公开(公告)号：US09637377B2

公开(公告)日：2017-05-02

申请号：US13129601

申请日：2009-11-17

Applicant: Wolfgang Reinert ,  Jochen Quenzer ,  Kai Gruber ,  Stephan Warnat

Inventor： Wolfgang Reinert ,  Jochen Quenzer ,  Kai Gruber ,  Stephan Warnat

IPC: B05D5/12 ,  B81C1/00 ,  B81B7/00 ,  G01J5/04 ,  H01L23/26 ,  B32B3/30

CPC classification number: B81C1/00206 ,  B32B3/30 ,  B81B7/0038 ,  G01J5/045 ,  H01L23/26 ,  H01L2924/0002 ,  Y10T29/4913 ,  Y10T428/24174 ,  Y10T428/24612 ,  H01L2924/00

Abstract: The present invention relates to a method for forming a micro-surface structure on a substrate, in particular for producing a micro-electromechanical component, a micro-surface structure of this type, a method for producing a micro-electromechanical component having a micro-surface structure of this type and such a micro-electromechanical component. The invention is particularly relevant for components of microsystem technology (MST, micro-electromechanical systems MEMS) and the construction and connection technology for hermetically housing micro components, preferably using getter materials.

公开(公告)号：US20110287214A1

公开(公告)日：2011-11-24

申请号：US13129601

申请日：2009-11-17

Applicant: Wolfgang Reinert ,  Jochen Quenzer ,  Kai Gruber ,  Stephan Warnat

Inventor： Wolfgang Reinert ,  Jochen Quenzer ,  Kai Gruber ,  Stephan Warnat

IPC: B32B7/00 ,  B32B3/30 ,  H05K3/30

CPC classification number: B81C1/00206 ,  B32B3/30 ,  B81B7/0038 ,  G01J5/045 ,  H01L23/26 ,  H01L2924/0002 ,  Y10T29/4913 ,  Y10T428/24174 ,  Y10T428/24612 ,  H01L2924/00

Abstract: The present invention relates to a method for forming a micro-surface structure on a substrate, in particular for producing a micro-electromechanical component, a micro-surface structure of this type, a method for producing a micro-electromechanical component having a micro-surface structure of this type and such a micro-electromechanical component. The invention is particularly relevant for components of microsystem technology (MST, micro-electromechanical systems MEMS) and the construction and connection technology for hermetically housing micro components, preferably using getter materials.

Abstract translation: 本发明涉及一种在基板上形成微表面结构的方法，特别是用于制造微机电元件的微型表面结构，这种微型表面结构的制造方法， 这种类型的表面结构和这种微机电部件。 本发明特别涉及微系统技术（MST，微机电系统MEMS）的组件以及用于气密地容纳微组件的构造和连接技术，优选使用吸气材料。