公开(公告)号：US10455697B2

公开(公告)日：2019-10-22

申请号：US16249169

申请日：2019-01-16

Applicant: MDM INC.

Inventor： Ku Yong Kim

IPC: H05K7/20 ,  H05K1/05 ,  H05K1/02 ,  H05K1/03 ,  H05K5/00 ,  H05K5/03 ,  H05K7/02

Abstract: An embodiment of the present invention provides a PCB module comprising: a multilayer PCB assembly including a heat dissipation plate layer, and an upper PCB and a lower PCB which are attached to the upper surface and the lower surface of the heat dissipation plate layer, respectively; and an upper case and a lower case for covering the upper side and the lower side of the multilayer PCB assembly, respectively, wherein the heat dissipation plate layer includes a plurality of electrically insulating heat dissipation plates arranged on the same plane, and at least one of the plurality of heat dissipation plates comprises: a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole in thermal contact with the inner surface of at least one of the upper and lower cases.

公开(公告)号：US09930815B2

公开(公告)日：2018-03-27

申请号：US15358687

申请日：2016-11-22

Applicant: MDM Inc.

Inventor： Ku Yong Kim

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K7/209 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/303 ,  H05K3/4608 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10242

Abstract: The present disclosure relates to a layered structure of a multi-layer PCB, and more particularly, to a structure of a high-power multi-layer PCB which can use a high current by efficiently dissipating heat generated from the inside of the multi-layered PCB and heat generated from a power semiconductor module package mounted on the PCB, and a production method thereof. The multi-layer PCB includes: a conductive plate having a plurality of heat poles protruding from at least one of a top surface and a bottom surface thereof; PCBs which are disposed on the top surface and the bottom surface of the conductive plate, and have a plurality of penetrating holes formed therethrough to allow the heat poles of the conductive plate to be inserted thereinto; and an insulation layer which is attached between the conductive plate and the PCBs in order to electrically insulate.

公开(公告)号：US20200178399A1

公开(公告)日：2020-06-04

申请号：US16697182

申请日：2019-11-27

Applicant: MDM Inc.

Inventor： Ku Yong Kim

IPC: H05K3/46 ,  H05K3/14 ,  H05K3/12

Abstract: A method for forming a multilayered circuit pattern on a surface of a 3D metal board includes: forming a first insulation layer on the surface of the 3D metal board; forming a first conductive pattern on the first insulation layer; forming a second insulation layer on the first conductive pattern except for a predetermined region; forming a second conductive pattern on the second insulation layer; and forming a third insulation layer on the second conductive pattern except for one or more circuit element mounting regions.

公开(公告)号：US20200178396A1

公开(公告)日：2020-06-04

申请号：US16697186

申请日：2019-11-27

Applicant: MDM Inc.

Inventor： Ku Yong Kim

IPC: H05K3/14 ,  H05K3/46

Abstract: A method for forming a circuit pattern on a surface of a 3D structure includes: forming a first insulation layer on the surface of the 3D structure; forming a conductive pattern on the first insulation layer; forming a second insulation layer on the conductive pattern except for a circuit element mounting region; and mounting one or more circuit elements on the circuit element mounting region.

公开(公告)号：US20190166691A1

公开(公告)日：2019-05-30

申请号：US16249169

申请日：2019-01-16

Applicant: MDM INC.

Inventor： Ku Yong KIM

IPC: H05K1/05 ,  H05K5/03 ,  H05K7/20 ,  H05K7/02

Abstract: An embodiment of the present invention provides a PCB module comprising: a multilayer PCB assembly including a heat dissipation plate layer, and an upper PCB and a lower PCB which are attached to the upper surface and the lower surface of the heat dissipation plate layer, respectively; and an upper case and a lower case for covering the upper side and the lower side of the multilayer PCB assembly, respectively, wherein the heat dissipation plate layer includes a plurality of electrically insulating heat dissipation plates arranged on the same plane, and at least one of the plurality of heat dissipation plates comprises: a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole in thermal contact with the inner surface of at least one of the upper and lower cases.

公开(公告)号：US20170208704A1

公开(公告)日：2017-07-20

申请号：US15358687

申请日：2016-11-22

Applicant: MDM Inc.

Inventor： Ku Yong KIM

IPC: H05K7/20 ,  H05K3/30 ,  H05K3/46 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/209 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/303 ,  H05K3/4608 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10242

Abstract: The present disclosure relates to a layered structure of a multi-layer PCB, and more particularly, to a structure of a high-power multi-layer PCB which can use a high current by efficiently dissipating heat generated from the inside of the multi-layered PCB and heat generated from a power semiconductor module package mounted on the PCB, and a production method thereof. The multi-layer PCB includes: a conductive plate having a plurality of heat poles protruding from at least one of a top surface and a bottom surface thereof; PCBs which are disposed on the top surface and the bottom surface of the conductive plate, and have a plurality of penetrating holes formed therethrough to allow the heat poles of the conductive plate to be inserted thereinto; and an insulation layer which is attached between the conductive plate and the PCBs in order to electrically insulate.