METHODS OF MANUFACTURING A HERMETIC AND ISOLATING FEEDTHROUGH FOR AN ELECTRONIC DEVICE CASING, IN PARTICULAR MADE OF TITANIUM

    公开(公告)号:US20190099604A1

    公开(公告)日:2019-04-04

    申请号:US16151317

    申请日:2018-10-03

    Applicant: MISTIC

    Inventor: Bertrand BOUTAUD

    Abstract: A device casing includes a wall having a metallic substrate and electrical connection of a feedthrough that includes a metal through-element made at least in a zone of isolation of the area of the feedthrough from the substrate material, in the form of an islet of closed contour, physically and electrically isolated from the substrate. An interface for coupling the through-element to the substrate provides the mechanical securing of the through-element to the substrate and the electrical isolation thereof and includes a peripheral lateral layer made of an electrically isolating material that surrounds the through-element over the whole periphery thereof and extends transversally through the thickness of the thinned area of the substrate. The substrate, the through-element and the lateral layer form a monolithically integrated unit, and the lateral layer provides essentially and directly both the mechanical securing and the electrical isolation between through-element and substrate.

    Biocompatible monolithically integrated sensor, in particular for an active implantable medical device

    公开(公告)号:US10442679B2

    公开(公告)日:2019-10-15

    申请号:US16167904

    申请日:2018-10-23

    Applicant: MISTIC

    Inventor: Bertrand Boutaud

    Abstract: The sensor includes: a first biocompatible substrate, with an operative area deformable under the effect of an external mechanical stress and a mobile transducer element; a second biocompatible substrate, with an operative area and a fixed transducer element cooperative with the mobile element to vary an electrical parameter of the sensor; a mechanical connection for securing the first substrate to the second substrate; a first sensor terminal coupled to the mobile element; and a second sensor terminal coupled to the fixed element. The operative area of one of the substrates has the shape of an islet of closed contour, physically and electrically isolated from the remainder of the substrate by a peripheral lateral layer that is monolithically integrated with the remainder of the substrate and the operative area.

    Methods of manufacturing a hermetic and isolating feedthrough for an electronic device casing, in particular made of titanium

    公开(公告)号:US11318318B2

    公开(公告)日:2022-05-03

    申请号:US16151317

    申请日:2018-10-03

    Applicant: MISTIC

    Inventor: Bertrand Boutaud

    Abstract: A device casing includes a wall having a metallic substrate and electrical connection of a feedthrough that includes a metal through-element made at least in a zone of isolation of the area of the feedthrough from the substrate material, in the form of an islet of closed contour, physically and electrically isolated from the substrate. An interface for coupling the through-element to the substrate provides the mechanical securing of the through-element to the substrate and the electrical isolation thereof and includes a peripheral lateral layer made of an electrically isolating material that surrounds the through-element over the whole periphery thereof and extends transversally through the thickness of the thinned area of the substrate. The substrate, the through-element and the lateral layer form a monolithically integrated unit, and the lateral layer provides essentially and directly both the mechanical securing and the electrical isolation between through-element and substrate.

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