPC: H01J5/02

CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.

Abstract translation: 图像传感器封装结构包括基板，芯片，多根导线和框架层。 基板具有形成有第一电极的上表面和形成有与第一电极电连接的第二电极的下表面。 芯片具有传感器区域和位于芯片的传感器区域侧的多个接合焊盘，并且安装在基板的上表面上。 多个导线将芯片的焊盘电连接到基板的第一电极。 框架层插入透明层，并且布置在基板的上表面上以覆盖芯片。