公开(公告)号：US20120112365A1

公开(公告)日：2012-05-10

申请号：US13348531

申请日：2012-01-11

Applicant: Udo Ausserlechner ,  Carsten von Koblinski ,  Sigrid Wabnig ,  Volker Strutz ,  Robert Grünberger

Inventor： Udo Ausserlechner ,  Carsten von Koblinski ,  Sigrid Wabnig ,  Volker Strutz ,  Robert Grünberger

IPC: H01L23/52 ,  H01L21/56

CPC classification number: G01R15/20 ,  G01R15/207 ,  G01R33/072 ,  H01L23/047 ,  H01L23/16 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32111 ,  H01L2224/32237 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49177 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container.

Abstract translation: 在一个实施例中，半导体封装包括具有形成内膜部分和外缘部分的凹部的隔离容器。 边缘部分比膜部分厚。 封装包括设置在凹部中的半导体芯片和设置在隔离容器的膜部下方的背板。

公开(公告)号：US09013890B2

公开(公告)日：2015-04-21

申请号：US13348531

申请日：2012-01-11

Applicant: Udo Ausserlechner ,  Carsten von Koblinski ,  Sigrid Wabnig ,  Volker Strutz ,  Robert Grünberger

Inventor： Udo Ausserlechner ,  Carsten von Koblinski ,  Sigrid Wabnig ,  Volker Strutz ,  Robert Grünberger

IPC: H05K7/00 ,  G01R15/20 ,  G01R33/07 ,  H01L23/16 ,  H01L23/31 ,  H01L23/00

CPC classification number: G01R15/20 ,  G01R15/207 ,  G01R33/072 ,  H01L23/047 ,  H01L23/16 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32111 ,  H01L2224/32237 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49177 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container.

Abstract translation: 在一个实施例中，半导体封装包括具有形成内膜部分和外缘部分的凹部的隔离容器。 边缘部分比膜部分厚。 封装包括设置在凹部中的半导体芯片和设置在隔离容器的膜部下方的背板。