公开(公告)号：US20160286662A1

公开(公告)日：2016-09-29

申请号：US15033567

申请日：2014-10-31

Applicant: PPG INDUSTRIES OHIO, INC. ,  SI-CAL TECHNOLOGIES, INC., A NISSHA COMPANY

Inventor： Jaye Tyler ,  Paul F. Cheetham ,  Darren Burn ,  Gregory J. McCollum

IPC: H05K3/20 ,  H05K3/38 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K3/207 ,  B32B7/06 ,  B32B37/025 ,  B32B38/10 ,  B32B2037/268 ,  B44C1/24 ,  B44C3/02 ,  H01L21/6835 ,  H05K1/095 ,  H05K1/16 ,  H05K3/0017 ,  H05K3/007 ,  H05K3/38 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/09018 ,  H05K2201/0999 ,  H05K2203/0156 ,  H05K2203/1545

Abstract: Methods of transferring an electrically conductive material to a substrate are disclosed. The methods include: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200° F. to 450° F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material adheres to the substrate. Methods of forming a layered structure are also disclosed.

Abstract translation: 公开了将导电材料转移到基底的方法。 所述方法包括：a）使至少一部分基底与布置在载体膜上的导电材料接触; 和b）在200-400°F的温度和30至150psi的压力范围内，将热和压力施加到衬底和载体膜上1至40秒的时间段 ，使得导电材料粘附到基底。 还公开了形成层状结构的方法。