公开(公告)号：US20030136812A1

公开(公告)日：2003-07-24

申请号：US10341191

申请日：2003-01-13

Applicant: NAS INTERPLEX, INC.

Inventor： Jack Seidler

IPC: B23K031/00

CPC classification number: H05K9/0028 ,  B23K1/0016 ,  B23K2101/40 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0415 ,  Y02P70/613

Abstract: An electromagnetic shield is provided and includes a shield body having an upper wall connected to opposing side walls and opposing end walls. At least two opposing walls of the electromagnetic shield each have a plurality of resilient fingers formed at a lower edge thereof. The electromagnetic shield also includes a solder mass securely held by the fingers by being interleaved between the fingers of each of the at least two opposing walls. The interleaving of the solder mass results in the solder mass being securely held by the fingers and ready for mounting to an electronic component for shielding a portion of the electronic component from undesirable and potentially damaging emissions from neighboring components. A method of mounting an electromagnetic shield to an electronic component having a planar surface and a method of interleaving the solder mass are also provided.

Abstract translation: 提供了一种电磁屏蔽，其包括屏蔽体，该屏蔽体具有连接到相对侧壁和相对端壁的上壁。 电磁屏蔽的至少两个相对的壁各自在其下边缘处形成有多个弹性指状物。 电磁屏蔽还包括通过在至少两个相对壁中的每一个的手指之间交错地由手指牢固地保持的焊料块。 焊料质量的交错导致焊料质量由手指牢固地保持，并且准备安装到电子部件上，用于屏蔽电子部件的一部分不受相邻部件的不期望的和潜在的破坏性的排放。 还提供了一种将电磁屏蔽件安装到具有平坦表面的电子部件和交错焊料块的方法。

公开(公告)号：US20030136818A1

公开(公告)日：2003-07-24

申请号：US10341190

申请日：2003-01-13

Applicant: NAS INTERPLEX, INC.

Inventor： Jack Seidler

IPC: B23K035/12

CPC classification number: B23K37/06 ,  B23K35/0222 ,  B23K2101/40 ,  H05K3/3426 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0415 ,  Y02P70/613

Abstract: A method of retaining a solder mass within a solder-bearing component is provided and includes the steps of: (a) forming a plurality of fingers in the solder-bearing component at one edge thereof, with each finger being defined by a pair of slots formed in the solder-bearing component; and (b) interleaving a solder mass between the fingers such that the solder mass is securely held by the fingers. The solder-bearing component includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.

Abstract translation: 提供了一种在焊料支承部件内保持焊料质量的方法，包括以下步骤：（a）在其一个边缘处在焊料支承部件中形成多个指状物，每个手指由一对槽限定 形成在焊接轴承部件中; 和（b）在指状物之间插入焊料块，使得焊料质量被手指牢固地保持。 焊料支承部件包括任何数量的不同类型的部件，其中由此保持焊料质量，例如引线，端子，连接器，电磁屏蔽等。