公开(公告)号：US20110017803A1

公开(公告)日：2011-01-27

申请号：US12844170

申请日：2010-07-27

Applicant: Karsten Guth ,  Alfred Kemper ,  Roland Speckels

Inventor： Karsten Guth ,  Alfred Kemper ,  Roland Speckels

IPC: B23K37/04

CPC classification number: B23K1/0016 ,  B23K2101/36 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  Y10T428/12493 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber, wherein the component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between a current position of the component and a current position of the substrate, for placing and pressing the component on the substrate, and the combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of a lower side of the component to be connected and a pressing direction of the component, the angle corresponding to an angle between the normal of a surface area of the substrate to be connected and the pressing direction of the component.

Abstract translation: 一种用于在封闭的抽真空室中通过扩散焊接将部件与基板连接的装置，其中待连接的部件和基板可在腔室中彼此分离，并且该腔室包括组合传送和压制单元， 在组件的当前位置和基板的当前位置之间可移位，用于将部件放置和按压在基板上，组合的转移和加压单元包括可旋转元件，其响应于部件的放置和按压 在基板上呈现要连接的部件的下侧的法线与部件的按压方向之间的角度，该角度对应于要连接的基板的表面区域的法线与压接件之间的角度 组件的方向。

公开(公告)号：US08736052B2

公开(公告)日：2014-05-27

申请号：US13214379

申请日：2011-08-22

Applicant: Niels Oeschler ,  Kirill Trunov ,  Roland Speckels

Inventor： Niels Oeschler ,  Kirill Trunov ,  Roland Speckels

IPC: H01L29/40

CPC classification number: H01L23/3735 ,  H01L23/04 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/072 ,  H01L2224/27505 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32503 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83539 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/12043 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor device includes a substrate and a first sintered silver layer on the substrate. The semiconductor device includes a first semiconductor chip and a first diffusion soldered layer coupling the first semiconductor chip to the first sintered silver layer.

Abstract translation: 半导体器件包括衬底和在衬底上的第一烧结银层。 半导体器件包括第一半导体芯片和将第一半导体芯片耦合到第一烧结银层的第一扩散焊接层。

公开(公告)号：US20100078463A1

公开(公告)日：2010-04-01

申请号：US12567434

申请日：2009-09-25

Applicant: Roland SPECKELS ,  Thomas Licht ,  Karsten Guth

Inventor： Roland SPECKELS ,  Thomas Licht ,  Karsten Guth

IPC: B23K31/00

CPC classification number: H01L21/67092 ,  H01L21/6835 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/93 ,  H01L25/072 ,  H01L25/50 ,  H01L2221/68354 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/78743 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15787 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01028

Abstract: A device and a method for making a semiconductor device including bonding a first bonding partner to a second bonding partner. The device comprises a lower tool and an upper tool, the upper tool including a plunger having a bottom side facing the lower tool at which bottom side a vacuum is creatable, so that the first bonding partner can be picked up by vacuum from the upper tool and positioned on the second bonding partner.

Abstract translation: 一种用于制造半导体器件的器件和方法，包括将第一结合伙伴接合到第二接合伙伴。 所述装置包括下部工具和上部工具，所述上部工具包括柱塞，所述柱塞具有面向所述下部工具的底侧，在所述下部工具的下侧可创建真空，从而可以从所述上部工具通过真空拾取所述第一焊接对象 并且位于第二粘合伙伴上。

公开(公告)号：US08209858B2

公开(公告)日：2012-07-03

申请号：US11627719

申请日：2007-01-26

Applicant: Roland Speckels ,  Karsten Guth

Inventor： Roland Speckels ,  Karsten Guth

IPC: H05K13/04

CPC classification number: H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75314 ,  H01L2224/758 ,  H01L2224/81005 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/1305 ,  H01L2924/13055 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00

Abstract: An arrangement for mounting a multiplicity of components (9, 10), particularly with irregular surface topography, on a support (7) using an assembly tool which has a tool substructure (5) and a tool superstructure (6), where the tool substructure (5) is designed to receive the support and the components which are to be mounted thereon, and the tool superstructure (6) has, in addition to an arrangement (11, 12) for transmitting assembly forces, an arrangement for compensating for tilts between the components and the support and/or an arrangement for compensating for irregular surface topologies.

Abstract translation: 一种用于使用具有工具子结构（5）和工具上部结构（6）的组装工具将多个部件（9,10）特别是具有不规则表面形貌的部件安装在支撑件（7）上的装置，其中所述工具子结构 （5）被设计成接收支撑件和要安装在其上的部件，并且除了用于传递组装力的装置（11,12）之外，工具上部结构（6）还具有用于补偿 部件和支撑件和/或用于补偿不规则表面拓扑结构的装置。

公开(公告)号：US08104667B2

公开(公告)日：2012-01-31

申请号：US12844170

申请日：2010-07-27

Applicant: Karsten Guth ,  Aldred Kemper ,  Roland Speckels

Inventor： Karsten Guth ,  Aldred Kemper ,  Roland Speckels

IPC: B23K20/00

CPC classification number: B23K1/0016 ,  B23K2101/36 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  Y10T428/12493 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber, wherein the component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between a current position of the component and a current position of the substrate, for placing and pressing the component on the substrate, and the combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of a lower side of the component to be connected and a pressing direction of the component, the angle corresponding to an angle between the normal of a surface area of the substrate to be connected and the pressing direction of the component.

Abstract translation: 一种用于在封闭的抽真空室中通过扩散焊接将部件与基板连接的装置，其中待连接的部件和基板可在腔室中彼此分离，并且该腔室包括组合传送和压制单元， 在组件的当前位置和基板的当前位置之间可移位，用于将部件放置和按压在基板上，组合的转移和加压单元包括可旋转元件，其响应于部件的放置和按压 在基板上呈现要连接的部件的下侧的法线与部件的按压方向之间的角度，该角度对应于要连接的基板的表面区域的法线与压接件之间的角度 组件的方向。

公开(公告)号：US20080230589A1

公开(公告)日：2008-09-25

申请号：US11688039

申请日：2007-03-19

Applicant: Karsten Guth ,  Alfred Kemper ,  Roland Speckels

Inventor： Karsten Guth ,  Alfred Kemper ,  Roland Speckels

IPC: B23K20/00

CPC classification number: B23K1/0016 ,  B23K2101/36 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  Y10T428/12493 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber is disclosed. The component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between the current position of the component and the current position of the substrate, for placing and pressing the component on the substrate. The combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of the lower side of the component to be connected and the pressing direction of the component, the angle corresponding to the angle between the normal of the substrate surface area to be connected and the pressing direction of the component.

Abstract translation: 公开了一种用于通过扩散焊接将组件与衬底连接在封闭的真空室中的装置。 待连接的部件和基板可以在腔室中彼此分开移位，并且腔室包括组合的传送和压制单元，其可以在部件的当前位置和基板的当前位置之间移动，以便放置和按压 基底上的成分。 组合传送和按压单元包括可旋转元件，该可旋转元件响应于元件在基板上的放置和挤压而呈现在待连接部件的下侧法线与部件的按压方向之间的角度 对应于要连接的基板表面区域的法线与部件的按压方向之间的角度的角度。

公开(公告)号：US08835299B2

公开(公告)日：2014-09-16

申请号：US13597311

申请日：2012-08-29

Applicant: Roland Speckels ,  Lars Böwer ,  Nicolas Heuck ,  Niels Oeschler

Inventor： Roland Speckels ,  Lars Böwer ,  Nicolas Heuck ,  Niels Oeschler

IPC: H01L21/30 ,  H01L21/46 ,  H01L23/00

CPC classification number: H01L24/83 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/27332 ,  H01L2224/275 ,  H01L2224/29006 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/8384 ,  H01L2224/83986 ,  H01L2224/9205 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/83203 ,  H01L2924/00014

Abstract: A sintered connection is formed by pressing a semiconductor die against a substrate with a dried sintering material interposed between the substrate and the semiconductor die, the dried sintering material having sintering particles and a solvent. The substrate is heated to a temperature below a sintering temperature of the dried sintering material while the semiconductor die is pressed against the substrate to form local sinter connections between adjacent ones of the sintering particles. The local sinter connections collectively provide a stable joint that fixes the semiconductor die to the substrate prior to sintering. A sintered connection is then formed between the semiconductor die and the substrate from the dried sintering material, after the stable joint is formed.

Abstract translation: 的烧结连接通过压在衬底上的半导体管芯与所述衬底和所述半导体管芯，所述具有干烧结料烧结颗粒和溶剂之间的干烧结材料形成。 而在半导体管芯被压在基材上以形成烧结颗粒的相邻者之间局部烧结连接基板被加热至低于干烧结材料的烧结温度的温度。 局部烧结连接集中提供稳定的接头，在烧结之前将半导体管芯固定到衬底上。 的烧结连接随后的半导体管芯和从干燥的烧结材料的衬底之间形成，在形成稳定的接合之后。

公开(公告)号：US20140061909A1

公开(公告)日：2014-03-06

申请号：US13597311

申请日：2012-08-29

Applicant: Roland Speckels ,  Lars Böwer ,  Nicolas Heuck ,  Niels Oeschler

Inventor： Roland Speckels ,  Lars Böwer ,  Nicolas Heuck ,  Niels Oeschler

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/27332 ,  H01L2224/275 ,  H01L2224/29006 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/8384 ,  H01L2224/83986 ,  H01L2224/9205 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/83203 ,  H01L2924/00014

Abstract: A sintered connection is formed by pressing a semiconductor die against a substrate with a dried sintering material interposed between the substrate and the semiconductor die, the dried sintering material having sintering particles and a solvent. The substrate is heated to a temperature below a sintering temperature of the dried sintering material while the semiconductor die is pressed against the substrate to form local sinter connections between adjacent ones of the sintering particles. The local sinter connections collectively provide a stable joint that fixes the semiconductor die to the substrate prior to sintering. A sintered connection is then formed between the semiconductor die and the substrate from the dried sintering material, after the stable joint is formed.

Abstract translation: 通过将干燥的烧结材料插入在基板和半导体管芯之间，干燥的烧结材料具有烧结颗粒和溶剂，将半导体管芯压靠在基板上来形成烧结连接。 将衬底加热到​​低于干燥烧结材料的烧结温度的温度，同时半导体管芯被压靠在衬底上，以在相邻的烧结颗粒之间形成局部烧结连接。 局部烧结连接集中提供稳定的接头，在烧结之前将半导体管芯固定到衬底上。 在形成稳定的接头之后，从干燥的烧结材料形成半导体管芯和基板之间的烧结连接。

公开(公告)号：US20130049204A1

公开(公告)日：2013-02-28

申请号：US13214379

申请日：2011-08-22

Applicant: Niels Oeschler ,  Kirill Trunov ,  Roland Speckels

Inventor： Niels Oeschler ,  Kirill Trunov ,  Roland Speckels

IPC: H01L23/498 ,  B23K31/02 ,  B23K1/20

CPC classification number: H01L23/3735 ,  H01L23/04 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/072 ,  H01L2224/27505 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32503 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83539 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/12043 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A semiconductor device includes a substrate and a first sintered silver layer on the substrate. The semiconductor device includes a first semiconductor chip and a first diffusion soldered layer coupling the first semiconductor chip to the first sintered silver layer.

Abstract translation: 半导体器件包括衬底和在衬底上的第一烧结银层。 半导体器件包括第一半导体芯片和将第一半导体芯片耦合到第一烧结银层的第一扩散焊接层。

公开(公告)号：US07851334B2

公开(公告)日：2010-12-14

申请号：US11780779

申请日：2007-07-20

Applicant: Roland Speckels ,  Karsten Guth ,  Hans Hartung

Inventor： Roland Speckels ,  Karsten Guth ,  Hans Hartung

IPC: H01L21/00

CPC classification number: H01L24/83 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/97 ,  H01L2221/68354 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83005 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2224/83 ,  H01L2924/00

Abstract: An apparatus and method for producing semiconductor modules is disclosed. One embodiment provides for bonding at least one semiconductor die onto a carrier including a support film strip, the support film having applied an adhesive layer to one of its surfaces to attach the semiconductor die, and a pressure tool to press the semiconductor die and the support film strip onto the carrier to permanently contact the at least one semiconductor die to the carrier.

Abstract translation: 公开了一种用于制造半导体模块的装置和方法。 一个实施例提供了将至少一个半导体管芯粘合到包括支撑膜条的载体上，该支撑膜已将粘合剂层施加到其表面之一以附接半导体管芯，以及压力工具以将半导体管芯和支撑件 薄膜条带到载体上以使至少一个半导体管芯永久地接触载体。