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    Hole in pad thermal management
    1.
    发明授权
    Hole in pad thermal management 有权
    孔中垫热管理

    公开(公告)号：US08575492B2

    公开(公告)日：2013-11-05

    申请号：US13396485

    申请日：2012-02-14

    Applicant: Lee H. Tullidge ,  Leonard De Oto ,  Tim Larson ,  Patrick O'Keefe ,  Herb Gertz

    Inventor： Lee H. Tullidge ,  Leonard De Oto ,  Tim Larson ,  Patrick O'Keefe ,  Herb Gertz

    IPC: H05K1/00

    CPC classification number: H05K1/0206 ,  H05K1/113 ,  H05K3/108 ,  H05K3/243 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/1492 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.

    Abstract translation: 散热表面贴装器件（SMD）元件的器件和方法。 在一个示例性方法中，通孔形成在印刷电路板（PCB）中，第一铜层被无电镀在孔中，第二铜层标准镀在PCB的孔和周围表面中，第三铜层是 屏蔽并脉冲电镀在孔中，孔中填充有非导电材料，然后与第二铜层进行砂光冲洗。 在PCB上的无孔电镀第四铜层，在孔的区域上镀有PCB上的第五铜层（或焊盘），以及表面贴装装置附着在第五铜层上。

    HOLE IN PAD THERMAL MANAGEMENT
    2.
    发明申请
    HOLE IN PAD THERMAL MANAGEMENT 有权
    密封垫热管理

    公开(公告)号：US20090090540A1

    公开(公告)日：2009-04-09

    申请号：US11868871

    申请日：2007-10-08

    Applicant: Lee H. Tullidge ,  Leonard De Oto ,  Tim Larson ,  Patrick O'Keefe ,  Herb Gertz

    Inventor： Lee H. Tullidge ,  Leonard De Oto ,  Tim Larson ,  Patrick O'Keefe ,  Herb Gertz

    IPC: H01B13/00 ,  H05K1/00

    CPC classification number: H05K1/0206 ,  H05K1/113 ,  H05K3/108 ,  H05K3/243 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/1492 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.

    Abstract translation: 散热表面贴装器件（SMD）元件的器件和方法。 在一个示例性方法中，通孔形成在印刷电路板（PCB）中，第一铜层被无电镀在孔中，第二铜层标准镀在PCB的孔和周围表面中，第三铜层是 屏蔽并脉冲电镀在孔中，孔中填充有非导电材料，然后与第二铜层进行砂光冲洗。 在PCB上的无孔电镀第四铜层，在孔的区域上镀有PCB上的第五铜层（或焊盘），以及表面贴装装置附着在第五铜层上。

    Transportable mass data storage system
    3.
    发明申请
    Transportable mass data storage system 审中-公开
    可移动大容量数据存储系统

    公开(公告)号：US20050099766A1

    公开(公告)日：2005-05-12

    申请号：US10807513

    申请日：2004-03-22

    Applicant: Peter Fraley ,  Ronald Major ,  Tim Larson ,  Adam Blomberg ,  Slava Gekht ,  Dale Hoepner ,  Rodney Berg ,  Richard Vignes ,  Jeffrey Haider

    Inventor： Peter Fraley ,  Ronald Major ,  Tim Larson ,  Adam Blomberg ,  Slava Gekht ,  Dale Hoepner ,  Rodney Berg ,  Richard Vignes ,  Jeffrey Haider

    IPC: G06F1/16 ,  G11B27/36 ,  G11B33/12 ,  H05B1/00 ,  H05B3/00

    CPC classification number: G11B33/126 ,  G11B27/36 ,  G11B33/128

    Abstract: The invention provides apparatus and methods for a removable and transportable mass data storage system assimilating multiple levels of abstraction, automation and hot-swappable, fault-tolerant modularization. In providing such a system, a means for or method of reducing or bypassing the amount of time needed for information exchange before such system can be removed and transported is provided. The means or method enables the information to be quickly physically transported from a hardware platform in which it was acquired to a hardware venue in which it could be examined, offloaded, stored, safeguarded, or the like. The means or method would enable rapid insertion of blank media for an immediate continuance of any originating process. The means or method would facilitate rapid exchanges of databases, expert systems, multimedia content, reconnoitered information, and the like.

    Abstract translation: 本发明提供用于可吸收和可传输的大容量数据存储系统的装置和方法，其吸收多级抽象，自动化和热插拔，容错模块化。 在提供这种系统的过程中，提供了一种减少或绕过信息交换所需的时间量的手段或方法。 手段或方法使得信息能够从被获取的硬件平台快速物理地运送到可以被检查，卸载，存储，保护等的硬件场所。 方法或方法将能够快速插入空白介质，以便立即继续任何始发方法。 手段或方法将有助于数据库，专家系统，多媒体内容，侦察信息等的快速交换。

    Independent electronics equipment heater using phase width modulation
    4.
    发明申请
    Independent electronics equipment heater using phase width modulation 审中-公开
    独立电子设备加热器采用相位调制

    公开(公告)号：US20050092727A1

    公开(公告)日：2005-05-05

    申请号：US10807522

    申请日：2004-03-22

    Applicant: Peter Fraley ,  Ronald Major ,  Tim Larson ,  Slava Gekht ,  Rodney Berg ,  Richard Vignes ,  Jeffrey Haider

    Inventor： Peter Fraley ,  Ronald Major ,  Tim Larson ,  Slava Gekht ,  Rodney Berg ,  Richard Vignes ,  Jeffrey Haider

    IPC: G06F1/16 ,  G11B27/36 ,  G11B33/12 ,  H05B1/00 ,  H05B3/00

    CPC classification number: G11B33/126 ,  G11B27/36 ,  G11B33/128

    Abstract: The invention provides an apparatus comprised of a heater system used for a mass data storage module. The system is configured to maintain the correct operating temperature for drives of the module when the ambient temperature and/or initial, starting temperature is outside of the range of temperatures required for reliable operation of the drives and as appropriate, to report issues to a user via in-band (i.e., the host system data path) and out-of-band (supplemental user communication links) interfaces. Pulse width modulation is used in distributing heat across the drives with the implementation of a rotating “seed” methodology, rather than a variable duty cycle.

    Abstract translation: 本发明提供一种包括用于大容量数据存储模块的加热器系统的装置。 当环境温度和/或初始起始温度超出驱动器的可靠运行所需的温度范围并且适当地将问题报告给用户时，该系统被配置为为模块的驱动器维持正确的操作温度 通过带内（即，主机系统数据路径）和带外（补充用户通信链路）接口。 脉冲宽度调制用于通过实施旋转“种子”方法而不是可变占空比来分配驱动器中的热量。

    HOLE IN PAD THERMAL MANAGEMENT
    5.
    发明申请
    HOLE IN PAD THERMAL MANAGEMENT 有权
    密封垫热管理

    公开(公告)号：US20120138341A1

    公开(公告)日：2012-06-07

    申请号：US13396485

    申请日：2012-02-14

    Applicant: Lee H. Tullidge ,  Leonard De Oto ,  Tim Larson ,  Patrick O'Keefe ,  Herb Gertz

    Inventor： Lee H. Tullidge ,  Leonard De Oto ,  Tim Larson ,  Patrick O'Keefe ,  Herb Gertz

    IPC: H05K7/20

    CPC classification number: H05K1/0206 ,  H05K1/113 ,  H05K3/108 ,  H05K3/243 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/1492 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer.

    Abstract translation: 散热表面贴装器件（SMD）元件的器件和方法。 在一个示例性方法中，通孔形成在印刷电路板（PCB）中，第一铜层被无电镀在孔中，第二铜层标准镀在PCB的孔和周围表面中，第三铜层是 屏蔽并脉冲电镀在孔中，孔中填充有非导电材料，然后与第二铜层进行砂光冲洗。 在PCB上的无孔电镀第四铜层，在孔的区域上镀有PCB上的第五铜层（或焊盘），以及表面贴装装置附着在第五铜层上。

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