Abstract:
A system, a shelf, and a high density platform optimize physical arrangement of cards to maximize cooling effectiveness and line card pitch while minimizing backplane trace lengths between line interface and switch fabric cards. The shelf and system and associated card arrangement supports scaling to a larger, double size system that maintains the required length of backplane traces for card communications without compromising card cooling. Advantageously, the shelf and system maintains full NEBS compliance through an arrangement supporting full air intake/outtake through a front and/or back of the shelf or system, i.e. no side ventilation, and includes a false front to ensure all cards (switch fabric and line interface cards) are substantially flush with one another.
Abstract:
A recessed connectorized faceplate assembly is disclosed for connecting multiple cables at the front of an electronics equipment shelf. The recessed connectorized faceplate assembly includes a connectorized faceplate defining the back wall of a cabling volume behind where a standard faceplate would normally be situated. The cabling volume has an aperture admitting cables routed from a cable trough situated between equipment shelves. The front of the cabling volume is preferably defined by a hinged faceplate granting access to the cabling volume. Access is further enhanced via a pivoting panel forming one of the sidewalls. A bridging cable connecting the circuit card containing the faceplate to the backplane allows partial withdrawal of the card while maintaining connections. The recessed connectorized faceplate assembly is particularly useful for overcoming accidental cable and connector damage due to incidental contact as compared to exposed connectorized faceplates known in the art, and for providing a more aesthetically pleasing appearance to an equipment shelf front.
Abstract:
A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.
Abstract:
A system, a shelf, and a high density platform optimize physical arrangement of cards to maximize cooling effectiveness and line card pitch while minimizing backplane trace lengths between line interface and switch fabric cards. The shelf and system and associated card arrangement supports scaling to a larger, double size system that maintains the required length of backplane traces for card communications without compromising card cooling. Advantageously, the shelf and system maintains full NEBS compliance through an arrangement supporting full air intake/outtake through a front and/or back of the shelf or system, i.e. no side ventilation, and includes a false front to ensure all cards (switch fabric and line interface cards) are substantially flush with one another.
Abstract:
A recessed connectorized faceplate assembly for connecting multiple cables at the front of an electronics equipment shelf. The recessed connectorized faceplate assembly includes a connectorized faceplate defining the back wall of a cabling volume behind where a standard faceplate would normally be situated. The cabling volume has an aperture admitting cables routed from a cable trough situated between equipment shelves. The front of the cabling volume comprises a hinged faceplate granting access to the cabling volume. Access is via a pivoting panel forming one of the sidewalls. A bridging cable connecting the circuit card containing the faceplate to the backplane allows partial withdrawal of the card while maintaining connections.
Abstract:
A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.