公开(公告)号：US08670006B2

公开(公告)日：2014-03-11

申请号：US12883321

申请日：2010-09-16

Applicant: Hee-Jung Hong ,  Eui-Yeol Oh ,  Si-Hoon Lee ,  Hee-Won Ahn

Inventor： Hee-Jung Hong ,  Eui-Yeol Oh ,  Si-Hoon Lee ,  Hee-Won Ahn

IPC: G09G5/10

CPC classification number: G09G3/3426 ,  G09G2320/0233 ,  G09G2320/064 ,  G09G2320/0646 ,  G09G2360/145 ,  G09G2360/16

Abstract: A local dimming driving method of the LCD device includes divisionally driving all of a plurality of blocks of a backlight unit using a maximum luminance signal and measuring luminance per block, setting one of the plurality of blocks as a reference block, detecting luminance deviations between the reference block and the residual blocks, and setting an offset value per block for compensating for the detected luminance deviations per block, analyzing an input image in units of blocks corresponding to the plurality of blocks of a backlight unit respectively, detecting a representative value per block, and determining a dimming value per block according to the representative value per block, correcting the dimming value per block using the offset value per block, and controlling the luminance of the backlight unit on a block-by-block basis using the corrected dimming value per block.

Abstract translation: LCD装置的局部调光驱动方法包括使用最大亮度信号分割驱动背光单元的多个块，并测量每个块的亮度，将多个块中的一个设置为参考块，检测所述多个块之间的亮度偏差 参考块和剩余块，并且设置每个块的偏移值以补偿每块的检测到的亮度偏差，分别以对应于背光单元的多个块的块为单位分析输入图像，检测每个块的代表值 并且根据每个块的代表值确定每个块的调光值，使用每个块的偏移值来校正每个块的调光值，并且使用校正的调光值逐个块地控制背光单元的亮度 每个块。

公开(公告)号：US08222089B2

公开(公告)日：2012-07-17

申请号：US13033307

申请日：2011-02-23

Applicant: Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

Inventor： Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

IPC: H01J9/00

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/189 ,  H05K2201/09109 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2203/1581 ,  H01L2924/00

Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Abstract translation: 公开了一种片上胶片（COF）型半导体封装以及使用其的器件。 COF型半导体封装可以包括包括顶表面和底表面的绝缘衬底，绝缘衬底的顶表面上的半导体器件，绝缘衬底的底表面上的散热部件，以及绝缘衬底的至少一个空间 绝缘基板的底表面和散热部件的顶表面。

公开(公告)号：US20110148941A1

公开(公告)日：2011-06-23

申请号：US12869520

申请日：2010-08-26

Applicant: Dong-Woo Kim ,  Si-Hoon Lee ,  Kyo-Hyuck Choo

Inventor： Dong-Woo Kim ,  Si-Hoon Lee ,  Kyo-Hyuck Choo

IPC: G09G5/10 ,  G09G3/36

CPC classification number: G09G3/3426 ,  G09G2320/0646 ,  G09G2360/16

Abstract: A driving method for local dimming of a Liquid Crystal Display (LCD) device and an apparatus using the same are disclosed. The driving method includes determining a dimming value of each of a plurality of local dimming blocks into which a backlight unit is divided to be driven on a block basis by analyzing input image data on a block basis, detecting a high gray area concentrated with high gray levels from each local dimming block based on the analysis of the input image data, and generating position information about the high gray area according to a distance between the high gray area in the block and an adjacent block, and compensating the dimming value of each of the plurality of local dimming blocks by spatial filtering using a spatial filter having a different filter size or different filter coefficients for local dimming blocks according to the position information about the high gray area in the local dimming block.

Abstract translation: 公开了一种用于液晶显示器（LCD）器件的局部调光的驱动方法及其使用方法。 所述驱动方法包括：通过以块为基础分析输入图像数据来确定多个局部调光块中的每一个的调光值，通过以块为基础分析输入图像数据，将背光单元划分成要以块为基础驱动的多个局部调光块， 基于对输入图像数据的分析，从每个局部调光块的电平开始，并且根据块中的高灰度区域与相邻块之间的距离生成关于高灰度区域的位置信息，并且补偿每个区域的调光块的调光值 根据关于本地调光块中的高灰度区域的位置信息，通过使用具有不同滤波器尺寸或不同滤波器系数的空间滤波器对局部调光块进行空间滤波的多个局部调光块。

公开(公告)号：US20100149775A1

公开(公告)日：2010-06-17

申请号：US12584516

申请日：2009-09-08

Applicant: Sang-Ho Park ,  Sa-Yoon Kang ,  Si-Hoon Lee

Inventor： Sang-Ho Park ,  Sa-Yoon Kang ,  Si-Hoon Lee

IPC: H05K7/00

CPC classification number: H01L23/49838 ,  G02F1/13452 ,  H01L21/563 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/142 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/09227 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within the chip mount portion toward a second side. The second wiring extends into the chip mount portion through a third side and bends within the chip mount portion toward the second side. The first, second, and third sides are different sides of the chip mount portion. Thus, size and in turn cost of the base film are minimized by arranging wirings within the chip mount portion for further miniaturization of electronic devices, such as a display panel assembly, using the tape circuit substrate.

Abstract translation: 带状电路基板包括具有第一布线的基膜和设置在基膜上的第二布线。 第一布线通过第一侧延伸到芯片安装部分中，并且在芯片安装部分内向第二侧弯曲。 第二布线通过第三侧延伸到芯片安装部分，并且在芯片安装部分内向第二侧弯曲。 第一，第二和第三面是芯片安装部分的不同侧面。 因此，通过在芯片安装部分内布置布线以使得使用带电路基板的诸如显示面板组件的电子设备的进一步小型化来使基膜的尺寸和成本进一步降低。

公开(公告)号：US07683476B2

公开(公告)日：2010-03-23

申请号：US11517253

申请日：2006-09-08

Applicant: Si-hoon Lee ,  Jae-cheon Doh ,  Sa-yoon Kang

Inventor： Si-hoon Lee ,  Jae-cheon Doh ,  Sa-yoon Kang

IPC: H01L23/34

CPC classification number: H01L23/49833 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/86 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014

Abstract: Semiconductor package films and a display module comprising a packaged semiconductor device punched from a semiconductor package film are provided. In one embodiment, the invention provides a semiconductor package film comprising a base film comprising a plurality of semiconductor device regions, an intermediate region disposed on a first surface of the base film and disposed between two semiconductor device regions, and a reinforcing member attached to a second surface of the base film opposite the first surface of the base film and attached opposite the intermediate region. Each semiconductor device region comprises a semiconductor mounting region adapted to receive a semiconductor chip, and first and second metal line regions.

Abstract translation: 提供半导体封装膜和包括从半导体封装膜冲压的封装半导体器件的显示模块。 在一个实施例中，本发明提供了一种半导体封装膜，其包括基膜，所述基膜包括多个半导体器件区域，设置在所述基膜的第一表面上并设置在两个半导体器件区域之间的中间区域， 基膜的与基膜的第一表面相对的第二表面并且与中间区域相对地安装。 每个半导体器件区域包括适于接收半导体芯片的半导体安装区域以及第一和第二金属线区域。

公开(公告)号：US07652366B2

公开(公告)日：2010-01-26

申请号：US12189039

申请日：2008-08-08

Applicant: Ye-Chung Chung ,  Si-Hoon Lee

Inventor： Ye-Chung Chung ,  Si-Hoon Lee

IPC: H01L23/52 ,  H01L23/48 ,  H01L23/495 ,  H01L29/40 ,  H01L23/485 ,  H01L23/498

CPC classification number: G02F1/13452 ,  H01L21/563 ,  H01L23/4985 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size.

Abstract translation: 集成电路（IC）芯片上的输出焊盘沿着第一长边布置，并且沿着具有输入焊盘的第二长边布置。 输出焊盘连接到形成在基膜的顶表面和底表面上的各个输出图案。 所有的输出模式都可能超过第一个较长的一侧。 或者，连接到第二长边处的输出焊盘的输出图案可以越过较短的一侧。 这些图形结构建立了有效的衬垫布置，而不增加TAB封装的尺寸，而允许减小芯片尺寸。

公开(公告)号：US07420270B2

公开(公告)日：2008-09-02

申请号：US11362882

申请日：2006-02-28

Applicant: Si-Hoon Lee ,  Eun-Seok Song

Inventor： Si-Hoon Lee ,  Eun-Seok Song

IPC: H01L23/52

CPC classification number: H01L23/552 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/50 ,  H01L24/17 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H05K1/0216 ,  H05K1/113 ,  H05K1/189 ,  H05K2201/0715 ,  H05K2201/09318 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A chip-on-film package may include a tape wiring substrate, a semiconductor chip mounted on the tape wiring substrate, and a molding compound provided between the semiconductor chip and the tape wiring substrate. The tape wiring substrate may include a film having upper and lower surfaces. Vias may penetrate the film. An upper metal layer may be provided on the upper surface of the film and include input terminal patterns and/or output terminal patterns. The input terminal patterns may include ground terminal patterns and/or power terminal patterns. A lower metal layer may be provided on the lower surface of the film and include a ground layer and/or a power layer. The ground layer and the power layer may cover at least a chip mounting area.

Abstract translation: 胶片封装可以包括带布线基板，安装在带布线基板上的半导体芯片，以及设置在半导体芯片和带布线基板之间的模塑料。 带状布线基板可以包括具有上表面和下表面的膜。 通风口可能会穿透电影。 上层金属层可以设置在膜的上表面上并且包括输入端子图案和/或输出端子图案。 输入端子图案可以包括接地端子图案和/或电源端子图案。 下部金属层可以设置在膜的下表面上并且包括接地层和/或功率层。 接地层和功率层可以至少覆盖芯片安装区域。

公开(公告)号：US20070057360A1

公开(公告)日：2007-03-15

申请号：US11517253

申请日：2006-09-08

Applicant: Si-hoon Lee ,  Jae-cheon Doh ,  Sa-yoon Kang

Inventor： Si-hoon Lee ,  Jae-cheon Doh ,  Sa-yoon Kang

IPC: H01L23/48 ,  G02F1/1345

CPC classification number: H01L23/49833 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/86 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014

Abstract: Semiconductor package films and a display module comprising a packaged semiconductor device punched from a semiconductor package film are provided. In one embodiment, the invention provides a semiconductor package film comprising a base film comprising a plurality of semiconductor device regions, an intermediate region disposed on a first surface of the base film and disposed between two semiconductor device regions, and a reinforcing member attached to a second surface of the base film opposite the first surface of the base film and attached opposite the intermediate region. Each semiconductor device region comprises a semiconductor mounting region adapted to receive a semiconductor chip, and first and second metal line regions.

Abstract translation: 提供半导体封装膜和包括从半导体封装膜冲压的封装半导体器件的显示模块。 在一个实施例中，本发明提供了一种半导体封装膜，其包括基膜，所述基膜包括多个半导体器件区域，设置在所述基膜的第一表面上并设置在两个半导体器件区域之间的中间区域， 基膜的与基膜的第一表面相对的第二表面并且与中间区域相对地安装。 每个半导体器件区域包括适于接收半导体芯片的半导体安装区域以及第一和第二金属线区域。

公开(公告)号：US20060012019A1

公开(公告)日：2006-01-19

申请号：US11173852

申请日：2005-06-30

Applicant: Suk-Chae Kang ,  Si-Hoon Lee ,  Sa-Yoon Kang ,  Dong-Han Kim ,  Yun-Hyeok Im ,  Gu-Sung Kim

Inventor： Suk-Chae Kang ,  Si-Hoon Lee ,  Sa-Yoon Kang ,  Dong-Han Kim ,  Yun-Hyeok Im ,  Gu-Sung Kim

IPC: H01L23/02

CPC classification number: H01L23/3675 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.

Abstract translation: 半导体封装包括半导体芯片，形成有线图形的电路板，以及包括插入电路板的开口部分的半导体芯片所在的金属结构体。 随着半导体芯片与金属结构直接接触，热特性得到改善。 由于电路板由金属结构支撑，机械稳定性提高。

公开(公告)号：US08665298B2

公开(公告)日：2014-03-04

申请号：US12883332

申请日：2010-09-16

Applicant: Hee-Jung Hong ,  Eui-Yeol Oh ,  Si-Hoon Lee ,  Jung-Hwan Lee

Inventor： Hee-Jung Hong ,  Eui-Yeol Oh ,  Si-Hoon Lee ,  Jung-Hwan Lee

IPC: G09G5/10

CPC classification number: G09G3/3426 ,  G02F2001/133601 ,  G09G2320/0646

Abstract: Disclosed is a method for analyzing a light profile of a light source includes driving a light source of one of a plurality of blocks which divide a backlight unit, setting a light analyzing region matched to one light emission region of the light source, dividing the light analyzing region into at least two symmetric regions considering a form of the light emission region and symmetry of the light emission region, and analyzing and storing a light profile of one of the at least two symmetric regions.

Abstract translation: 公开了一种用于分析光源的光分布的方法，包括驱动分割背光单元的多个块中的一个的光源，设置与光源的一个发光区域匹配的光分析区域， 考虑到发光区域的形式和发光区域的对称性，将区域分析成至少两个对称区域，以及分析和存储至少两个对称区域中的一个的光谱。