公开(公告)号：US20070107837A1

公开(公告)日：2007-05-17

申请号：US11593808

申请日：2006-11-06

Applicant: Steven Dutton

Inventor： Steven Dutton

IPC: B29C65/00

CPC classification number: B32B37/10 ,  B29C65/18 ,  B29C66/45 ,  B29K2027/18 ,  B29K2049/00 ,  B29K2063/00 ,  B29K2071/12 ,  B29K2079/08 ,  B29K2101/10 ,  B29K2105/0079 ,  B29L2009/00 ,  B32B37/0046 ,  B32B37/12 ,  B32B2305/55 ,  B32B2457/08 ,  H05K3/4611 ,  H05K2203/068 ,  H05K2203/085

Abstract: A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Abstract translation: 一种用于生产高层数，多层电路的方法和装置，包括制造其中具有开口的固定装置，用于放置在压机内。 在启动压力机之前，将材料堆叠，特别是具有多层液晶聚合物的材料堆叠放置在固定装置的开口内，以层压位于固定装置内的材料堆叠。

公开(公告)号：US20070017092A1

公开(公告)日：2007-01-25

申请号：US11187220

申请日：2005-07-22

Applicant: Steven Dutton

Inventor： Steven Dutton

IPC: H05K3/20 ,  B23P19/00

CPC classification number: H05K3/4611 ,  B32B37/0046 ,  B32B37/12 ,  B32B2305/55 ,  B32B2309/68 ,  B32B2457/08 ,  H05K2201/0141 ,  H05K2201/2018 ,  H05K2201/2036 ,  H05K2203/085 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53196 ,  Y10T29/532

Abstract: A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Abstract translation: 一种用于生产高层数，多层电路的方法和装置，包括制造其中具有开口的固定装置，用于放置在压机内。 在启动压力机之前，将材料堆叠，特别是具有多层液晶聚合物的材料堆叠放置在固定装置的开口内，以层压位于固定装置内的材料堆叠。

公开(公告)号：US20070234560A1

公开(公告)日：2007-10-11

申请号：US11749100

申请日：2007-05-15

Applicant: Steven Dutton

Inventor： Steven Dutton

IPC: H05K3/36 ,  H05K1/00

CPC classification number: H05K3/4611 ,  B32B37/0046 ,  B32B37/12 ,  B32B2305/55 ,  B32B2309/68 ,  B32B2457/08 ,  H05K2201/0141 ,  H05K2201/2018 ,  H05K2201/2036 ,  H05K2203/085 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53196 ,  Y10T29/532

Abstract: A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Abstract translation: 一种用于生产高层数，多层电路的方法和装置，包括制造其中具有开口的固定装置，用于放置在压机内。 在启动压力机之前，将材料堆叠，特别是具有多层液晶聚合物的材料堆叠放置在固定装置的开口内，以层压位于固定装置内的材料堆叠。

公开(公告)号：US06782971B2

公开(公告)日：2004-08-31

申请号：US10226439

申请日：2002-08-23

Applicant: Steven Dutton ,  John Phillips

Inventor： Steven Dutton ,  John Phillips

IPC: E04B182

CPC classification number: E04F13/12 ,  E04B1/80 ,  E04B2001/8263 ,  E04B2001/8442 ,  E04F13/0803 ,  E04F13/0875

Abstract: The present invention provides methods and apparatus for constructing an acoustic absorbing structure, such as a wall or enclosure, with removable and serviceable acoustic absorbing panels.

Abstract translation: 本发明提供用于构造具有可移除和可使用的吸声板的吸声结构（例如壁或外壳）的方法和装置。

公开(公告)号：US06581724B2

公开(公告)日：2003-06-24

申请号：US09843989

申请日：2001-04-27

Applicant: Steven Dutton ,  John Phillips

Inventor： Steven Dutton ,  John Phillips

IPC: E04B100

CPC classification number: E04B1/8218

Abstract: The invention provides a method for acoustic closure of an installation of a row of sound isolation modules within a host building encompassing the modules. One or more acoustic absorbing closure panels are mounted to form a partition in front of the row of modules, thus forming two acoustically separate regions. The absorbing panels are comprised of one or more sound absorbing materials between a front and rear surface. The front surface faces the region exterior to the installation within the host building. The rear surface faces the installation.

公开(公告)号：US20070234562A1

公开(公告)日：2007-10-11

申请号：US11749102

申请日：2007-05-15

Applicant: Steven Dutton

Inventor： Steven Dutton

IPC: H05K3/36 ,  C04B37/00

CPC classification number: H05K3/4611 ,  B32B37/0046 ,  B32B37/12 ,  B32B2305/55 ,  B32B2309/68 ,  B32B2457/08 ,  H05K2201/0141 ,  H05K2201/2018 ,  H05K2201/2036 ,  H05K2203/085 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T29/5317 ,  Y10T29/53174 ,  Y10T29/53196 ,  Y10T29/532

Abstract: A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.