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    Crystalline silicon ingot and method of fabricating the same
    1.
    发明授权
    Crystalline silicon ingot and method of fabricating the same 有权
    结晶硅锭及其制造方法

    公开(公告)号：US09133565B2

    公开(公告)日：2015-09-15

    申请号：US13430131

    申请日：2012-03-26

    Applicant: Wen-Chieh Lan ,  Yong-Cheng Yu ,  Wen-Huai Yu ,  Sung-Lin Hsu ,  Wen-Ching Hsu

    Inventor： Wen-Chieh Lan ,  Yong-Cheng Yu ,  Wen-Huai Yu ,  Sung-Lin Hsu ,  Wen-Ching Hsu

    IPC: C30B11/02 ,  C30B11/14 ,  C30B29/06 ,  C30B11/00

    CPC classification number: C30B11/02 ,  C30B11/00 ,  C30B11/14 ,  C30B29/06

    Abstract: A crystalline silicon ingot and a method of manufacturing the same are provided. Using a crystalline silicon seed layer, the crystalline silicon ingot is formed by a directional solidification process. The crystalline silicon seed layer is formed of multiple primary monocrystalline silicon seeds and multiple secondary monocrystalline silicon seeds. Each of the primary monocrystalline silicon seeds has a first crystal orientation different from (100). Each of the secondary monocrystalline silicon seeds has a second crystal orientation different from the first crystal orientation. Each of the primary monocrystalline silicon seeds is adjacent to at least one of the secondary monocrystalline silicon seeds, and separate from the others of the primary monocrystalline silicon seeds.

    Abstract translation: 提供一种晶体硅锭及其制造方法。 使用结晶硅籽晶层，通过定向凝固工艺形成晶体硅锭。 晶体硅种子层由多个初级单晶硅晶种和多个次级单晶硅晶种形成。 每个初级单晶硅种子具有不同于（100）的第一晶体取向。 每个次级单晶硅种子具有不同于第一晶体取向的第二晶体取向。 每个初级单晶硅种子与次级单晶硅种子中的至少一种相邻，并与主要单晶硅晶种的其它晶体分离。

    FRACTURE AWARE OPC
    2.
    发明申请
    FRACTURE AWARE OPC 有权

    公开(公告)号：US20140013287A1

    公开(公告)日：2014-01-09

    申请号：US13544014

    申请日：2012-07-09

    Applicant: Nian-Fuh Cheng ,  Yu-Po Tang ,  Chien-Fu Lee ,  Sheng-Wen Lin ,  Yong-Cheng Lin ,  Wen-Chun Huang ,  Ru-Gun Liu

    Inventor： Nian-Fuh Cheng ,  Yu-Po Tang ,  Chien-Fu Lee ,  Sheng-Wen Lin ,  Yong-Cheng Lin ,  Wen-Chun Huang ,  Ru-Gun Liu

    IPC: G06F17/50

    CPC classification number: G03F7/70441 ,  G03F1/36 ,  G03F1/70

    Abstract: The present disclosure describes an OPC method of preparing data for forming a mask. The method includes setting a plurality of dissection points at the main feature and further includes setting a target point at the main feature. The method includes arranging the two dissection points crossing the main feature symmetrically each other. The method includes separating two adjacent dissection points at one side of the main feature by a maximum resolution of the mask writer. The method includes dividing the main feature into a plurality of segments using the dissection points. The method includes performing an OPC convergence simulation to a target point. The method includes correcting the segments belonging to an ambit of the target point and further includes correcting the segment shared by two ambits.

    Abstract translation: 本公开描述了制备用于形成掩模的数据的OPC方法。 该方法包括在主要特征处设置多个解剖点，并且还包括在主要特征处设置目标点。 该方法包括将两个解剖点布置成彼此对称的主要特征。 该方法包括通过掩模写入器的最大分辨率在主要特征的一侧分离两个相邻的解剖点。 该方法包括使用解剖点将主要特征划分成多个段。 该方法包括对目标点执行OPC收敛模拟。 该方法包括校正属于目标点的范围的段，并且还包括校正由两个方位共享的段。

    Highly resistant granular starch
    7.
    发明授权
    Highly resistant granular starch 失效
    高度耐磨的颗粒淀粉

    公开(公告)号：US06664389B1

    公开(公告)日：2003-12-16

    申请号：US09671523

    申请日：2000-09-27

    Applicant: Yong-Cheng Shi ,  Roger Jeffcoat

    Inventor： Yong-Cheng Shi ,  Roger Jeffcoat

    IPC: C08B3100

    CPC classification number: C08B30/12 ,  A23L29/212 ,  A23L29/35 ,  C08B30/20

    Abstract: Highly resistant granular starches may be produced which have unique and useful properties, including high enzyme resistance, dietary fiber, a unique molecular weight distribution, a high melting temperature and a high heat of gelatinization (Delta H) indicative of excellent processing tolerance. These starches may be prepared for example by heating a high amylose starch having at least 40% by weight amylose content and at a percent moisture and temperature insufficient to destroy the granular nature of the starch, and digesting the amorphous regions using alpha-amylase or a chemical reagent.

    Abstract translation: 可以生产具有独特且有用的特性的高抗性颗粒状淀粉，包括高耐酶性，膳食纤维，独特的分子量分布，高熔融温度和高的凝胶化热（Delta H），表明优异的加工耐受性。 这些淀粉可以例如通过加热具有至少40重量％直链淀粉含量的高直链淀粉和水分和温度百分比不足以破坏淀粉的颗粒性质，以及使用α-淀粉酶或 化学试剂。

    Universal optical signal receiver
    8.
    发明授权
    Universal optical signal receiver 失效
    通用光信号接收机

    公开(公告)号：US5907422A

    公开(公告)日：1999-05-25

    申请号：US779204

    申请日：1997-01-06

    Applicant: Ching Ho ,  Yue-Syan Jou ,  Chun-Meng Su ,  Peter Wang ,  Yong Cheng Tu

    Inventor： Ching Ho ,  Yue-Syan Jou ,  Chun-Meng Su ,  Peter Wang ,  Yong Cheng Tu

    IPC: H04B10/158 ,  H04B10/06

    CPC classification number: H04B10/6931

    Abstract: An optical receiver communication system converts optical signals modulated by analog or digital waveforms to RF signals. The optical receiver contains an automatic level control circuit to adjust the electronic gain of the system across a broad bandwidth spectrum. Two impedance matching circuits are designed using broad band matching technique to expand the bandwidth for increasing the maximum receivable frequencies to 1 GHz. A RLC impedance matching circuit forms a resonant combination to maintain .+-.1 dB fluctuation between the low-and-high-frequency limits of the bandwidth, and a 75.OMEGA. impedance matching circuit creates a 180.degree. phase shift between outgoing and incoming signals to ensure low return loss.

    Abstract translation: 光接收机通信系统将由模拟或数字波形调制的光信号转换为RF信号。 光接收器包含一个自动电平控制电路，用于在宽带宽频谱上调整系统的电子增益。 使用宽带匹配技术设计两个阻抗匹配电路，以扩大带宽以将最大可接收频率增加到1GHz。 RLC阻抗匹配电路形成谐振组合，以在带宽的低频和高频极限之间保持+/- 1dB的波动，并且75个OMEGA阻抗匹配电路在输出和输入信号之间产生180°的相移 确保低回报损失。

    Educational toy
    9.
    外观设计
    Educational toy 有权

    公开(公告)号：USD1026110S1

    公开(公告)日：2024-05-07

    申请号：US29875419

    申请日：2023-05-04

    Applicant: Yong Cheng

    Designer： Yong Cheng

    Abstract: FIG. 1 is a front, right, bottom perspective view of the educational toy, showing my new design;
    FIG. 2 is a front elevation view thereof;
    FIG. 3 is a rear elevation view thereof;
    FIG. 4 is a left side elevation view thereof;
    FIG. 5 is a right side elevation view thereof;
    FIG. 6 is a top plan view thereof; and,
    FIG. 7 is a bottom plan view thereof.
    The broken lines in the figures are for the purpose of illustrating portions of the educational toy and form no part of the claimed design.

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