公开(公告)号：US20220239086A1

公开(公告)日：2022-07-28

申请号：US17597039

申请日：2020-06-12

Applicant: SUNCALL CORPORATION

Inventor： Shota TATSUMI

IPC: H02G5/00

Abstract: A busbar assembly of the present invention includes a plurality of busbars disposed in parallel in a common plane with a gap between adjacent busbars, and an insulative resin layer including a gap filling part and a first surface-side laminate part, the first surface-side laminate part having a plurality of first surface-side center openings that expose predetermined parts of first surfaces of the plurality of busbars respectively to form a plurality of exposure regions, the insulative resin layer being formed by an insulative resin material that is transparent in a half-cured state and nontransparent in a completely cured state.

公开(公告)号：US20250007266A1

公开(公告)日：2025-01-02

申请号：US18884824

申请日：2024-09-13

Applicant: SUNCALL CORPORATION

Inventor： Shota TATSUMI

IPC: H02G5/00

Abstract: A busbar assembly of the present invention includes a plurality of busbars disposed in parallel in a common plane with a gap between adjacent busbars, and an insulative resin layer including a gap filling part and a first surface-side laminate part, the first surface-side laminate part having a plurality of first surface-side center openings that expose predetermined parts of first surfaces of the plurality of busbars respectively to form a plurality of exposure regions, the insulative resin layer being formed by an insulative resin material that is transparent in a half-cured state and nontransparent in a completely cured state.

公开(公告)号：US20230378736A1

公开(公告)日：2023-11-23

申请号：US18031324

申请日：2021-09-24

Applicant: Suncall Corporation

Inventor： Shota TATSUMI ,  Yuusuke ADACHI

IPC: H02G5/00

CPC classification number: H02G5/005 ,  H02G5/007

Abstract: According to a manufacturing method of the present invention, it is possible to manufacture a busbar assembly in an efficient manner, the busbar assembly including busbars disposed in parallel in a common plane and an insulative resin layer including a gap filling portion filled into a gap between the adjacent busbars and a bottom-surface-side laminated portion extending integrally from the gap filling portion and arranged on bottom surfaces of the busbars, a top surface of the busbar being at least partially exposed to form a top-surface-side connection portion, the bottom surface of the busbar including a first bottom surface region which is located at the same position in a thickness direction as a lower end portion of the gap and on which the bottom-surface-side laminated portion is arranged and a second bottom surface region located farther away from the top surface than the first bottom surface region and exposed to the outside to form a bottom-surface-side connection portion.