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    System and method for grating profile classification
    2.
    发明申请
    System and method for grating profile classification 有权
    光栅轮廓分类的系统和方法

    公开(公告)号：US20020188580A1

    公开(公告)日：2002-12-12

    申请号：US09737705

    申请日：2000-12-14

    Applicant: TIMBRE TECHNOLOGIES, INC.

    Inventor： Srinivas Doddi ,  Nickhil Jakatdar ,  Xinhui Niu

    IPC: G06F015/18 ,  G06G007/00

    CPC classification number: G02B5/18 ,  G03F7/70625 ,  Y10S706/934

    Abstract: Invention teaches a method and system for characterizing grating profile data. One embodiment is a method for characterizing grating profile data by clustering the grating profile data space and associating profile shape data to each cluster. Another aspect of the present invention is a system for classifying grating profile data comprising a cluster generator for generating clusters of grating profiles, for associating profile shape data to each cluster, and for linking the associated profile shape data to the grating profiles belonging to each cluster. The present invention includes a method and a system for evaluating input grating profile by comparing the profile data from the closest matching grating profile library instance with a set of acceptable ranges of profile data for the application; flagging the input grating profile if the profile data is outside the set of acceptable ranges; and presenting the profile data and flags associated with the input grating profile. The system is scalable and may operate in a distributed manner utilizing networks.

    Abstract translation: 发明教导了用于表征光栅轮廓数据的方法和系统。 一个实施例是通过聚集光栅轮廓数据空间并将轮廓形状数据与每个簇相关联来表征光栅轮廓数据的方法。 本发明的另一方面是一种用于对光栅轮廓数据进行分类的系统，该系统包括用于产生光栅轮廓的簇的簇发生器，用于将轮廓形状数据与每个簇相关联，并且用于将相关轮廓形状数据链接到属于每个簇的光栅轮廓 。 本发明包括一种方法和系统，用于通过将来自最近匹配的光栅轮廓库实例的轮廓数据与应用的轮廓数据的一组可接受的范围进行比较来评估输入光栅轮廓; 如果轮廓数据在可接受的范围之外，则标记输入光栅轮廓; 并呈现与输入光栅轮廓相关联的轮廓数据和标记。 该系统是可扩展的，并且可以利用网络以分布式方式运行。

    Optical metrology of single features
    5.
    发明申请
    Optical metrology of single features 失效

    公开(公告)号：US20040212812A1

    公开(公告)日：2004-10-28

    申请号：US10853060

    申请日：2004-05-24

    Applicant: Timbre Technologies, Inc.

    Inventor： Joerg Bischoff ,  Xinhui Niu ,  Junwei Bao

    IPC: G01B011/24

    CPC classification number: G01B11/24 ,  G01N21/4788

    Abstract: The profile of a single feature formed on a wafer can be determined by obtaining an optical signature of the single feature using a beam of light focused on the single feature. The obtained optical signature can then be compared to a set of simulated optical signatures, where each simulated optical signature corresponds to a hypothetical profile of the single feature and is modeled based on the hypothetical profile.

    Balancing planarization of layers and the effect of underlying structure on the metrology signal
    8.
    发明申请
    Balancing planarization of layers and the effect of underlying structure on the metrology signal 失效
    平衡层的平面化和底层结构对计量信号的影响

    公开(公告)号：US20040147048A1

    公开(公告)日：2004-07-29

    申请号：US10757689

    申请日：2004-01-13

    Applicant: Timbre Technologies, Inc.

    Inventor： Nickhil Jakatdar ,  Xinhui Niu

    IPC: H01L021/66

    CPC classification number: H01L22/32 ,  G01N21/4788 ,  G01N21/9501 ,  G01N21/956 ,  H01L21/31053

    Abstract: The present invention includes a method and system for identifying an underlying structure that achieves improved planarization characteristics of layers while minimizing introduction of random and/or systematic noise to the reflected metrology signal. One embodiment of the present invention is a method of designing underlying structures in a wafer with pads of varying sizes and varying loading factors, and selecting the design of pads that yield a reflected metrology signal closest to the calibration metrology signal and that meet preset standard planarization characteristics. Another embodiment is a method of designing underlying structures with random shapes of varying sizes and varying loading factors. Still another embodiment is the use of periodic structures of varying line-to-space ratios in one or more underlying layers of a wafer, the periodicity of the underlying periodic structure being positioned at an angle relative to the direction of periodicity of the target periodic structure of the wafer. The present invention also includes a system for selecting an underlying structure design that balances planarization and optical metrology objectives for a target structure comprising a wafer fabricator, a planarizer, a layer profiler, an optical metrology device, and a selector for the selecting the design of underlying structure that yields a reflected metrology signal closest to the calibration metrology signal and where the planarized surfaces meet preset standard planarization characteristics.

    Abstract translation: 本发明包括用于识别实现层的改进的平面化特性的基础结构的方法和系统，同时最小化随机和/或系统噪声对反射的测量信号的引入。 本发明的一个实施例是一种在具有不同尺寸和不同负载系数的焊盘的晶片中设计底层结构的方法，并且选择产生最接近校准度量信号的反射测量信号并且满足预设标准平面化的焊盘的设计 特点 另一个实施例是设计具有不同尺寸和变化的负载因子的随机形状的底层结构的方法。 另一个实施例是使用在晶片的一个或多个下层中具有不同的线间空间比的周期性结构，下面周期性结构的周期性相对于目标周期结构的周期方向定位成一定角度 的晶片。 本发明还包括用于选择平衡化的平面化和光学测量目标的基础结构设计的系统，所述目标结构包括晶片制造器，平面化器，层分析器，光学测量装置和用于选择设计的选择器 底层结构产生最接近校准计量信号的反射计量信号，其中平坦化表面满足预设的标准平面化特性。

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