公开(公告)号：US20130167774A1

公开(公告)日：2013-07-04

申请号：US13614321

申请日：2012-09-13

Applicant: Cheol-Kyu Yang ,  Seong-Min Lee ,  Chul-Young Jang ,  Dong-Min Son ,  Byung-Ho Ahn ,  Du-Han Jeon ,  Yong-Kyu Joo ,  Sang-Cheol Ha

Inventor： Cheol-Kyu Yang ,  Seong-Min Lee ,  Chul-Young Jang ,  Dong-Min Son ,  Byung-Ho Ahn ,  Du-Han Jeon ,  Yong-Kyu Joo ,  Sang-Cheol Ha

IPC: H01L21/46 ,  B05B1/00

CPC classification number: H01L21/67017 ,  C23C16/455 ,  C23C16/45563 ,  C23C16/45568 ,  C23C16/45578 ,  C23C16/45587 ,  H01L21/67109

Abstract: A batch type apparatus may include a tube; a boat configured to receive a plurality of semiconductor substrates, the boat vertically moved into the tube; a gas nozzle vertically arranged in the tube, the tube having a first portion and a second portion upwardly extended from the first portion; a gas pipe for supplying reaction gases to the gas nozzle, the gas pipe having a horizontal extension and a vertical extension, and the vertical extension extended in the gas nozzle; a fixing member for fixing the first portion of the gas nozzle to the gas pipe, the fixing member having strength higher than that of the gas nozzle; and a clamping member for clamping the gas pipe to the tube. Therefore, breakage of the gas nozzle may be suppressed.

Abstract translation: 分批式装置可以包括管; 船，其构造成接收多个半导体衬底，所述船垂直地移动到所述管中; 垂直布置在所述管中的气体喷嘴，所述管具有从所述第一部分向上延伸的第一部分和第二部分; 用于向气体喷嘴提供反应气体的气体管道，气体管道具有水平延伸部和垂直延伸部分，并且在气体喷嘴中延伸的垂直延伸部分; 固定构件，用于将气体喷嘴的第一部分固定到气体管，固定构件的强度高于气体喷嘴的强度; 以及用于将气体管道夹紧到管子的夹紧构件。 因此，可以抑制气体喷嘴的破损。

公开(公告)号：US20100282169A1

公开(公告)日：2010-11-11

申请号：US12810894

申请日：2009-01-16

Applicant: Bum-Sul Lee ,  Je-Ho Chae ,  Seong-Min Lee

Inventor： Bum-Sul Lee ,  Je-Ho Chae ,  Seong-Min Lee

IPC: C23C16/513

CPC classification number: H01L21/67103 ,  C23C16/4586

Abstract: A substrate support apparatus includes an upper plate supporting a substrate, a lower plate disposed under the upper plate, an insulating member interposed between the upper plate and the lower plate, an electrode interposed between the upper plate and the insulating member to direct plasma onto the substrate supported by the upper plate, and a heater interposed between the insulating member and the lower plate to heat the substrate supported by the upper plate. The insulating member includes a material having a volume resistance greater than or equal to about 106 Ω-cm at a temperature of about 400° C. to about 800° C. so as to reduce a leakage current between the heater and the electrode.

Abstract translation: 基板支撑装置包括支撑基板的上板，设置在上板下方的下板，插入在上板和下板之间的绝缘构件，插入在上板和绝缘构件之间的电极，以将等离子体引导到 由上板支撑的基板和插入在绝缘构件和下板之间的加热器，用于加热由上板支撑的基板。 绝缘构件包括在约400℃至约800℃的温度下体积电阻大于或等于约106μΩ·cm的材料，以便减少加热器和电极之间的漏电流。

公开(公告)号：US20100043708A1

公开(公告)日：2010-02-25

申请号：US12543100

申请日：2009-08-18

Applicant: Jeong-Duck CHOI ,  Seong-Min LEE ,  Jin-Sik CHOI

Inventor： Jeong-Duck CHOI ,  Seong-Min LEE ,  Jin-Sik CHOI

IPC: C23C16/50 ,  H05B3/68 ,  H01C17/02 ,  H05B3/18

CPC classification number: H05B3/143 ,  C23C16/4581 ,  C23C16/4586 ,  C23C16/46 ,  H01C7/043 ,  H01L21/67103 ,  Y10T29/49083

Abstract: A ceramic heater capable of reducing power consumption, a method of manufacturing the ceramic heater and an apparatus for forming a thin layer having the ceramic heater are disclosed. The ceramic heater includes a plate, a first heating layer, a second heating layer and a connecting member. The first and second heater layers are disposed parallel to each other within the plate. The connecting member includes a ceramic material having a negative temperature coefficient (NTC) to electrically connect the first heating layer with the second heating layer at a temperature higher than a predetermined target temperature.

Abstract translation: 公开了一种能够降低功耗的陶瓷加热器，陶瓷加热器的制造方法和用于形成具有陶瓷加热器的薄层的装置。 陶瓷加热器包括板，第一加热层，第二加热层和连接构件。 第一和第二加热器层在板内彼此平行设置。 连接构件包括具有负温度系数（NTC）的陶瓷材料，以在高于预定目标温度的温度下将第一加热层与第二加热层电连接。

公开(公告)号：US07473035B2

公开(公告)日：2009-01-06

申请号：US11679038

申请日：2007-02-26

Applicant: Dai Gil Lee ,  Dong Chang Park ,  Seong Min Lee ,  Byung Chul Kim ,  Hak Sung Kim ,  Sung Su Kim ,  Jong Woon Kim

Inventor： Dai Gil Lee ,  Dong Chang Park ,  Seong Min Lee ,  Byung Chul Kim ,  Hak Sung Kim ,  Sung Su Kim ,  Jong Woon Kim

IPC: F16C25/04

CPC classification number: F16C9/04 ,  F16C11/0633 ,  F16C33/201 ,  F16J1/22 ,  Y10T403/32631

Abstract: A bearing assembly includes a spherical journal and a hemispherical bearing that is made of a fiber reinforced composite and has a bearing surface for establishing a spherical pair with the spherical journal. The fiber reinforced composite can be constructed by arranging a uni-directional prepreg, woven fiber prepregs and staple-fiber prepregs in a variety of configurations, and thermoplastic resin particles or self-lubrication particles are uniformly provided on the bearing surface. It is possible to alleviate stress concentration generated on the bearing surface by forming a plurality of air channels capable of imparting directivity on an outer surface of the hemispherical bearing.

Abstract translation: 轴承组件包括球形轴颈和由纤维增强复合材料制成并具有用于与球形轴颈建立球形对的支承表面的半球形轴承。 纤维增强复合材料可以通过以各种构造布置单向预浸料坯料，编织纤维预浸料坯料和短纤维预浸料坯而构成，并且热塑性树脂颗粒或自润滑颗粒均匀地设置在轴承表面上。 通过形成能够赋予半球形轴承的外表面方向性的多个空气通道，可以减轻在轴承表面上产生的应力集中。

公开(公告)号：US20080213567A1

公开(公告)日：2008-09-04

申请号：US11951119

申请日：2007-12-05

Applicant: Jonghyurk PARK ,  Eunkyoung KIM ,  Seungeon MOON ,  Hong-Yeol LEE ,  Kang-Ho PARK ,  Jong Dae KIM ,  Gyu-Tae KIM ,  Kang-Ho LEE ,  Seong-Min LEE

Inventor： Jonghyurk PARK ,  Eunkyoung KIM ,  Seungeon MOON ,  Hong-Yeol LEE ,  Kang-Ho PARK ,  Jong Dae KIM ,  Gyu-Tae KIM ,  Kang-Ho LEE ,  Seong-Min LEE

IPC: B32B5/16 ,  B05D1/12

CPC classification number: B41J2/14314 ,  F03G7/005 ,  Y10T428/25

Abstract: Provided is a hetero-junction membrane including: a first layer comprising first nanoparticles of a first conductive type; and a second layer comprising second nanoparticles of a second conductive type, wherein the first layer and the second layer are joined to each other. The hetero-junction membrane has advantages in that actuating efficiency is much higher, the direction of actuating can be predicted and the manufacturing processes are simple compared to conventional bucky paper formed of a single layer.

Abstract translation: 提供了一种异质结膜，包括：第一层，包括第一导电类型的第一纳米颗粒; 以及包括第二导电类型的第二纳米颗粒的第二层，其中所述第一层和所述第二层彼此连接。 异相结合膜的优点在于，与由单层形成的传统的凹版纸相比，致动效率高得多，可以预测致动的方向，并且制造工艺简单。

公开(公告)号：US07182518B2

公开(公告)日：2007-02-27

申请号：US11044294

申请日：2005-01-28

Applicant: Dai Gil Lee ,  Dong Chang Park ,  Seong Min Lee ,  Byung Chul Kim ,  Hak Sung Kim ,  Sung Su Kim ,  Jong Woon Kim

Inventor： Dai Gil Lee ,  Dong Chang Park ,  Seong Min Lee ,  Byung Chul Kim ,  Hak Sung Kim ,  Sung Su Kim ,  Jong Woon Kim

IPC: F16C25/04

CPC classification number: F16C9/04 ,  F16C11/0633 ,  F16C33/201 ,  F16J1/22 ,  Y10T403/32631

Abstract: The present invention discloses a bearing assembly capable of assuring mechanical strength and reducing a friction coefficient and stress concentration, and a method for manufacturing the same. The present invention comprises a spherical journal and a hemispherical bearing that is made of a fiber reinforced composite and has a bearing surface for establishing a spherical pair with the spherical journal. The fiber reinforced composite can be constructed by arranging a uni-directional prepreg, woven fiber prepregs and staple-fiber prepregs in a variety of configurations, and thermoplastic resin particles or self-lubrication particles are uniformly provided on the bearing surface. It is possible to alleviate stress concentration generated on the bearing surface by forming a plurality of air channels capable of imparting directivity on an outer surface of the hemispherical bearing.

Abstract translation: 本发明公开了一种能够确保机械强度并降低摩擦系数和应力集中度的轴承组件及其制造方法。 本发明包括球形轴颈和半球形轴承，该轴承由纤维增强复合材料制成并且具有用于与球形轴颈建立球形对的支承表面。 纤维增强复合材料可以通过以各种构造布置单向预浸料坯料，编织纤维预浸料坯料和短纤维预浸料坯而构成，并且热塑性树脂颗粒或自润滑颗粒均匀地设置在轴承表面上。 通过形成能够赋予半球形轴承的外表面方向性的多个空气通道，可以减轻在轴承表面上产生的应力集中。

公开(公告)号：US5899729A

公开(公告)日：1999-05-04

申请号：US941070

申请日：1997-09-30

Applicant: Seong Min Lee

Inventor： Seong Min Lee

IPC: H01L21/301 ,  H01L21/78 ,  H01L21/46

CPC classification number: H01L21/78

Abstract: A semiconductor wafer having an active surface separated into device regions with semiconductor chips formed thereon and scribe regions formed between the device regions. The wafer includes an insulating layer formed on the active surface in the device regions. The insulating layer has a first edge and a second edge oriented in a confronting relationship. The first edge and the second edge end at the scribe regions.

Abstract translation: 具有分离成具有在其上形成有半导体芯片的器件区域的有源表面的半导体晶片和在器件区域之间形成的划线区域。 晶片包括形成在器件区域中的有源表面上的绝缘层。 绝缘层具有朝向相对关系的第一边缘和第二边缘。 第一边缘和第二边缘在划线区域处结束。

公开(公告)号：US5811874A

公开(公告)日：1998-09-22

申请号：US840233

申请日：1997-04-11

Applicant: Seong Min Lee

Inventor： Seong Min Lee

IPC: H01L21/3205 ,  H01L21/28 ,  H01L21/60 ,  H01L23/52 ,  H01L23/58 ,  H01L23/495

CPC classification number: H01L23/58 ,  H01L2924/0002

Abstract: A semiconductor chip packaging device includes a lead frame electrically connected to the chip and mechanically supporting the chip; a metal layer guard ring formed along at least one peripheral edge of an active surface of the chip; at least one slit formed at corner parts of the chip; a passivation layer covering the metal layer guard ring, the chip and the lead frame; and a package body made of a molding resin encapsulating the passivation layer, the lead frame, the metal layer and the chip; the metal layer guard ring being chamfered or rounded at corner parts of the chip to reduce shear stresses at the corner parts of the chip.

Abstract translation: 一种半导体芯片封装装置，包括与芯片电连接并机械地支撑芯片的引线框架; 沿所述芯片的有源表面的至少一个周边边缘形成的金属层保护环; 形成在所述芯片的角部的至少一个狭缝; 覆盖金属层保护环的钝化层，芯片和引线框架; 以及由封装所述钝化层，所述引线框架，所述金属层和所述芯片的模制树脂制成的封装体; 金属层保护环在芯片的角部被倒角或倒圆，以减小芯片角部处的剪切应力。

公开(公告)号：US5804883A

公开(公告)日：1998-09-08

申请号：US679450

申请日：1996-07-12

Applicant: Hong-beom Kim ,  Seong-min Lee

Inventor： Hong-beom Kim ,  Seong-min Lee

IPC: H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/29 ,  H01L23/31 ,  H01L27/02

CPC classification number: H01L24/03 ,  H01L2224/05556 ,  H01L2924/01004 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/351

Abstract: A bonding pad in a semiconductor device having at least one slit is provided. In the semiconductor device including a passivation layer covering the bonding pad and metal wiring, at least one slit is formed on the bonding pad for electrically connecting the metal wiring to external leads of the semiconductor device. The slit formed in the bonding pad may be filled with a molding compound to buffer the stresses caused by a wire-bonding process. Hence, stress-induced corrosion may be reduced and PCT reliability may be enhanced.

Abstract translation: 提供了具有至少一个狭缝的半导体器件中的焊盘。 在包括覆盖焊盘和金属布线的钝化层的半导体器件中，在焊盘上形成至少一个狭缝，用于将金属布线电连接到半导体器件的外部引线。 形成在接合焊盘中的狭缝可以填充有模制化合物以缓冲由引线键合过程引起的应力。 因此，可能降低应力诱发的腐蚀，并且可以提高PCT的可靠性。

公开(公告)号：US20120187828A1

公开(公告)日：2012-07-26

申请号：US13237021

申请日：2011-09-20

Applicant: Young-Kwan Kim ,  Eun-Gi Heo ,  Kyung-Cheol Choi ,  Seong-Min Lee

Inventor： Young-Kwan Kim ,  Eun-Gi Heo ,  Kyung-Cheol Choi ,  Seong-Min Lee

IPC: H01J17/49 ,  H01J9/22

CPC classification number: H01J9/241 ,  H01J11/22 ,  H01J11/42 ,  H01J2211/42

Abstract: A plasma display panel includes first and second substrates opposite to each other; a plurality of address electrodes disposed on one surface of the first substrate; a plurality of display electrodes disposed in a perpendicular direction to the address electrodes on one surface of the second substrate; and red, green, and blue phosphor layers disposed in a discharge space between the first and second substrates. At least one of the phosphor layers include a phosphor coated with a metal.

Abstract translation: 等离子体显示面板包括彼此相对的第一和第二基板; 设置在所述第一基板的一个表面上的多个寻址电极; 多个显示电极，设置在与第二基板的一个表面上的寻址电极垂直的方向上; 以及设置在第一和第二基板之间的放电空间中的红色，绿色和蓝色荧光体层。 荧光体层中的至少一个包括涂覆有金属的荧光体。