MOS TRANSISTOR USING STRESS CONCENTRATION EFFECT FOR ENHANCING STRESS IN CHANNEL AREA
    1.
    发明申请
    MOS TRANSISTOR USING STRESS CONCENTRATION EFFECT FOR ENHANCING STRESS IN CHANNEL AREA 审中-公开
    使用应力集中效应的MOS晶体管增强通道的应力

    公开(公告)号:US20130137235A1

    公开(公告)日:2013-05-30

    申请号:US13512415

    申请日:2011-04-22

    Abstract: A MOS transistor (60, 62) is provided. The structure of the transistor (60, 62) includes: a semiconductor substrate (10), a channel area (20, 24), source/drain regions (22, 26), a gate (30, 32), a gate insulating layer (11), a shallow trench isolation region (12), a passive layer (50, 52), and holes (40, 42) formed with a certain distance to the gate insulating layer (11). Wherein both the shapes of the holes (40, 42) and the Young's modulus' difference between the material in the holes (40, 42) and that around the holes (40, 42) contribute to the stress concentration effect, thus the stress in the channel area (20, 24) is enhanced. The structure of the transistor (60, 62) can greatly reduce the stress attenuation during the transmission from stress resource to the sensitive region, and concentrate the stress in the sensitive region. The structure can be involved in large size device, especially.

    Abstract translation: 提供了MOS晶体管(60,62)。 晶体管(60,62)的结构包括:半导体衬底(10),沟道区(20,24),源极/漏极区(22,26),栅极(30,32),栅极绝缘层 (11),浅沟槽隔离区(12),钝化层(50,52)和与栅绝缘层(11)形成一定距离的孔(40,42)。 其中孔(40,42)的形状和孔(40,42)中的材料与孔(40,42)周围的材料之间的杨氏模量差都有助于应力集中效应,因此应力 增加了通道区域(20,24)。 晶体管(60,62)的结构可以大大降低从应力资源向敏感区域传输过程中的应力衰减,并将应力集中在敏感区域。 该结构可以涉及大尺寸装置,特别是。

    Medicine bottle
    4.
    外观设计

    公开(公告)号:USD1007842S1

    公开(公告)日:2023-12-19

    申请号:US29893747

    申请日:2023-06-02

    Applicant: Weijie Zhou

    Designer: Weijie Zhou

    Abstract: FIG. 1 is a perspective view of a medicine bottle showing my new design;
    FIG. 2 is a front elevation view thereof;
    FIG. 3 is a rear elevation view thereof;
    FIG. 4 is a left side elevation view thereof;
    FIG. 5 is a right side elevation view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof; and,
    FIG. 8 is another perspective view thereof.

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