公开(公告)号：US4031313A

公开(公告)日：1977-06-21

申请号：US546810

申请日：1975-02-03

Applicant: Arnold Franz ,  Dirk Huthwelker ,  Lothar Jacob

Inventor： Arnold Franz ,  Dirk Huthwelker ,  Lothar Jacob

IPC: B32B15/04 ,  B29C67/00 ,  B29D1/00 ,  B32B15/08 ,  B32B37/00 ,  H01B5/14 ,  H05K1/03 ,  H05K1/00 ,  B32B15/02

CPC classification number: H01B5/14 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10S428/901 ,  Y10S428/92 ,  Y10T428/24917 ,  Y10T428/24967 ,  Y10T428/265 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31627 ,  Y10T428/31649 ,  Y10T428/31688 ,  Y10T428/31699 ,  Y10T428/31935 ,  Y10T428/31949 ,  Y10T428/31964 ,  Y10T428/31967

Abstract: A laminated material comprises a substrate material containing resin-impregnated layers, a metal foil disposed on said substrate and an arc-retardant layer arranged between the metal foil and the substrate material. The arc-retardant layer is an arc-retardant, crosslinked heat-stable synthetic resinous material consisting of from about 60 to 100% by weight of a heat-stable resin which is free of aromatic groupings or heterocyclic rings containing at least one heteroatom and conjugated double bonds and which is not converted to a graphite-containing structure upon being thermally decomposed.

Abstract translation: 叠层材料包括含有树脂浸渍层的基底材料，设置在所述基底上的金属箔和布置在金属箔和基底材料之间的阻燃层。 阻燃层是阻燃交联的热稳定合成树脂材料，由约60至100重量％的不含芳族基团的热稳定性树脂或含有至少一个杂原子的杂环和共轭 双键，并且在热分解时不转化为含石墨的结构。

公开(公告)号：US4360560A

公开(公告)日：1982-11-23

申请号：US18734

申请日：1979-03-08

Applicant: Siegfried Kopnick ,  Dirk Huthwelker ,  Arnold Franz ,  Lothar Jacob

Inventor： Siegfried Kopnick ,  Dirk Huthwelker ,  Arnold Franz ,  Lothar Jacob

IPC: B32B29/00 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  B32B27/04 ,  B32B27/30 ,  B32B27/42 ,  B32B31/12 ,  H05K1/00

CPC classification number: H05K1/036 ,  B32B29/00 ,  H05K3/387 ,  H05K2201/0133 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1476 ,  H05K3/181 ,  Y10S428/901 ,  Y10T428/31877 ,  Y10T442/3561 ,  Y10T442/3577

Abstract: A base material for the production of printed circuits according to the additive method includes a laminate base made up of laminated-together core sheets impregnated with hardenable resin, and a cover layer made up of a substrate sheet preimpregnated with phenolic resol resin and provided with an adhesive layer of an elastomeric polymer. The preimpregnated substrate sheet is also provided with a further resin impregnation containing a self-crosslinking copolymer of acrylic monomers and up to 30% by weight of a hardenable phenolic resol resin.

Abstract translation: 用于根据添加剂方法生产印刷电路的基材包括由浸渍有可硬化树脂的层叠在一起的芯片构成的层叠基材和由预先浸渍有酚醛树脂树脂的基材片构成的覆盖层， 弹性体聚合物的粘合剂层。 预浸渍的基材片还具有进一步的树脂浸渍，其含有丙烯酸单体的自交联共聚物和最多30重量％的可硬化酚醛树脂树脂。