公开(公告)号：US20100180934A1

公开(公告)日：2010-07-22

申请号：US12687142

申请日：2010-01-14

Applicant: Takashi Naito ,  Shinichi Tachizono ,  Kei Yoshimura ,  Yuji Hashiba ,  Keiichi Kanazawa ,  Shinji Yamada ,  Satoru Amou ,  Hiroki Yamamoto ,  Takuya Aoyagi

Inventor： Takashi Naito ,  Shinichi Tachizono ,  Kei Yoshimura ,  Yuji Hashiba ,  Keiichi Kanazawa ,  Shinji Yamada ,  Satoru Amou ,  Hiroki Yamamoto ,  Takuya Aoyagi

IPC: H01L31/0224 ,  C03C3/21 ,  C03C8/00 ,  C03C14/00 ,  H01B1/02 ,  H01B5/14

CPC classification number: C03C8/08 ,  C03C3/21 ,  C03C8/24 ,  H01L31/022425 ,  Y02E10/50

Abstract: A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.

Abstract translation: 低软化点玻璃组合物，其基本上不含铅，铋和锑，并且包含钒，磷，碲和铁的氧化物，组合物的软化点为380℃或更低。

公开(公告)号：US5071824A

公开(公告)日：1991-12-10

申请号：US406536

申请日：1989-09-13

Applicant: Shuichi Ohara ,  Satoru Amou ,  Shinichi Akasaka

Inventor： Shuichi Ohara ,  Satoru Amou ,  Shinichi Akasaka

IPC: B41M5/385 ,  B41M5/035 ,  B41M5/26 ,  B41M5/30 ,  B41M5/388 ,  B41M5/39 ,  D06P5/00

CPC classification number: B41M5/385 ,  B41M5/3854 ,  B41M5/388 ,  Y10S428/913 ,  Y10S428/914

Abstract: A heat transfer sheet which has a high recording sensitivity and can form image of high maximum reflection density and of high contrast is provided by containing in an ink layer of the heat transfer sheet at least one dye which has a product of an extinction coefficient (l.cm.sup.-1.g.sup.-1) and an evaporation or sublimation rate at 240.degree. C. (wt %.min..sup.-1) of at least 1.8.times.10.sup.2 (l.wt %.cm.sup.-1.g.sup.-1.min.sup.-1).

Abstract translation: 通过在传热片的油墨层中含有至少一种具有消光系数（l）的产物的染料，提供具有高记录灵敏度并且可以形成高最大反射浓度和高对比度的图像的传热片 .cm-1.g-1），并且在240℃（wt％.min.-1）下的蒸发或升华速率为至少1.8×102（重量％.cm-1.g-1.min- 1）。

公开(公告)号：US08470723B2

公开(公告)日：2013-06-25

申请号：US12687142

申请日：2010-01-14

Applicant: Takashi Naito ,  Shinichi Tachizono ,  Kei Yoshimura ,  Yuji Hashiba ,  Keiichi Kanazawa ,  Shinji Yamada ,  Satoru Amou ,  Hiroki Yamamoto ,  Takuya Aoyagi

Inventor： Takashi Naito ,  Shinichi Tachizono ,  Kei Yoshimura ,  Yuji Hashiba ,  Keiichi Kanazawa ,  Shinji Yamada ,  Satoru Amou ,  Hiroki Yamamoto ,  Takuya Aoyagi

IPC: C03C8/08 ,  C03C3/21 ,  C03C8/14 ,  C03C3/18 ,  C03C8/16 ,  B32B17/06

CPC classification number: C03C8/08 ,  C03C3/21 ,  C03C8/24 ,  H01L31/022425 ,  Y02E10/50

Abstract: A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.

Abstract translation: 低软化点玻璃组合物，其基本上不含铅，铋和锑，并且包含钒，磷，碲和铁的氧化物，组合物的软化点为380℃或更低。

公开(公告)号：US08227361B2

公开(公告)日：2012-07-24

申请号：US12453029

申请日：2009-04-28

Applicant: Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

Inventor： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC: B32B17/02 ,  B32B27/04

CPC classification number: H05K1/0366 ,  C08J5/24 ,  H05K1/024 ,  H05K2201/012 ,  H05K2201/029 ,  Y10T442/2418 ,  Y10T442/2992

Abstract: It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer.

Abstract translation: 本发明的目的是提供一种降低介电损耗角正切，重量，厚度和成本的高频能力的印刷线路板材料，而不会影响可加工性，并提供使用其的电子部件。 本发明提供一种通过使用由低密度石英玻璃纤维构成的石英玻璃布作为基材并用具有低介电损耗角正切的热固性树脂组合物浸渍布而获得的预浸料，并且使用 预浸料作为绝缘层。

公开(公告)号：US08115105B2

公开(公告)日：2012-02-14

申请号：US12353357

申请日：2009-01-14

Applicant: Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

Inventor： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC: H05K1/00

CPC classification number: H05K1/0366 ,  B32B3/08 ,  B32B3/18 ,  B32B5/022 ,  B32B5/024 ,  B32B15/02 ,  B32B15/14 ,  B32B15/20 ,  B32B17/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0253 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/00 ,  B32B2457/04 ,  B32B2457/08 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T442/2475

Abstract: A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100° C. is 50 ppm/° C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed.

Abstract translation: 包含作为布的主要部分的由玻璃纤维和聚烯烃纤维组成的复合织布或无纺布的预浸料，以及提供具有低热膨胀系数的固化产物的热固性树脂组合物，其中， 在50〜100℃下的固化树脂组合物为50ppm /℃以下。 公开了印刷电路板，多层电路板和电子部件。

公开(公告)号：US20110088933A1

公开(公告)日：2011-04-21

申请号：US12907116

申请日：2010-10-19

Applicant: Satoru AMOU ,  Hikaru Kagiwada ,  Dai Hori

Inventor： Satoru AMOU ,  Hikaru Kagiwada ,  Dai Hori

IPC: H05K1/09 ,  B32B5/02 ,  B32B15/08

CPC classification number: H05K3/389 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2203/0315 ,  Y10T428/12438 ,  Y10T428/12444 ,  Y10T428/12472

Abstract: A wiring board comprising a copper wiring, and an insulating layer which is a cured product of a resin composition containing a compound having a carbon-carbon unsaturated double bond as a cross-linking component, the wiring board having a surface-treated layer formed on one or both sides of the copper wiring, and the surface-treated layer having a metal layer (A) containing at least one metallic component selected from the group consisting of tin, zinc, nickel, chromium, cobalt and aluminium, an oxide and/or hydroxide layer (B) of the metallic component on the metal layer (A), an amino-silane coupling agent layer (C) having an amino group in its structure on the oxide and/or hydroxide layer (B), and a vinyl-silane coupling agent layer (D) having a carbon-carbon unsaturated double bond on the amino-silane coupling agent layer (C).

Abstract translation: 包括铜布线的布线板和作为交联成分含有碳 - 碳不饱和双键的化合物的树脂组合物的固化物的绝缘层，所述布线基板上形成有表面处理层 并且所述表面处理层具有含有选自锡，锌，镍，铬，钴和铝中的至少一种金属成分的金属层（A），氧化物和/ 或氢氧化物层（B），金属层（A）上的金属组分的氢氧化物层（B），在氧化物和/或氢氧化物层（B）上具有氨基的氨基 - 硅烷偶联剂层（C） 在氨基硅烷偶联剂层（C）上具有碳 - 碳不饱和双键的硅烷偶联剂层（D）。

公开(公告)号：US20080261472A1

公开(公告)日：2008-10-23

申请号：US12105328

申请日：2008-04-18

Applicant: Satoru AMOU ,  Hiroshi Shimizu ,  Akinori Hanawa

Inventor： Satoru AMOU ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC: B32B27/04 ,  B32B5/02 ,  D03D25/00

CPC classification number: D03D15/0011 ,  B32B15/08 ,  B32B27/04 ,  C08J5/24 ,  C08J2353/02 ,  D03D1/0082 ,  D03D15/00 ,  D03D15/0027 ,  D10B2101/06 ,  D10B2321/02 ,  D10B2321/021 ,  D10B2321/022 ,  D10B2401/041 ,  D10B2401/063 ,  D10B2505/02 ,  H05K1/0366 ,  H05K3/4626 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T442/2475 ,  Y10T442/30

Abstract: A prepreg is thermosettable. The prepreg comprises a thermosetting resin composition A, a cured resin of the thermosetting resin composition exhibiting a dielectric tangent of 0.005 or less under 1 Hz or more, and a substrate B into which the resin A is impregnated, wherein the substrate B comprises polyolefin fiber C and a fiber D, which has a tensile strength higher than that of the polyolefin fiber C and a thermal expansion coefficient smaller than that of the fiber C, and wherein the substrate is a woven cloth and has a solubility rate into a hydrocarbon organic solvent is less than 5 wt %.

Abstract translation: 预浸料是热固性的。 预浸料坯包含热固性树脂组合物A，热固性树脂组合物的固化树脂在1Hz以上表现出0.005以下的介电切线和浸渍有树脂A的基材B，其中，基材B含有聚烯烃纤维 C和纤维D，其拉伸强度高于聚烯烃纤维C的拉伸强度，并且热膨胀系数小于纤维C的热膨胀系数，并且其中基材是织布并且具有溶解速率进入烃有机溶剂 小于5重量％。

公开(公告)号：US20070077413A1

公开(公告)日：2007-04-05

申请号：US11529661

申请日：2006-09-29

Applicant: Satoru Amou ,  Haruo Akahoshi ,  Yoshihiro Nakamura ,  Nobuyuki Minami ,  Yasuhiro Murai

Inventor： Satoru Amou ,  Haruo Akahoshi ,  Yoshihiro Nakamura ,  Nobuyuki Minami ,  Yasuhiro Murai

IPC: B32B5/16 ,  C08K5/34

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B15/14 ,  B32B15/20 ,  B32B2255/02 ,  B32B2262/02 ,  B32B2262/10 ,  B32B2307/3065 ,  C08J5/24 ,  C08J2371/12 ,  C08K3/36 ,  C08K5/0066 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/259

Abstract: There is provided a varnish of a low dielectric loss tangent resin composition which is low in viscosity and excellent in storage stability. The varnish of a low dielectric loss tangent resin composition contains a thermosetting monomer (A) having a weight average molecular weight of not more than 1,000, a high polymer (B) having a weight average molecular weight of not less than 5,000, a halogen flame-retardant agent (C), a silicon dioxide filler (D), and an organic solvent (E). The average particle diameter of each the components (C) and (D) is in the range of 0.2 to 3 μm.

Abstract translation: 提供了一种低介电损耗角正切树脂组合物的清漆，其粘度低，储存稳定性优异。 低介电损耗角正切树脂组合物的清漆含有重均分子量不大于1000的热固性单体（A），重均分子量不小于5,000的高聚物（B），卤素火焰 缓冲剂（C），二氧化硅填料（D）和有机溶剂（E）。 各成分（C）和（D）的平均粒径为0.2〜3μm的范围。

公开(公告)号：US07112627B2

公开(公告)日：2006-09-26

申请号：US10385720

申请日：2003-03-12

Applicant: Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Akira Nagai ,  Masatoshi Sugimasa

Inventor： Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Akira Nagai ,  Masatoshi Sugimasa

IPC: C08L9/00

CPC classification number: H05K1/032 ,  Y10T428/31721 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T442/2861 ,  Y10T442/3854 ,  Y10T442/3862 ,  Y10T442/3886 ,  Y10T442/3902 ,  Y10T442/3911 ,  Y10T442/678

Abstract: A curing low dielectric loss tangent film using a low dielectric loss tangent composition containing a polyfunctional styrene compound having excellent dielectric characteristics, and a wiring film using the same as an insulating layer are provided. The low dielectric loss tangent film contains a high molecular weight material and a crosslinking ingredient with a weight average molecular weight of 1000 or less having a plurality of styrene groups shown by the following general formula: (where R represents a hydrocarbon skeleton, R1, which may be identical or different with each other, represents a hydrogen atom or a hydrocarbon group of 1 to 20 carbon atoms, R2, R3 and R4, which may be identical or different with each other, each represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, m represents an integer of 1 to 4, and n represents an integer of 2 or greater).

Abstract translation: 提供了使用包含具有优异介电特性的多官能苯乙烯化合物的低介电损耗角正切组合物的固化低介电损耗角正切薄膜和使用其的绝缘层的布线膜。 低介电损耗角正切膜含有高分子量材料和重均分子量为1000以下的具有多个苯乙烯基团的交联成分，所述苯乙烯基团由以下通式表示：（其中R表示烃骨架，R ^{1可以相同或不同，表示氢原子或1-20个碳原子的烃基，R 2，R 3 O， 和R 4彼此可以相同或不同，各自表示氢原子或1〜6个碳原子的烷基，m表示1〜4的整数，n表示 2以上的整数）。}

公开(公告)号：US06855952B2

公开(公告)日：2005-02-15

申请号：US10400647

申请日：2003-03-28

Applicant: Akira Nagai ,  Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Hiroshi Nakano

Inventor： Akira Nagai ,  Satoru Amou ,  Shinji Yamada ,  Takao Ishikawa ,  Hiroshi Nakano

IPC: C08K5/01 ,  C08L101/00 ,  H01L21/312 ,  H01L23/31 ,  H01L23/36 ,  H01L23/532 ,  B32B27/00 ,  H01L35/24

CPC classification number: H01L23/3114 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/249958 ,  Y10T428/249988 ,  Y10T428/249991 ,  Y10T428/249993 ,  Y10T428/31855 ,  Y10T428/31931 ,  H01L2924/00

Abstract: A semiconductor device wherein a resin containing as a cross-linking component a compound having a plurality of styrene group and represented by chemical formula [1] is used as an insulating material: where R is a hydrocarbon structure which may have a substituent group or groups, R1 is hydrogen, methyl, or ethyl, m is and integer of 1 to 4, and n is an integer of not less than 2. With this, a semiconductor device and a semiconductor package which show excellent transmission characteristics and less power consumption are provided.

Abstract translation: 使用含有作为交联成分的具有多个苯乙烯基并由化学式[1]表示的化合物的树脂作为绝缘材料的半导体器件：其中R为可具有取代基或烃基的烃结构 R 1为氢，甲基或乙基，m为1〜4的整数，n为2以上的整数。由此，具有优异的透射特性和较少的半导体器件和半导体封装 提供功耗。