DEFECT REDUCTION IN A SUBSTRATE TREATMENT METHOD
    2.
    发明申请
    DEFECT REDUCTION IN A SUBSTRATE TREATMENT METHOD 审中-公开
    基底处理方法中的缺陷减少

    公开(公告)号:US20160004152A1

    公开(公告)日:2016-01-07

    申请号:US14768899

    申请日:2014-02-25

    Abstract: A method for treating a substrate surface uses Neutral Beam irradiation derived from a gas-cluster ion-beam and articles produced thereby including lithography photomask substrates. One embodiment provides a method of treating a surface of a substrate that contains one or more embedded particles or contains sub-surface damage, comprising the steps of: providing a reduced pressure chamber; forming a gas-cluster ion-beam comprising gas-cluster ions within the reduced pressure chamber; accelerating the gas-cluster ions to form an accelerated gas-cluster ion-beam along a beam path within the reduced pressure chamber; promoting fragmentation and/or dissociation of at least a portion of the accelerated gas-cluster ions along the beam path; removing charged particles from the beam path to form an accelerated neutral beam along the beam path in the reduced pressure chamber; holding the surface in the beam path; and treating at least a portion of the surface of the substrate by irradiation.

    Abstract translation: 用于处理基板表面的方法使用源自气体簇离子束的中性光束照射和由此制备的物品包括光刻光掩模基板。 一个实施方案提供了一种处理含有一种或多种嵌入颗粒或含有亚表面损伤的基材表面的方法,包括以下步骤:提供减压室; 在所述减压室内形成包含气体簇离子的气体簇离子束; 加速气体簇离子以在减压室内沿着光束路径形成加速的气体簇离子束; 促进至少一部分加速的气团离子沿着光束路径的分裂和/或解离; 从所述光束路径去除带电粒子以在所述减压室中沿所述光束路径形成加速的中性光束; 将表面保持在光束路径中; 以及通过照射处理所述基材的至少一部分表面。

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