公开(公告)号：US09478719B2

公开(公告)日：2016-10-25

申请号：US13086310

申请日：2011-04-13

Applicant: R. Scott West ,  Yan Chai

Inventor： R. Scott West ,  Yan Chai

IPC: H01L33/60 ,  H01L33/58 ,  H01L33/62 ,  H01L33/54

CPC classification number: H01L33/486 ,  H01L33/46 ,  H01L33/502 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00012

Abstract: A light source includes LED dies that are flip-chip mounted on a flexible plastic substrate. The LED dies are attached to the substrate using an asymmetric conductor material with deformable conducting particles sandwiched between surface mount contacts on the LED dies and traces on the substrate. A diffusively reflective material containing light scattering particles is used instead of expensive reflective cups to reflect light upwards that is emitted sideways from the LED dies. The diffusively reflective material is dispensed over the top surface of the substrate and contacts the side surfaces of the dies. The light scattering particles are spheres of titanium dioxide suspended in silicone. The light source is manufactured in a reel-to-reel process in which the asymmetric conductor material and the diffusively reflective material are cured simultaneously. A silicone layer of molded lenses including phosphor particles is also added over the mounted LED dies in the reel-to-reel process.

Abstract translation: 光源包括倒装芯片安装在柔性塑料基板上的LED管芯。 使用不对称导体材料将LED管芯附着到基板上，可变形导电颗粒夹在LED管芯上的表面安装触点和基板上的迹线之间。 使用包含光散射粒子的漫反射材料代替昂贵的反射杯来反射从LED芯片侧向发射的光。 扩散反射材料被分配在基板的顶表面上并与模具的侧表面接触。 光散射颗粒是悬浮在硅酮中的二氧化钛的球体。 光源以卷对卷方式制造，其中不对称导体材料和漫反射材料同时固化。 包括磷光体颗粒的模制透镜的硅氧烷层也在卷对盘工艺中被添加到所安装的LED模具上。

公开(公告)号：US09461023B2

公开(公告)日：2016-10-04

申请号：US13284835

申请日：2011-10-28

Applicant: R. Scott West

Inventor： R. Scott West

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/46

CPC classification number: H01L25/0753 ,  H01L33/46 ,  H01L33/502 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A layer of Highly Reflective (HR) material is deposited by jetting microdots of the HR material in liquid form onto a substrate and then allowing the HR material to harden. In one example, the HR layer is the HR layer of a white LED assembly. The HR layer is jetted onto the substrate around LED dice of the assembly after die attach and wire bonding have been completed. The HR material can be made to flow laterally so that areas of the substrate under wire bonds are coated with HR material, so that HR material contacts side edges of the LED dice, and so that HR material contacts the inside side edge of a retaining ring. By jetting the HR material in this way, the amount of substrate that is not covered with HR material is reduced, thereby improving the light efficiency of the resulting LED assembly.

Abstract translation: 通过将液体形式的HR材料的微粒喷射到基底上，然后使HR材料硬化来沉积一层高反射（HR）材料。 在一个示例中，HR层是白色LED组件的HR层。 在芯片附着和引线接合完成之后，将HR层喷射到组件的LED芯片周围的基板上。 可以使HR材料横向流动，使得在线接合处的基底区域涂覆有HR材料，使得HR材料接触LED骰子的侧边缘，并且使得HR材料接触保持环的内侧边缘 。 通过以这种方式喷射HR材料，减少了不被HR材料覆盖的基板的量，从而提高了所得LED组件的光效率。

公开(公告)号：US08652860B2

公开(公告)日：2014-02-18

申请号：US13441903

申请日：2012-04-08

Applicant: R. Scott West ,  Tao Tong ,  Mike Kwon ,  Michael Solomensky

Inventor： R. Scott West ,  Tao Tong ,  Mike Kwon ,  Michael Solomensky

IPC: H01L21/00

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2924/07811 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass between the top and bottom surfaces of the substrate upon which LED dies are mounted. Microdots of highly reflective material are jetted onto the top surface. Landing pads on the top surface of the substrate are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors in the interconnect structure are electrically coupled to the LED dies in the photon building blocks through the contact pads and landing pads. Compression molding is used to form lenses over the LED dies and leaves a flash layer of silicone covering the landing pads. The flash layer laterally above the landing pads is removed by blasting particles at the flash layer.

Abstract translation: 标准化的光子构建块被封装在模制的互连结构中以形成各种LED阵列产品。 没有电导体穿过安装有LED管芯的基板的顶表面和底表面之间。 高反射材料的微点喷射到顶面上。 衬底顶表面上的着陆垫连接到布置在互连结构的唇缘下侧的接触垫。 在焊料回流工艺中，光子构建块在互连结构内自对准。 互连结构中的导体通过接触焊盘和着陆焊盘电耦合到光子构建块中的LED管芯。 压缩成型用于在LED管芯上形成透镜，并留下覆盖着色焊盘的硅胶闪光层。 通过在闪光层处的喷砂颗粒去除着陆垫上方的闪光层。

公开(公告)号：US07048412B2

公开(公告)日：2006-05-23

申请号：US10166853

申请日：2002-06-10

Applicant: Paul S. Martin ,  R. Scott West ,  Daniel A. Steigerwald

Inventor： Paul S. Martin ,  R. Scott West ,  Daniel A. Steigerwald

IPC: F21V7/00

CPC classification number: F21V29/51 ,  F21K9/68 ,  F21S41/147 ,  F21S41/335 ,  F21S45/47 ,  F21V7/09 ,  F21V29/77 ,  F21Y2101/00 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: A lamp has LED sources that are placed about a lamp axis in an axial arrangement. The lamp includes a post with post facets where the LED sources are mounted. The lamp includes a segmented reflector for guiding light from the LED sources. The segmented reflector includes reflective segments each of which is illuminated primarily by light from one of the post facets (e.g., one of the LED sources on the post facet). The LED sources may be made up of one or more LED dies. The LED dies may include optic-on-chip lenses to direct the light from each post facet to a corresponding reflective segment. The LED dies may be of different sizes and colors chosen to generate a particular far-field pattern.

公开(公告)号：US07009213B2

公开(公告)日：2006-03-07

申请号：US10633054

申请日：2003-07-31

Applicant: Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

Inventor： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

IPC: H01L33/00

CPC classification number: H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

Abstract translation: 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。

公开(公告)号：US20130105837A1

公开(公告)日：2013-05-02

申请号：US13284835

申请日：2011-10-28

Applicant: R. Scott West

Inventor： R. Scott West

IPC: H01L33/60

CPC classification number: H01L25/0753 ,  H01L33/46 ,  H01L33/502 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A layer of Highly Reflective (HR) material is deposited by jetting microdots of the HR material in liquid form onto a substrate and then allowing the HR material to harden. In one example, the HR layer is the HR layer of a white LED assembly. The HR layer is jetted onto the substrate around LED dice of the assembly after die attach and wire bonding have been completed. The HR material can be made to flow laterally so that areas of the substrate under wire bonds are coated with HR material, so that HR material contacts side edges of the LED dice, and so that HR material contacts the inside side edge of a retaining ring. By jetting the HR material in this way, the amount of substrate that is not covered with HR material is reduced, thereby improving the light efficiency of the resulting LED assembly.

Abstract translation: 通过将液体形式的HR材料的微粒喷射到基底上，然后使HR材料硬化来沉积一层高反射（HR）材料。 在一个示例中，HR层是白色LED组件的HR层。 在芯片附着和引线接合完成之后，将HR层喷射到组件的LED芯片周围的基板上。 可以使HR材料横向流动，使得在线接合处的基底区域涂覆有HR材料，使得HR材料接触LED骰子的侧边缘，并且使得HR材料接触保持环的内侧边缘 。 通过以这种方式喷射HR材料，减少了不被HR材料覆盖的基板的量，从而提高了所得LED组件的光效率。

公开(公告)号：US07276737B2

公开(公告)日：2007-10-02

申请号：US11328964

申请日：2006-01-09

Applicant: Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

Inventor： Michael D. Camras ,  Gerard Harbers ,  William R. Imler ,  Matthijs H. Keuper ,  Paul S. Martin ,  Douglas W. Pocius ,  Frank M. Steranka ,  Helena Ticha ,  Ladislav Tichy ,  R. Scott West

IPC: H01L33/00

CPC classification number: H01L33/58 ,  H01L33/44 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.

Abstract translation: 一种器件包括结合到光学元件的发光半导体器件。 在一些实施例中，光学元件可以是细长的或成形的，以在与半导体发光器件和光学元件的中心轴线基本垂直的方向上引导由有源区域发射的光的一部分。 在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。 光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。 在一些实施方案中，该键基本上不含有机基粘合剂。

公开(公告)号：US08536605B2

公开(公告)日：2013-09-17

申请号：US13304769

申请日：2011-11-28

Applicant: R. Scott West ,  Tao Tong ,  Mike Kwon

Inventor： R. Scott West ,  Tao Tong ,  Mike Kwon

IPC: H01L33/58 ,  B24C1/08

CPC classification number: H01L33/56 ,  B24C1/003 ,  B24C1/04 ,  B24C3/322 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.

Abstract translation: 使用压缩成型在金属芯印刷电路板上的LED阵列上形成透镜，留下覆盖接触焊盘的硅胶闪光层，这些接触焊盘将阵列连接到电源。 去除闪蒸层的方法包括在闪蒸层处喷射碳酸氢钠颗粒。 喷嘴位于闪光层顶表面三十毫米内。 从喷嘴出来的空气流以垂直于顶表面的五至三十度之间的角度指向顶表面。 将碳酸氢钠颗粒加入到空气流中，然后碰撞到硅氧烷闪蒸层的顶表面，直到去除接触垫横向上方的闪蒸层。 清洁的接触垫周围的硅树脂的边缘其后含有痕量的碳酸氢钠。

公开(公告)号：US20130134459A1

公开(公告)日：2013-05-30

申请号：US13304769

申请日：2011-11-28

Applicant: R. Scott West ,  Tao Tong ,  Mike Kwon

Inventor： R. Scott West ,  Tao Tong ,  Mike Kwon

IPC: H01L33/58 ,  B24C1/08

CPC classification number: H01L33/56 ,  B24C1/003 ,  B24C1/04 ,  B24C3/322 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Using compression molding to form lenses over LED arrays on a metal core printed circuit board leaves a flash layer of silicone covering the contact pads that are later required to connect the arrays to power. A method for removing the flash layer involves blasting particles of sodium bicarbonate at the flash layer. A nozzle is positioned within thirty millimeters of the top surface of the flash layer. The stream of air that exits from the nozzle is directed towards the top surface at an angle between five and thirty degrees away from normal to the top surface. The particles of sodium bicarbonate are added to the stream of air and then collide into the top surface of the silicone flash layer until the flash layer laterally above the contact pads is removed. The edge of silicone around the cleaned contact pad thereafter contains a trace amount of sodium bicarbonate.

Abstract translation: 使用压缩成型在金属芯印刷电路板上的LED阵列上形成透镜，留下覆盖接触焊盘的硅胶闪光层，这些接触焊盘将阵列连接到电源。 去除闪蒸层的方法包括在闪蒸层处喷射碳酸氢钠颗粒。 喷嘴位于闪光层顶表面三十毫米内。 从喷嘴出来的空气流以垂直于顶表面的五至三十度之间的角度指向顶表面。 将碳酸氢钠颗粒加入到空气流中，然后碰撞到硅氧烷闪蒸层的顶表面，直到去除接触垫横向上方的闪蒸层。 清洁的接触垫周围的硅树脂的边缘其后含有痕量的碳酸氢钠。

公开(公告)号：US20120175643A1

公开(公告)日：2012-07-12

申请号：US12987148

申请日：2011-01-09

Applicant: R. SCOTT WEST

Inventor： R. SCOTT WEST

IPC: H01L33/62 ,  H01L21/60 ,  H01L33/00 ,  H01L33/08

CPC classification number: H01L33/62 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/644 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83447 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0066 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10409 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Standardized photon building blocks are used to make both discrete light emitters as well as array products. Each photon building block has one or more LED chips mounted on a substrate. No electrical conductors pass between the top and bottom surfaces of the substrate. The photon building blocks are supported by an interconnect structure that is attached to a heat sink. Landing pads on the top surface of the substrate of each photon building block are attached to contact pads disposed on the underside of a lip of the interconnect structure. In a solder reflow process, the photon building blocks self-align within the interconnect structure. Conductors on the interconnect structure are electrically coupled to the LED dice in the photon building blocks through the contact pads and landing pads. The bottom surface of the interconnect structure is coplanar with the bottom surfaces of the substrates of the photon building blocks.

Abstract translation: 标准化的光子构建块用于制造分立的发光体以及阵列产品。 每个光子构建块具有安装在基板上的一个或多个LED芯片。 没有电导体通过衬底的顶表面和底表面之间。 光子构建块由连接到散热器的互连结构支撑。 每个光子构建块的衬底的顶表面上的着陆焊盘附接到布置在互连结构的唇缘的下侧上的接触焊盘。 在焊料回流工艺中，光子构建块在互连结构内自对准。 互连结构上的导体通过接触焊盘和着陆焊盘电耦合到光子构建块中的LED管芯。 互连结构的底表面与光子积木的基底的底表面共面。