公开(公告)号：US07906364B2

公开(公告)日：2011-03-15

申请号：US11791749

申请日：2005-11-29

Applicant: Moshe Kriman ,  Merav Yaakoby

Inventor： Moshe Kriman ,  Merav Yaakoby

IPC: H01L21/00

CPC classification number: H05K3/321 ,  H01L2224/13016 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/1476 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: A method for connecting substrates having electrical conductive elements thereon, comprising: providing at least one spacer between the substrates; applying a conductive material to at least one of the electrical conductive elements; aligning the electrical conductive elements; and, connecting the substrates by urging them together, wherein the at least one spacer prevents lateral spreading of the conductive material on the substrates from bridging a distance between adjacent conductive elements during the connecting.

Abstract translation: 一种用于连接其上具有导电元件的衬底的方法，包括：在所述衬底之间提供至少一个间隔物; 将导电材料施加到至少一个导电元件; 对准导电元件; 以及通过将它们一起推动而将所述基板连接在一起，其中所述至少一个间隔物防止所述导电材料在所述基板上的横向扩展，从而在连接期间桥接相邻导电元件之间的距离。

公开(公告)号：US20090322696A1

公开(公告)日：2009-12-31

申请号：US12486787

申请日：2009-06-18

Applicant: Merav YAAKOBY ,  Doron Teomim ,  Dov Nachshon ,  Dov Brecher ,  Alex Kaimonovich

Inventor： Merav YAAKOBY ,  Doron Teomim ,  Dov Nachshon ,  Dov Brecher ,  Alex Kaimonovich

IPC: G06F3/041 ,  B32B37/02

CPC classification number: G06F3/041 ,  Y10T156/10

Abstract: A digitizer assembly includes a transparent sensor patterned with conductive elements within at least one layer, a PCB or the like patterned with conductive elements positioned along at least one edge of the transparent sensor, wherein the conductive elements at least partially match the conductive elements on the transparent sensor, and a double sided adhesive positioned between the transparent sensor and the PCB operative to mount the PCB on to the transparent sensor.

Abstract translation: 数字转换器组件包括在至少一层内的导电元件图案化的透明传感器，PCB等，其图案化为沿着透明传感器的至少一个边缘定位的导电元件，其中导电元件至少部分地匹配在 透明传感器和位于透明传感器和PCB之间的双面粘合剂，其操作以将PCB安装到透明传感器上。

公开(公告)号：US20070292983A1

公开(公告)日：2007-12-20

申请号：US11791749

申请日：2005-11-29

Applicant: Moshe Kriman ,  Merav Yaakoby

Inventor： Moshe Kriman ,  Merav Yaakoby

IPC: H01L31/18 ,  H01L21/60

CPC classification number: H05K3/321 ,  H01L2224/13016 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0367 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/1476 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: A method for connecting substrates having electrical conductive elements thereon, comprising: providing at least one spacer between the substrates; applying a conductive material to at least one of the electrical conductive elements; aligning the electrical conductive elements; and, connecting the substrates by urging them together, wherein the at least one spacer prevents lateral spreading of the conductive material on the substrates from bridging a distance between adjacent conductive elements during the connecting.

Abstract translation: 一种用于连接其上具有导电元件的衬底的方法，包括：在所述衬底之间提供至少一个间隔物; 将导电材料施加到至少一个导电元件; 对准导电元件; 以及通过将它们一起推动而将所述基板连接在一起，其中所述至少一个间隔物防止所述导电材料在所述基板上的横向扩展，从而在连接期间桥接相邻导电元件之间的距离。