公开(公告)号：US07293692B2

公开(公告)日：2007-11-13

申请号：US10865474

申请日：2004-06-10

Applicant: Hiroshi Akamatsu ,  Yukinori Kawamura ,  Hiroshi Kai ,  Osamu Kuramoto ,  Shigeru Iwasaki ,  Kenji Asai ,  Minoru Hibino

Inventor： Hiroshi Akamatsu ,  Yukinori Kawamura ,  Hiroshi Kai ,  Osamu Kuramoto ,  Shigeru Iwasaki ,  Kenji Asai ,  Minoru Hibino

IPC: B23K31/02

CPC classification number: H05K3/3415 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/0545 ,  H05K2203/111 ,  H05K2203/1121 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T428/12493

Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.

Abstract translation: 公开了由具有优异特性的锌基无铅焊料形成的焊点结构的结构。 在第一无铅焊料层和焊盘之间形成以下层：形成在焊盘上的锡 - 铜合金层; 由主要成分为锡和银的第二无铅层形成的第一合金层; 以及形成在第一合金层和第一无铅焊料之间的第二合金层。 这种结构允许形成由具有高接合强度的锌基无铅焊料形成的焊点结构。

公开(公告)号：US20080179379A1

公开(公告)日：2008-07-31

申请号：US11866607

申请日：2007-10-03

Applicant: Hiroshi AKAMATSU ,  Yukinori KAWAMURA ,  Hiroshi KAI ,  Osamu KURAMOTO ,  Shigeru IWASAKI ,  Kenji ASAI ,  Minoru HIBINO

Inventor： Hiroshi AKAMATSU ,  Yukinori KAWAMURA ,  Hiroshi KAI ,  Osamu KURAMOTO ,  Shigeru IWASAKI ,  Kenji ASAI ,  Minoru HIBINO

IPC: B23K35/14

CPC classification number: H05K3/3415 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/0545 ,  H05K2203/111 ,  H05K2203/1121 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T428/12493

Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.

Abstract translation: 公开了由具有优异特性的锌基无铅焊料形成的焊点结构的结构。 在第一无铅焊料层和焊盘之间形成以下层：形成在焊盘上的锡 - 铜合金层; 由主要成分为锡和银的第二无铅层形成的第一合金层; 以及形成在第一合金层和第一无铅焊料之间的第二合金层。 这种结构允许形成由具有高接合强度的锌基无铅焊料形成的焊点结构。

公开(公告)号：US5461672A

公开(公告)日：1995-10-24

申请号：US92213

申请日：1993-07-15

Applicant: Kazuhiro Enokido ,  Akio Suzuki ,  Shigeru Iwasaki

Inventor： Kazuhiro Enokido ,  Akio Suzuki ,  Shigeru Iwasaki

IPC: H04Q7/32 ,  H04B1/08 ,  H04M1/02 ,  H04M1/03 ,  H04M1/00

CPC classification number: H04M1/03 ,  H04B1/088 ,  H04M1/0237

Abstract: A portable radiotelephone transmits and receives voice information signals to and from a telephone base station by radio. The radio telephone includes a telephone main body having a key pad section mounted on its outer surface and containing a microphone unit. A speaker housing containing a speaker unit is slidably mounted on the telephone main body. A switching unit located between the telephone body and the speaker housing establishes electrical connection and disconnection between the telephone body and the speaker housing depending upon their relative positions as changed by sliding the speaker unit. Electrical connection is established when the speaker housing is moved in a direction away from the microphone unit located on the telephone main body.

Abstract translation: 便携式无线电话机通过无线电发送和接收来自电话基站的语音信息信号。 无线电话包括电话主体，其具有安装在其外表面上并包含麦克风单元的键盘部分。 容纳扬声器单元的扬声器壳体可滑动地安装在电话主体上。 位于电话主体和扬声器壳体之间的切换单元根据通过滑动扬声器单元而改变的相对位置来建立电话主体和扬声器壳体之间的电连接和断开。 当扬声器壳体沿远离位于电话主体上的麦克风单元的方向移动时，建立电连接。