公开(公告)号：US20240339482A1

公开(公告)日：2024-10-10

申请号：US18628607

申请日：2024-04-05

Applicant: Teledyne FLIR Commercial Systems, Inc.

Inventor： Eric A. Kurth ,  Marin Sigurdson ,  Robert F. Cannata

IPC: H01L27/146 ,  G01J5/00 ,  G01J5/02 ,  G01J5/20 ,  G01J5/24 ,  H04N5/33 ,  H04N25/75

CPC classification number: H01L27/14669 ,  G01J5/023 ,  G01J5/024 ,  G01J5/20 ,  G01J5/24 ,  H01L27/14636 ,  H01L27/14649 ,  H01L27/14683 ,  H04N5/33 ,  H04N25/75 ,  G01J2005/0077 ,  G01J2005/202

Abstract: Microbolometer systems and methods are provided herein. For example, an infrared imaging device includes a substrate having contacts and a surface. The surface defines a plane. The infrared imaging device further includes a microbolometer array coupled to the substrate. Each microbolometer of the microbolometer array includes a cross-section having a first section, a second section substantially parallel to the first section, and a third section joining the first section and the second section.

公开(公告)号：US20240304361A1

公开(公告)日：2024-09-12

申请号：US18595669

申请日：2024-03-05

Applicant: TDK CORPORATION

Inventor： Maiko KOKUBO ,  Shinji Hara ,  Naoki Ohta ,  Susumu Aoki

IPC: H01C7/00 ,  G01J5/20

CPC classification number: H01C7/008 ,  G01J5/20 ,  G01J2005/202

Abstract: A thermistor element includes: a thermistor film formed of an oxide having a spinel crystal structure; a first surface-side electrode provided in contact with a first surface of the thermistor film; and a second surface-side electrode provided in contact with a second surface of the thermistor film, wherein the first surface-side electrode includes a first electrode and a second electrode, and at least a part of the first electrode and at least a part of the second electrode are disposed to overlap the second surface-side electrode, and in the thermistor film, an oxygen concentration of a second region between the first electrode and the second electrode in a plan view is higher than that of a first region consisting of a region that overlaps the first electrode and the second surface-side electrode and a region that overlaps the second electrode and the second surface-side electrode.

公开(公告)号：US20240142311A1

公开(公告)日：2024-05-02

申请号：US18215477

申请日：2023-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinmyoung Kim ,  Choongho Rhee ,  Byonggwon Song ,  Yongseop Yoon ,  Jaekwan Kim ,  Jangwoo You ,  Byungkyu Lee

IPC: G01J5/22

CPC classification number: G01J5/22 ,  G01J2005/202

Abstract: Provided are a long-wave infrared sensor and an electronic device including the same. The long-wave infrared sensor and the electronic device including the same include a pixel array including a plurality of pixels, an optical absorber layer arranged on the pixel array, and a drive circuit configured to drive the pixel array, wherein each of the plurality of pixels for a long-wave infrared sensor includes a lower electrode and an upper electrode which are arranged apart from each other, and a plurality of magnetic tunnel junction devices arranged regularly between the lower electrode and the upper electrode and electrically connected to each other in parallel, and the plurality of magnetic tunnel junction devices are arranged apart from each other with an empty space therebetween.

公开(公告)号：US20230296443A1

公开(公告)日：2023-09-21

申请号：US18180297

申请日：2023-03-08

Applicant: TDK Corporation

Inventor： Naoki OHTA ,  Shinji HARA ,  Susumu AOKI ,  Maiko KOKUBO ,  Kazuya MAEKAWA ,  Tadao SENRIUCHI

IPC: G01J5/20

CPC classification number: G01J5/20 ,  G01J2005/202

Abstract: Electromagnetic wave sensor (infrared sensor) 1 has: a first substrate; a second substrate that faces the first substrate and that allows infrared rays to pass through at least a part of the second substrate; first circumferential wall 4a that is positioned between the first substrate and the second substrate and that forms first space 8a together with the first and second substrates; bolometer structures 7 that are provided in first space 8a; first measuring element 9a that is provided in first space 8a and that is used for taking a first measurement relating to pressure P1 in first space 8a; and a monitoring portion. The monitoring portion acquires the first measurement that is taken using first measuring element 9a and outputs a predetermined signal indicating an abnormality based on at least the first measurement.

公开(公告)号：US11733102B2

公开(公告)日：2023-08-22

申请号：US17713483

申请日：2022-04-05

Applicant: NEC Corporation

Inventor： Tomo Tanaka

IPC: G01J5/08 ,  G01J5/22 ,  G01J5/20

CPC classification number: G01J5/0853 ,  G01J5/22 ,  G01J2005/202

Abstract: An example object of the present invention is to provide a bolometer-type detector capable of reducing heat transfer between pixels. A bolometer-type detector according to an example aspect of the present invention includes a plurality of pixels, and at least includes: a substrate, a heat insulating layer provided on the substrate, bolometer films provided on individual pixels on the heat insulating layer, and a wiring for signal output connected to contact electrodes provided in contact with the bolometer films, wherein the wiring for signal output is disposed in a layer different from the bolometer films, and the heat insulating layer between adjacent pixels is removed at least partially in the depth direction and in a region of a length of 50% or longer and a width of 100 nm or wider of a closed curve that surrounds each bolometer film.

公开(公告)号：US20230213390A1

公开(公告)日：2023-07-06

申请号：US17836568

申请日：2022-06-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinmyoung KIM ,  Byonggwon SONG ,  Yooseong YANG ,  Duhyun LEE ,  Byungkyu LEE

IPC: G01J5/20 ,  G01J5/58

CPC classification number: G01J5/20 ,  G01J5/58 ,  G01J2005/202

Abstract: A long wavelength infrared sensor includes a first magnetoresistive unit; a second magnetoresistive unit; and a light absorption layer that absorbs light and emits heat, wherein the first magnetoresistive unit includes a first magnetoresistive element and a second magnetoresistive element electrically connected to each other, the second magnetoresistive unit includes a third magnetoresistive element and a fourth magnetoresistive element electrically connected to each other, the first and third magnetoresistive elements each have an antiparallel state of magnetization direction, the second and fourth magnetoresistive elements each have a parallel state of magnetization direction, and the first magnetoresistive element is electrically connected to the third magnetoresistive element by way of the second magnetoresistive element.

公开(公告)号：US20180067143A1

公开(公告)日：2018-03-08

申请号：US15259106

申请日：2016-09-08

Applicant: Robert Bosch GmbH

Inventor： Seow Yuen Yee ,  Gary Yama ,  Thomas Rocznik

IPC: G01P5/26 ,  G01P13/00

CPC classification number: G01P5/26 ,  G01F1/68 ,  G01F1/684 ,  G01F1/69 ,  G01F1/696 ,  G01F1/699 ,  G01J5/0037 ,  G01J5/0265 ,  G01J5/045 ,  G01J5/06 ,  G01J5/061 ,  G01J5/0887 ,  G01J5/20 ,  G01J2005/063 ,  G01J2005/202 ,  G01P13/0006

Abstract: A sensor comprises a substrate having a first surface; a cap structure connected to the substrate, the cap structure configured to define a cavity between an inner surface of the cap structure and the first surface of the substrate, the cap structure configured to block infrared radiation from entering the cavity from outside the cap structure; a plurality of absorbers, each absorber in the plurality of absorbers being connected to the first surface of the substrate and arranged at a respective position within the cavity and configured to absorb infrared radiation at the respective position within the cavity; and a plurality of readout circuits, each readout circuit in the plurality of readout circuits being connected to a respective absorber in the plurality of absorbers and configured to provide a measurement signal that indicates an amount of infrared radiation absorbed by the respective absorber.

公开(公告)号：US20170370776A1

公开(公告)日：2017-12-28

申请号：US15542425

申请日：2016-01-08

Applicant: Apple Inc.

Inventor： Miikka M. KANGAS ,  Michael J. BISHOP ,  Robert CHEN ,  David I. SIMON ,  Harold L. SONTAG III ,  George Dee SKIDMORE

IPC: G01J5/08 ,  G01J4/04 ,  G01J5/20

CPC classification number: G01J5/0825 ,  G01J4/04 ,  G01J5/0225 ,  G01J5/0846 ,  G01J5/0853 ,  G01J5/20 ,  G01J2005/202

Abstract: This relates to sensor systems, detectors, imagers, and readout integrated circuits (ROICs) configured to selectively detect one or more frequencies or polarizations of light, capable of operating with a wide dynamic range, or any combination thereof. In some examples, the detector can include one or more light absorbers; the patterns and/or properties of a light absorber can be configured based on the desired measurement wavelength range and/or polarization direction. In some examples, the detector can comprise a plurality of at least partially overlapping light absorbers for enhanced dynamic range detection. In some examples, the detector can be capable of electrostatic tuning for one or more flux levels by varying the response time or sensitivity to account for various flux levels. In some examples, the ROIC can be capable of dynamically adjusting at least one of the frame rate integrating capacitance, and power of the illumination source.

公开(公告)号：US09813644B1

公开(公告)日：2017-11-07

申请号：US14744779

申请日：2015-06-19

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： Paul E. Jackson ,  Clara R. Baleine ,  Christopher P. Voita

IPC: G01J1/04 ,  H04N5/33 ,  G01J1/42 ,  G01J1/44

CPC classification number: H04N5/33 ,  G01J1/0407 ,  G01J1/0448 ,  G01J1/4228 ,  G01J1/44 ,  G01J5/046 ,  G01J5/0825 ,  G01J5/0837 ,  G01J5/0896 ,  G01J2001/448 ,  G01J2005/0077 ,  G01J2005/202

Abstract: An infrared imager includes a first optical component, a second optical component, and at least one thin film dielectric layer. The first optical component has multiple first parallel conductors with a first spacing pattern, aligned in a plane perpendicular to an axis. The second optical component has multiple second parallel conductors with a second spacing pattern, aligned in a plane perpendicular to the axis, angularly offset from the first direction. The thin film dielectric layer includes a refractive index change (RIC) material disposed between and in contact with the first and second parallel conductors. The first optical component, second optical component, and at least one thin film dielectric layer form an antenna array configured to detect one or more predetermined infrared wavelengths based on at least one of the first spacing pattern or the second spacing pattern or the angular offset.

公开(公告)号：US09726548B2

公开(公告)日：2017-08-08

申请号：US14925753

申请日：2015-10-28

Applicant: STMicroelectronics SA

Inventor： Hani Sherry ,  Andreia Cathelin ,  Andreas Kaiser ,  Ullrich Pfeiffer ,  Janusz Grzyb ,  Yan Zhao

IPC: G01J5/22 ,  G01J5/10 ,  G01N21/3581 ,  G01J5/20 ,  H01Q23/00 ,  G01J5/00

CPC classification number: G01J5/22 ,  G01J5/10 ,  G01J5/20 ,  G01J2005/0077 ,  G01J2005/202 ,  G01N21/3581 ,  H01Q23/00 ,  Y10T29/49018

Abstract: A terahertz imager includes an array of pixel circuits. Each pixel circuit has an antenna and a detector. The detector is coupled to differential output terminals of the antenna. A frequency oscillator is configured to generate a frequency signal on an output line. The output line is coupled to an input terminal of the antenna of at least one of the pixel circuits.