公开(公告)号：US20080185459A1

公开(公告)日：2008-08-07

申请号：US11792065

申请日：2004-12-31

Applicant: Doo-Keun An ,  Pyeng-Jae Park

Inventor： Doo-Keun An ,  Pyeng-Jae Park

IPC: B05B1/00

CPC classification number: B01J4/02 ,  B01J4/002 ,  B01J2219/00164

Abstract: The present invention is directed to a system for supplying chemicals to a plurality of nozzles to fabricate integrated circuits. The system includes a supply line, a return line, and a selecting part for supplying a constant amount of chemicals to the return line or one of nozzles. According to the invention, a constant amount of chemicals are supplied from a chemical storage irrespective of the number of nozzles requiring a supply of chemicals. This enables a pump to avoid overworking and suppresses the conventional problem that a determined time is required for enabling chemicals to reach a fixed temperature.

Abstract translation: 本发明涉及一种用于向多个喷嘴提供化学品以制造集成电路的系统。 该系统包括供应管线，返回管线和用于向返回管线或喷嘴中的一个供应恒定量的化学品的选择部件。 根据本发明，不管需要供应化学品的喷嘴的数量如何，从化学品存储器供应恒定量的化学品。 这使得泵避免过度劳累并且抑制了使化学品达到固定温度所需的确定时间的常规问题。

公开(公告)号：US08282771B2

公开(公告)日：2012-10-09

申请号：US12211229

申请日：2008-09-16

Applicant: Gil-Hun Song ,  Pyeng-Jae Park

Inventor： Gil-Hun Song ,  Pyeng-Jae Park

IPC: C23F1/08 ,  H01L21/68

CPC classification number: H01L21/67051 ,  H01L21/67034 ,  H01L21/6708 ,  H01L21/68714

Abstract: In a spin unit for rotating a substrate and a method of processing the substrate, the substrate is secured on a support and is rotated on the support. Processing materials including drying gases, etching solutions and cleaning solutions are selectively supplied onto a bottom surface of the rotating substrate. The same processing materials are also selectively supplied onto a top surface of the substrate. The top and bottom surfaces of the substrate are simultaneously processed by simultaneous supply of the processing materials through the first and second sub-injectors.

Abstract translation: 在用于旋转衬底的旋转单元和处理衬底的方法中，衬底固定在支撑件上并在支撑件上旋转。 包括干燥气体，蚀刻溶液和清洁溶液的处理材料选择性地供应到旋转基板的底表面上。 相同的处理材料也被选择性地供应到基板的顶表面上。 通过第一和第二次注射器同时供应处理材料，同时处理衬底的顶表面和底表面。

公开(公告)号：US20090075484A1

公开(公告)日：2009-03-19

申请号：US12211229

申请日：2008-09-16

Applicant: Gil-Hun Song ,  Pyeng-Jae Park

Inventor： Gil-Hun Song ,  Pyeng-Jae Park

IPC: H01L21/302 ,  C23F1/02

CPC classification number: H01L21/67051 ,  H01L21/67034 ,  H01L21/6708 ,  H01L21/68714

Abstract: In a spin unit for rotating a substrate and a method of processing the substrate, the substrate is secured on a support and is rotated on the support. Processing materials including drying gases, etching solutions and cleaning solutions are selectively supplied onto a bottom surface of the rotating substrate. The same processing materials are also selectively supplied onto a top surface of the substrate. The top and bottom surfaces of the substrate are simultaneously processed by simultaneous supply of the processing materials through the first and second sub-injectors.

Abstract translation: 在用于旋转衬底的旋转单元和处理衬底的方法中，衬底固定在支撑件上并在支撑件上旋转。 包括干燥气体，蚀刻溶液和清洁溶液的处理材料选择性地供应到旋转基板的底表面上。 相同的处理材料也被选择性地供应到基板的顶表面上。 通过第一和第二次注射器同时供应处理材料，同时处理衬底的顶表面和底表面。

公开(公告)号：US06784106B2

公开(公告)日：2004-08-31

申请号：US10183788

申请日：2002-06-26

Applicant: Jeong-Yong Bae ,  Chang-Ro Yoon ,  Pyeng-Jae Park

Inventor： Jeong-Yong Bae ,  Chang-Ro Yoon ,  Pyeng-Jae Park

IPC: H01L21302

CPC classification number: H01L21/67028 ,  H01L21/67034

Abstract: A method for drying a semiconductor substrate includes the steps of clearing the substrate by supplying a liquid into a processing bath of a chamber, injecting first dry gases onto a surface of the supplied liquid, draining the liquid from the processing bath so that the substrate is slowly exposed to the surface of the liquid, and injecting a second dry gas into the chamber and forcibly exhausting gas in the chamber.

Abstract translation: 干燥半导体衬底的方法包括以下步骤：通过将液体供应到室的处理槽中来清洗衬底，将第一干燥气体注入到所提供的液体的表面上，从处理槽排出液体，使得衬底为 缓慢地暴露于液体的表面，并且将第二干燥气体注入到室中并强制地排出腔室中的气体。

公开(公告)号：US06757989B2

公开(公告)日：2004-07-06

申请号：US10183813

申请日：2002-06-26

Applicant: Jeong-Yong Bae ,  Chang-Ro Yoon ,  Pyeng-Jae Park

Inventor： Jeong-Yong Bae ,  Chang-Ro Yoon ,  Pyeng-Jae Park

IPC: F26B1300

CPC classification number: H01L21/67034

Abstract: An apparatus for drying a semiconductor substrate includes a chamber having a processing bath and a cover, a liquid flow system for supplying a liquid flow into the processing bath so as to clean the substrate and for draining a liquid from the processing bath, a gas distributor for spraying a gas for drying the substrate, and decompression means for exhausting air in the chamber.

Abstract translation: 用于干燥半导体衬底的设备包括具有处理槽和盖的室，用于将液体流供应到处理槽中以便清洁衬底并从处理槽排出液体的液体流动系统，气体分配器 用于喷射用于干燥基底的气体，以及用于排出腔室中的空气的减压装置。