公开(公告)号：US20130168137A1

公开(公告)日：2013-07-04

申请号：US13732125

申请日：2012-12-31

Applicant: Peking Unicersity Founder Group Co., Ltd. ,  Zhuhai Founder Tech. Multilayer PCB Co., Ltd. ,  Zhuhai Founder PCB Development Co., Ltd.

Inventor： Yansheng HUA

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/46 ,  H05K1/0201 ,  H05K1/0204 ,  H05K3/4611 ,  H05K3/4694 ,  H05K2201/10416 ,  Y10T156/1056

Abstract: A method of fabricating a printed circuit board is disclosed. The method includes opening a first window in a first base board and opening a second window in a second base board and a resin layer. The resin layer is between the second base board and the first base board. The method further includes bonding the first base board and the second base board through the resin layer; placing a heat dissipating conductor in the first window in the first base board through the second window; placing a resin portion on the first base board in the second window; embedding a sub-board in the second window of the second base board; and bonding the sub-board with the first base board through the resin portion.

Abstract translation: 公开了一种制造印刷电路板的方法。 该方法包括在第一基板中打开第一窗口并在第二基板和树脂层中打开第二窗口。 树脂层位于第二基板和第一基板之间。 该方法还包括通过树脂层将第一基板和第二基板接合; 通过第二窗口将散热导体放置在第一基板中的第一窗口中; 将树脂部分放置在第二窗口中的第一基板上; 将子板嵌入第二基板的第二窗口中; 以及通过所述树脂部分将所述子板与所述第一基板接合。

公开(公告)号：US09101084B2

公开(公告)日：2015-08-04

申请号：US13732125

申请日：2012-12-31

Applicant: PEKING UNIVERSITY FOUNDER GROUP CO., LTD. ,  ZHUHAI FOUNDER TECH. MULTILAYER PCB CO., LTD. ,  ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD.

Inventor： Yansheng Hua

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/46 ,  H05K1/0201 ,  H05K1/0204 ,  H05K3/4611 ,  H05K3/4694 ,  H05K2201/10416 ,  Y10T156/1056

Abstract: A method of fabricating a printed circuit board is disclosed. The method includes opening a first window in a first base board and opening a second window in a second base board and a resin layer. The resin layer is between the second base board and the first base board. The method further includes bonding the first base board and the second base board through the resin layer; placing a heat dissipating conductor in the first window in the first base board through the second window; placing a resin portion on the first base board in the second window; embedding a sub-board in the second window of the second base board; and bonding the sub-board with the first base board through the resin portion.

Abstract translation: 公开了一种制造印刷电路板的方法。 该方法包括在第一基板中打开第一窗口并在第二基板和树脂层中打开第二窗口。 树脂层位于第二基板和第一基板之间。 该方法还包括通过树脂层将第一基板和第二基板接合; 通过第二窗口将散热导体放置在第一基板中的第一窗口中; 将树脂部分放置在第二窗口中的第一基板上; 将子板嵌入第二基板的第二窗口中; 以及通过所述树脂部分将所述子板与所述第一基板接合。

公开(公告)号：US20130168314A1

公开(公告)日：2013-07-04

申请号：US13730444

申请日：2012-12-28

Applicant: PEKING UNIVERSITY FOUNDER GROUP CO. LTD. ,  ZHUHAI FOUNDER TECH. MULTILAYER PCB CO., LTD. ,  ZHUHAI FOUNDER PCB DEVELOPMENT CO., LTD.

Inventor： Bo ZHOU

IPC: C02F1/62

CPC classification number: C02F1/62 ,  C02F1/56 ,  C02F1/66 ,  C02F2101/20 ,  C02F2101/303

Abstract: Disclosed is a method for treating wastewater containing at least one copper complex, comprising: 1) providing the wastewater containing the at least one copper complex, wherein the at least one copper complex is chosen from EDTA-Cu2+ complex and ammonia-Cu2+ complex; 2) adjusting pH of the wastewater containing the at least one copper complex to be within a range from 2.0 to 3.0, and adding ferrous sulfate to convert copper in the wastewater into a form of cuprous ions; and 3) adjusting pH of the wastewater obtained in step 2) to be within a range from 8.0 to 10.5, so that the cuprous ions in the wastewater are converted into precipitates of cuprous hydroxide and/or precipitates of cuprous oxide.

Abstract translation: 公开了一种处理含有至少一种铜络合物的废水的方法，包括：1）提供含有至少一种铜络合物的废水，其中所述至少一种铜络合物选自EDTA-Cu 2+络合物和氨-Cu2 +络合物; 2）将含有至少一种铜络合物的废水的pH调节在2.0〜3.0的范围内，并加入硫酸亚铁将废水中的铜转化为亚铜离子的形式; 和3）将步骤2）中获得的废水的pH调节在8.0至10.5的范围内，使得废水中的亚铜离子转化为氢氧化亚铜和/或氧化亚铜的沉淀物。