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公开(公告)号：US11715742B2
公开(公告)日：2023-08-01
申请号：US17095588
申请日：2020-11-11
Applicant: Luca Hung , Lavender Cheng
Inventor： Luca Hung , Lavender Cheng
IPC: G02F1/1362 , H01L27/12 , G02F1/1339 , H01Q1/38 , G02F1/1368 , H10K59/131
CPC classification number: H01L27/124 , G02F1/1339 , G02F1/1368 , G02F1/136286 , H01Q1/38 , G02F2202/28 , H10K59/1315
Abstract: A wiring structure and an electronic device including the wiring structure are provided. The wiring structure includes a plurality of wires, and each of the wires has a first portion and a second portion. The first portion and the second portion respectively have a first width W1 and a second width W2. The second width W2 is different from the first width W1. In addition, at least one of the wires satisfies an equation as follows:
0
≦
❘
"\[LeftBracketingBar]"
AR
2
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AR
1
❘
"\[RightBracketingBar]"-
公开(公告)号：US20220035191A1
公开(公告)日：2022-02-03
申请号：US16944149
申请日：2020-07-31
Applicant: Fiona JHAN , Lavender CHENG
Inventor： Fiona JHAN , Lavender CHENG
IPC: G02F1/1339 , G02F1/1343 , H05K1/14 , H05K1/02
Abstract: A sealing structure is provided. The sealing structure includes two substrates opposite each other, each of which has a sealing region on its periphery. The sealing structure further includes a recess structure having at least one recess in the sealing region of at least one of the two substrates. The sealing structure further includes a sealing material with filler particles, which is disposed along the sealing regions to seal the two substrates, wherein a portion of the filler particles are accommodated in the at least one recess.
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公开(公告)号：US11206734B1
公开(公告)日：2021-12-21
申请号：US16896100
申请日：2020-06-08
Applicant: Roger Huang , Joe Huang , Lavender Cheng , Sean Chang
Inventor： Roger Huang , Joe Huang , Lavender Cheng , Sean Chang
IPC: H05K1/02 , H05K1/11 , H01L51/00 , H01L23/498 , H05K1/18
Abstract: A wiring structure is provided, including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side, a bottom side and two side walls opposite to each other. The insulating layer which wraps around the conductive wiring at least through the top side and two side walls, wherein there is a gap between the insulating layer and at least one of the two side walls.
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公开(公告)号：US11678435B2
公开(公告)日：2023-06-13
申请号：US17455653
申请日：2021-11-18
Applicant: Roger Huang , Joe Huang , Lavender Cheng , Sean Chang
Inventor： Roger Huang , Joe Huang , Lavender Cheng , Sean Chang
CPC classification number: H05K1/028 , H01L23/4985 , H01L51/0097 , H05K1/0393 , H05K1/11 , H05K1/18 , H05K2201/0373
Abstract: An electronic device is provided and includes a wiring structure including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side and two side walls opposite to each other. The insulating layer wraps around the conductive wiring at least through the top side and two side walls, wherein there is a gap between the insulating layer and at least one of the two side walls. The conductive wiring includes a first layer, a second layer and a third layer, the second layer is disposed between the first layer and the third layer, and the first layer is disposed between the second layer and the substrate. A thickness of the second layer is greater than a thickness of the first layer, and the thickness of the second layer is greater than a thickness of the third layer.
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公开(公告)号：US11561434B1
公开(公告)日：2023-01-24
申请号：US17517400
申请日：2021-11-02
Applicant: Yujun Chiu , Lavender Cheng , Maggy Hsu
Inventor： Yujun Chiu , Lavender Cheng , Maggy Hsu
IPC: G02F1/13357 , H01L25/075 , H01L33/50 , H01L33/58 , H01L33/62 , H01L33/60
Abstract: A light-emitting module is provided. The light-emitting module includes a circuit substrate and a first light-emitting element disposed on the circuit substrate. The light-emitting module also includes an optical pattern disposed on the circuit substrate and adjacent to the first light-emitting element. The light-emitting module further includes a lens covering the first light-emitting element and the optical pattern.
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Patent Agency Ranking
公开(公告)号：US11500248B2
公开(公告)日：2022-11-15
申请号：US16944149
申请日：2020-07-31
Applicant: Fiona Jhan , Lavender Cheng
Inventor： Fiona Jhan , Lavender Cheng
IPC: H05K1/14 , G02F1/1339 , G02F1/1343 , H05K1/02
Abstract: A sealing structure is provided. The sealing structure includes two substrates opposite each other, each of which has a sealing region on its periphery. The sealing structure further includes a recess structure having at least one recess in the sealing region of at least one of the two substrates. The sealing structure further includes a sealing material with filler particles, which is disposed along the sealing regions to seal the two substrates, wherein a portion of the filler particles are accommodated in the at least one recess.
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公开(公告)号：US20220149078A1
公开(公告)日：2022-05-12
申请号：US17095588
申请日：2020-11-11
Applicant: Luca HUNG , Lavender CHENG
Inventor： Luca HUNG , Lavender CHENG
IPC: H01L27/12 , G02F1/1362 , G02F1/1339 , G02F1/1368 , H01Q1/38
Abstract: A wiring structure and an electronic device including the wiring structure are provided. The wiring structure includes a plurality of wires, and each of the wires has a first portion and a second portion. The first portion and the second portion respectively have a first width W1 and a second width W2. The second width W2 is different from the first width W1. In addition, at least one of the wires satisfies an equation as follows: 0 ≦ AR 2 - AR 1
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公开(公告)号：US11330726B2
公开(公告)日：2022-05-10
申请号：US16935461
申请日：2020-07-22
Applicant: Yujun Chiu , Lavender Cheng
Inventor： Yujun Chiu , Lavender Cheng
Abstract: An electronic device is provided. The electronic device includes: a panel, a first cushioning component, and a second cushioning component. The panel includes a bottom surface, a first corner and a second corner, and the bottom surface connects between the first corner and the second corner. The first cushioning component supports the first corner of the panel. The second cushioning component supports the second corner of the panel. The Young's modulus of the first cushioning component and the Young's modulus of the second cushioning component are ranged from 500 MPa to 1500 MPa.
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公开(公告)号：US20210385940A1
公开(公告)日：2021-12-09
申请号：US16896100
申请日：2020-06-08
Applicant: Roger HUANG , Joe HUANG , Lavender CHENG , Sean CHANG
Inventor： Roger HUANG , Joe HUANG , Lavender CHENG , Sean CHANG
IPC: H05K1/02 , H01L23/498 , H01L51/00
Abstract: A wiring structure is provided, including a conductive wiring and an insulating layer. The conductive wiring is disposed on a substrate and has a top side, a bottom side and two side walls opposite to each other. The insulating layer which wraps around the conductive wiring at least through the top side and two side walls, wherein there is a gap between the insulating layer and at least one of the two side walls.
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公开(公告)号：US11848333B2
公开(公告)日：2023-12-19
申请号：US17409960
申请日：2021-08-24
Applicant: Tony Li , Lavender Cheng , Joe Liu
Inventor： Tony Li , Lavender Cheng , Joe Liu
IPC: H01L27/12
CPC classification number: H01L27/124
Abstract: An electronic device includes a substrate, a first signal line, a second signal line, and a third signal line. The first signal line, the second signal line, and the third signal line are disposed in a peripheral region of the substrate, arranged along a first direction, and extending along a second direction. The second signal line has a line portion and an end portion. The end portion has a first end point adjacent to the first signal line and a second end point adjacent to the third signal line. In the first direction, the first distance between the first signal line and the line portion is greater than the second distance between the line portion and the third signal line, and the third distance between the first end point and the line portion is greater than the fourth distance between the second end point and the line portion.
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