公开(公告)号：US06910615B2

公开(公告)日：2005-06-28

申请号：US10400944

申请日：2003-03-27

Applicant: Peter A. Gruber ,  Minkailu A Jalloh ,  Chon Cheong Lei

Inventor： Peter A. Gruber ,  Minkailu A Jalloh ,  Chon Cheong Lei

IPC: B23K1/00 ,  B23K1/008 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L21/68 ,  H05K3/22 ,  H05K3/26 ,  H05K3/34 ,  B23K31/02 ,  B23K37/00

CPC classification number: H01L21/6835 ,  B23K1/0016 ,  B23K1/008 ,  H01L21/563 ,  H01L22/14 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K3/225 ,  H05K3/26 ,  H05K3/341 ,  H05K3/3463 ,  H05K2203/047 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2224/05599

Abstract: In a solder reflow type building of modular electrical apparatus involving integrated circuit and discrete components, fabrication operations are arranged to include the providing of a general type series of steps for each component element involving a reflow or joining step at the highest joining temperature, immediately followed by a solder flux cleaning step and immediately followed by a testing of the entire module constructed thus far. There is provided a further specific type operation for each different type of component element that includes the providing of a loop for the introduction of a replacement for any broken discrete component with joining being achieved with use of a lower fusion temperature solder, flux cleaning and testing at each joining followed by reinsertion into the module. There is further provided an operation at the encapsulation stage of the module building for introducing underfill between the component and supporting carrier.

Abstract translation: 在涉及集成电路和分立组件的模块化电气设备的回流焊接建筑物中，制造操作被布置为包括为在最高接合温度下涉及回流或接合步骤的每个部件元件提供一般类型的一系列步骤，紧接着 通过焊剂清洁步骤，并立即进行到目前为止构成的整个模块的测试。 为每个不同类型的元件提供了另外的特定类型的操作，包括提供一个环，用于引入任何破损的分立元件的替换，使用较低的熔融温度焊料，焊剂清洁和测试 在每次连接之后重新插入模块。 在模块建筑物的封装阶段进一步提供了在组件和支撑载体之间引入底部填充物的操作。

公开(公告)号：US6051119A

公开(公告)日：2000-04-18

申请号：US5873

申请日：1998-01-12

Applicant: Paul F. Findeis ,  Kenneth R. Idler ,  Minkailu A. Jalloh ,  Thomas A. Kelly ,  Emanuele F. Lopergolo

Inventor： Paul F. Findeis ,  Kenneth R. Idler ,  Minkailu A. Jalloh ,  Thomas A. Kelly ,  Emanuele F. Lopergolo

IPC: C25D17/00 ,  H01L21/48 ,  C25D17/04

CPC classification number: H01L21/4889 ,  C25D17/005 ,  Y10T29/49117

Abstract: Disclosed is a plating structure including a substrate having a plurality of pins to be plated and a metallic plating screen having a plurality of apertures, wherein each of the apertures has at least two tabs spaced apart from each other, wherein the metallic plating screen is placed over the pins so that at least two pins penetrate each aperture, each of the pins contacting a tab of the aperture. Also disclosed is a method of electrolytically plating a plurality of pins utilizing the above metallic plating screen.

Abstract translation: 公开了一种电镀结构，包括具有多个要被电镀的引脚的基板和具有多个孔的金属电镀屏，其中每个孔具有彼此间隔开的至少两个突片，其中金属电镀屏被放置 使得至少两个销穿过每个孔，每个销接触孔的突片。 还公开了利用上述金属电镀屏幕对多个销进行电解电镀的方法。