中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

25 records (took 0.017 seconds)

    Two-dimensional adjustable edge connector adaptor
    2.
    发明授权
    Two-dimensional adjustable edge connector adaptor 有权
    二维可调边缘连接器适配器

    公开(公告)号：US07255578B2

    公开(公告)日：2007-08-14

    申请号：US11097871

    申请日：2005-03-31

    Applicant: Edoardo Campini ,  William Handley ,  Mark D. Summers

    Inventor： Edoardo Campini ,  William Handley ,  Mark D. Summers

    IPC: H01R12/00

    CPC classification number: H05K7/1461 ,  G06F1/185

    Abstract: A two-dimensional adjustable edge connector adaptor to support high bandwidth signal paths. The edge connector adapter includes a housing having a cavity formed in one side and an edge connector extending outward from an opposing side. The edge connector includes contact members that are configured to function as conventional edge connector contacts on one end, while the opposing end includes a leg that is in contact with first side of an elastomer connector disposed in the cavity. The elastomer connector facilitates electrical coupling between each contact member and a corresponding board contact on a board having a connector edge that is inserted into the cavity, wherein each board contact includes a leg that is in contact with a second side of the elastomer connector. The adjustable edge connector adaptor enables the board to be positioned in both the horizontal and vertical directions relative to the edge connector.

    Abstract translation: 二维可调边缘连接器适配器，支持高带宽信号路径。 边缘连接器适配器包括具有形成在一侧的空腔和从相对侧向外延伸的边缘连接器的壳体。 边缘连接器包括接触构件，其构造成在一端上起常规边缘连接器触点的作用，而相对端包括与布置在空腔中的弹性体连接器的第一侧接触的支脚。 弹性体连接器便于每个接触构件之间的电耦合以及具有插入空腔中的连接器边缘的电路板上的相应电路板触点，其中每个电路板触点包括与弹性体连接器的第二侧接触的支脚。 可调节边缘连接器适配器使板可以相对于边缘连接器在水平和垂直方向上定位。

    Thermal solution for a mezzanine card
    3.
    发明授权
    Thermal solution for a mezzanine card 失效
    夹层卡的热解决方案

    公开(公告)号：US06917523B2

    公开(公告)日：2005-07-12

    申请号：US10850136

    申请日：2004-05-19

    Applicant: Mark D. Summers ,  Javier Leija

    Inventor： Mark D. Summers ,  Javier Leija

    IPC: H05K1/02 ,  H05K7/20

    CPC classification number: H05K7/20436 ,  H05K1/0204 ,  H05K2201/09054 ,  H05K2203/1572 ,  Y10T29/4935

    Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

    Abstract translation: 底部散热装置可附接到印刷电路板（PCB）的底表面。 底部散热装置的顶表面可以与安装在PCB的底表面上的一个或多个电子部件的背面热耦合。 顶部散热装置可附接到PCB的顶表面。 顶部散热装置可以通过导热联接构件与底部散热装置热耦合，以提供用于从底部散热装置到顶部散热装置的热传递的导电路径。 与导热联接构件的边缘相邻的开口可以允许空气在顶部和底部散热装置之间流动。 PCB可以是夹层卡的一部分，例如外围组件互连（PCI）夹层卡（PMC）。

    Heat transfer apparatus
    4.
    发明授权
    Heat transfer apparatus 失效
    传热装置

    公开(公告)号：US06765797B2

    公开(公告)日：2004-07-20

    申请号：US10324289

    申请日：2002-12-19

    Applicant: Mark D. Summers ,  Karl H. Mauritz ,  Amber S. Bedi ,  William Handley ,  Carol Miller ,  Javier Leija ,  Daniel Dragoon

    Inventor： Mark D. Summers ,  Karl H. Mauritz ,  Amber S. Bedi ,  William Handley ,  Carol Miller ,  Javier Leija ,  Daniel Dragoon

    IPC: H05K720

    CPC classification number: H05K7/20509 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

    Abstract translation: 本发明一般涉及用于从发热部件扩散和耗散热能的装置和方法。 更具体地说，本发明涉及一种在电气领域特别有用的传热装置和方法。 传热装置的一个实施例包括但不限于弹簧偏压构件，其包括第一侧构件，第二侧构件和适于弹簧偏置的可移除附接到发热装置的连接构件。 传热装置的另一实施例是弹簧偏置的载体，其附接到发热装置并且承载诸如翅片板的构件。 传热装置的另一实施例是弹簧偏置构件，其包括用于将热能传导到结构的指状物。 传热装置的另一个实施例是用于将单独的散热/散热构件（例如翅片板）附接到发热构件的弹簧偏置夹子。

    Heat transfer apparatus
    5.
    发明授权
    Heat transfer apparatus 失效

    公开(公告)号：US06535387B2

    公开(公告)日：2003-03-18

    申请号：US09894462

    申请日：2001-06-28

    Applicant: Mark D. Summers ,  Karl H. Mauritz ,  Amber S. Bedi ,  William Handley ,  Carol Miller ,  Javier Leija ,  Daniel Dragoon

    Inventor： Mark D. Summers ,  Karl H. Mauritz ,  Amber S. Bedi ,  William Handley ,  Carol Miller ,  Javier Leija ,  Daniel Dragoon

    IPC: H05K720

    CPC classification number: H05K7/20509 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

    Rotating latching mechanism for ATCA mezzanine card modules
    6.
    发明授权
    Rotating latching mechanism for ATCA mezzanine card modules 有权
    ATCA夹层卡模块的旋转闭锁机构

    公开(公告)号：US07345890B2

    公开(公告)日：2008-03-18

    申请号：US11096398

    申请日：2005-04-01

    Applicant: Steven DeNies ,  William Handley ,  Mark D. Summers

    Inventor： Steven DeNies ,  William Handley ,  Mark D. Summers

    IPC: H05K7/14

    CPC classification number: H05K7/1409

    Abstract: Rotating latching mechanism for securing Advanced Telecom Computing Architecture (ATCA) mezzanine card (AdvancedMC) modules within mezzanine slots on an ATCA carrier board. The rotating latching mechanism includes a rotating latching member having a handle coupled to a shaft to which a latching paddle and position detector actuator paddle are also coupled. The rotating latching member is pivotally coupled relative to a faceplate of a module proximate to the handle, and the shaft at the opposite end is supported by a rear bearing support member coupled to the modules circuit card. As the handle is rotated, the latching paddle is rotated to engage a cutout formed in a strut coupled to the ATCA carrier board, thus latching the module in place. The position detector actuator paddle is also rotated to cause a position detector to be actuated.

    Abstract translation: 旋转锁定机构，用于将高级电信计算架构（ATCA）夹层卡（AdvancedMC）模块固定在ATCA载板上的夹层插槽内。 旋转锁定机构包括旋转的闩锁构件，其具有联接到轴的手柄，锁定桨和位置检测器执行器桨也联接到该轴。 旋转的闩锁构件相对于靠近手柄的模块的面板枢转地联接，并且在相对端的轴由耦合到模块电路卡的后轴承支撑构件支撑。 当手柄旋转时，闩锁桨旋转以接合形成在连接到ATCA承载板的支柱中的切口，从而将模块锁定就位。 位置检测器致动器桨也被旋转以使位置检测器被致动。

    Method for testing pressure sensors
    8.
    发明授权
    Method for testing pressure sensors 失效
    压力传感器测试方法

    公开(公告)号：US5900530A

    公开(公告)日：1999-05-04

    申请号：US979331

    申请日：1997-11-24

    Applicant: Gary J. O'Brien ,  Andrew C. McNeil ,  Mark D. Summers

    Inventor： Gary J. O'Brien ,  Andrew C. McNeil ,  Mark D. Summers

    IPC: G01L27/00

    CPC classification number: G01L27/005

    Abstract: Pressure sensors that are fabricated to sense low pressures are tested and calibrated by providing a controlled gas flow or leak to create a pressure during testing. Rather than placing the pressure sensor in a sealed environment, a controlled leak of a gas is used to induce a stable and controllable pressure region over the pressure sensor during testing. The stable low pressure region is monitored via a sensing tube.

    Abstract translation: 制造用于感测低压的压力传感器通过提供受控的气体流或泄漏来测试和校准，以在测试期间产生压力。 不是将压力传感器放置在密封环境中，而是在测试期间使用气体的可控泄漏在压力传感器上引起稳定和可控的压力区域。 通过传感管监测稳定的低压区域。

    Thermal management for hot-swappable module
    9.
    发明授权
    Thermal management for hot-swappable module 有权
    热插拔模块的热管理

    公开(公告)号：US07248479B2

    公开(公告)日：2007-07-24

    申请号：US11092358

    申请日：2005-03-29

    Applicant: Mark D. Summers ,  Lawson Guthrie ,  William Handley

    Inventor： Mark D. Summers ,  Lawson Guthrie ,  William Handley

    IPC: H05K7/20

    CPC classification number: H05K7/20727 ,  H05K7/20545

    Abstract: A method according to one embodiment may include providing a heat generating component disposed on a first side of a first circuit board, and transferring heat from the heat generating component through the first circuit board to a second side of the first circuit board. The method according to this embodiment may further include slidingly thermally coupling the second side of the first circuit board to a thermal solution disposed on a second circuit board. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

    Abstract translation: 根据一个实施例的方法可以包括提供设置在第一电路板的第一侧上的发热部件，并且将热量从发热部件通过第一电路板传递到第一电路板的第二侧。 根据本实施例的方法还可以包括将第一电路板的第二面滑动热耦合到设置在第二电路板上的散热溶液。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

Patent Agency Ranking