公开(公告)号：US20190235302A1

公开(公告)日：2019-08-01

申请号：US16330116

申请日：2017-08-09

Applicant: KORTEK CORPORATION

Inventor： Keun Shik NAH ,  Chan Hwan KIM

IPC: G02F1/1333 ,  H05K3/36 ,  G06F1/16 ,  G02F1/1345

CPC classification number: G02F1/133305 ,  G02F1/1345 ,  G02F2001/133325 ,  G06F1/16 ,  G06F1/1652 ,  G09F9/30 ,  H05K1/14 ,  H05K1/18 ,  H05K3/361 ,  H05K2201/10681

Abstract: Provided is a method of manufacturing a curved display device, wherein a tape automated bonding (TAB) tape, which includes a base film, a driving chip formed at an upper portion of the base film, a plurality of one-side outer leads formed to bond an output terminal of the driving chip and a terminal of a liquid crystal display (LCD) substrate by an outer lead bonding (OLB) method, and a plurality of the other-side outer leads formed to bond an input terminal of the driving chip and a terminal of a printed circuit board, is designed so that from the end of the OLB bonding part to the part at which the film begins to bend is greater than or equal to the longitudinal length (E) of the driving chip ((4F−D/2)≥E).

公开(公告)号：US09922921B2

公开(公告)日：2018-03-20

申请号：US14637385

申请日：2015-03-03

Applicant: Jae-min Jung ,  Na-rae Shin

Inventor： Jae-min Jung ,  Na-rae Shin

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/498 ,  H05K1/00 ,  H01L23/48 ,  H01L23/49 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/49811 ,  H01L23/4985 ,  H01L23/564 ,  H01L2224/16225 ,  H05K1/189 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A semiconductor package includes: a semiconductor chip including an effective chip region at a center of the semiconductor chip and in which pads connected to chip wirings are formed, and a dummy chip region at a side of the effective chip region and in which pads not connected to the chip wirings are formed; a base film including a chip mounting section on which the semiconductor chip is mounted; and a plurality of wiring patterns disposed on the base film and electrically connected to the chip wirings of the semiconductor chip, wherein first wiring patterns, which are a part of the plurality of wiring patterns, extend on a first region of the chip mounting section corresponding to the dummy chip region.

公开(公告)号：US20180049324A1

公开(公告)日：2018-02-15

申请号：US15446255

申请日：2017-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-eun Koo ,  Ye-chung Chung ,  Yong-hoon Kim

IPC: H05K1/18 ,  H01L23/00 ,  G09G5/18 ,  H01L25/065 ,  H01L21/48 ,  H01L23/538 ,  H01L25/18

CPC classification number: H05K1/185 ,  G09G3/20 ,  G09G5/18 ,  G09G2300/0426 ,  G09G2310/08 ,  H01L21/486 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2924/141 ,  H01L2924/1426 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/181 ,  H05K1/186 ,  H05K1/189 ,  H05K2201/0154 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10681

Abstract: Provided are a semiconductor package and a display device including the same. In some aspects, the semiconductor package may include a film substrate including a base film including cavities and a wiring layer on the base film, a semiconductor chip connected to the wiring layer and mounted on a surface of the base film, and passive devices accommodated in the cavities of the base film and electrically connected to the semiconductor chip through the wiring layer. According to other aspects a base film having at least one recess may be provided. A wiring layer may be on the base film, and a semiconductor chip may be connected to the wiring layer and mounted on a surface of the base film. At least one passive device may be in the at least one recess of the base film and electrically connected to the semiconductor chip via the wiring layer.

公开(公告)号：US20180031751A1

公开(公告)日：2018-02-01

申请号：US15658095

申请日：2017-07-24

Applicant: Japan Display Inc.

Inventor： Ken Sugiyama

IPC: F21V8/00 ,  H01L33/58 ,  H05K1/02 ,  H01L25/075 ,  H05K1/18 ,  H01L33/48 ,  H01L33/62

CPC classification number: G02B6/009 ,  G02B6/0051 ,  G02B6/0053 ,  G02B6/0055 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0083 ,  G02F1/1333 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H05K1/0274 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: According to one embodiment, a light source device includes a light-emitting chip, and a case in which the light-emitting chip is accommodated. The case includes a light-emitting surface which transmits light from the light-emitting chip, and a plurality of sidewalls extending so as to intersect the light-emitting surface. At least a part of the sidewalls is colored or painted in black.

公开(公告)号：US20180007793A1

公开(公告)日：2018-01-04

申请号：US15527530

申请日：2016-09-22

Applicant: BOE Technology Group Co., Ltd. ,  Beijing BOE Display Technology Co., Ltd.

Inventor： Qiang Zhang ,  Bin Zhang ,  Dianzheng Dong ,  Guangxing Wang ,  Kan Zhang

IPC: H05K1/18 ,  H05K5/00 ,  H05K1/02

CPC classification number: H05K1/189 ,  H05K1/0269 ,  H05K1/028 ,  H05K5/0017 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/10196 ,  H05K2201/10681 ,  H05K2203/161

Abstract: This disclosure discloses a flexible printed circuit, a chip on film, and a bonding method and a display device using this flexible printed circuit and chip on film. The flexible printed circuit/chip on film of this disclosure a humidity detection layer located between a flexible base film and a metal foil, wherein the humidity detection layer and the flexible base film, and/or the humidity detection layer and the metal foil, are optionally bonded by an adhesive layer. The humidity detection layer can change resistance and/or color according to the humidity, so that intuitive and rapid localization of coating badness is performed directly (by color change) or by means of a detecting lead and an impedance/voltage detecting circuit, and finally the object of reducing the ratio of defective products is achieved.

公开(公告)号：US20170345575A1

公开(公告)日：2017-11-30

申请号：US15678237

申请日：2017-08-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadateru YAMADA

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/012 ,  H05K1/18 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/248 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10681

Abstract: In a capacitor main body, a dimension along the thickness direction of a first region where a first inner electrode and a second inner electrode are provided is t1, a dimension along the thickness direction of a second region that is positioned on the side of a first main surface relative to the first region is t2, and a dimension along the thickness direction of a third region that is positioned on the side of a second main surface relative to the first region is t3. A condition of t2/t1>about 0.15 and a condition of t3/t1>about 0.15 are satisfied.

公开(公告)号：US20170318677A1

公开(公告)日：2017-11-02

申请号：US15651056

申请日：2017-07-17

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Man Bok JEON

IPC: H05K1/14 ,  G02F1/1345 ,  H05K1/02 ,  H01L27/32

CPC classification number: H05K1/147 ,  G02F1/13452 ,  G09G2300/0408 ,  H01L27/3276 ,  H01L2251/5338 ,  H05K1/0281 ,  H05K2201/09018 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: A curved display device includes a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and an output wire unit connected to the driving chips, a printed circuit board (PCB) connected to the input wire unit of the semiconductor chip package, and a display panel including a display unit and a pad unit connected to the output wire unit of the semiconductor chip package, wherein the display panel, the semiconductor chip package, and the PCB are bendable in a first direction, and the driving chips of the of the semiconductor chip package are separated from each other in the first direction.

公开(公告)号：US20170229417A1

公开(公告)日：2017-08-10

申请号：US15502585

申请日：2015-08-17

Applicant: Sharp Kabushiki Kaisha

Inventor： Katsuhiro YAMAGUCHI ,  Nobuhiro NAKATA

IPC: H01L23/00 ,  G02F1/13 ,  G02F1/1345 ,  H05K3/32

CPC classification number: H01L24/75 ,  G02F1/1303 ,  G02F1/13452 ,  G02F2201/54 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83862 ,  H05K1/148 ,  H05K3/32 ,  H05K3/361 ,  H05K2201/056 ,  H05K2201/10136 ,  H05K2201/10681 ,  H05K2203/0278 ,  H05K2203/1105 ,  H01L2924/00

Abstract: A driver mounting apparatus 40 includes a driver mount-side heat supply support member 42, a substrate support member 41, a driver-side heat supply support member 43, a first moving portion 44, and a second moving portion 45. The driver mount-side heat supply support member 42 supports a driver mount portion GSd and supplies heat to the driver mount portion GSd. The substrate support member supports a substrate main portion GSm. The driver-side heat supply support member 43 supports and sandwich a driver 21 with the driver mount-side heat supply support member 42 and supplies heat to the driver 21. The first moving portion 44 relatively moves the driver mount portion GSd and the driver mount-side heat supply support member 42 in an overlapping direction in which the glass substrate GS and the driver 21 are overlapped. The second moving portion 45 relatively moves the driver 21 and the driver-side heat supply support member 43 in the overlapping direction.

公开(公告)号：US09560761B2

公开(公告)日：2017-01-31

申请号：US14577946

申请日：2014-12-19

Applicant: LG Display Co., Ltd.

Inventor： Katsuhiko Kishida ,  Hongsik Kim ,  Seunghwan Shin ,  Chimyung Ahn ,  Daeyoung Seo

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/147 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: Embodiment related to a curved display including a curved panel, a printed circuit board separated from the curved panel, and a plurality of flexible films electrically connecting the curved panel and the printed circuit board. The lengths of the flexible films is increased as the flexible films approach an edge of the curved panel.

Abstract translation: 与弯曲显示器相关的实施例，包括弯曲面板，与曲面板分离的印刷电路板，以及电连接弯曲面板和印刷电路板的多个柔性膜。 当柔性膜接近弯曲面板的边缘时，柔性膜的长度增加。

公开(公告)号：US20160372442A1

公开(公告)日：2016-12-22

申请号：US14416788

申请日：2014-12-09

Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Bing HAN ,  Shih Hsun LO ,  Jinjie WANG

IPC: H01L23/00 ,  G02F1/133

CPC classification number: H01L24/49 ,  G02F1/13306 ,  G02F1/13458 ,  H01L23/4985 ,  H01L24/48 ,  H01L2224/16054 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17106 ,  H01L2924/00014 ,  H01L2924/30101 ,  H05K1/117 ,  H05K2201/10681 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In the technical field of display, a display device for solving the technical problem of fanout mura of the pixels controlled by the wires located at both sides of a fanout is provided. The display device according to the present disclosure comprises a substrate, and a chip on film connected to the fanout on the substrate through a bounding lead. The bounding lead comprises a plurality of parallel wires. In the bounding lead, the areas of the wires gradually decrease from the wires located at both ends of the bounding lead to those located at the center thereof. The present disclosure can be applied to display devices, such as liquid crystal television and liquid crystal display, etc.

Abstract translation: 在显示技术领域中，提供了一种用于解决由位于扇出两侧的电线控制的像素的扇出的技术问题的显示装置。 根据本公开的显示装置包括基板和通过边界引线连接到基板上的扇出的薄膜上的芯片。 边界线包括多条平行线。 在边界引线中，电线的区域从位于边界线两端的电线逐渐减小到位于其中心的电线。 本公开可以应用于诸如液晶电视和液晶显示器等的显示装置