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    METHODS TO SELECTIVELY TREAT PORTIONS OF A SURFACE USING A SELF-REGISTERING MASK
    1.
    发明申请
    METHODS TO SELECTIVELY TREAT PORTIONS OF A SURFACE USING A SELF-REGISTERING MASK 审中-公开
    使用自注册掩模选择表面处理方法的方法

    公开(公告)号：US20150037923A1

    公开(公告)日：2015-02-05

    申请号：US14370321

    申请日：2013-01-06

    Applicant: 1366 TECHNOLOGIES, INC.

    Inventor： Vladimir S. Tarasov ,  Ali Ersen ,  ERIC Stern ,  Jason M. Criscione ,  Emanuel M. Sachs

    IPC: H01L31/0236 ,  H01L31/0248

    CPC classification number: H01L31/02363 ,  H01L31/0248 ,  Y02E10/50

    Abstract: Processes increase light absorption into silicon wafers by selectively changing the reflective properties of the bottom portions of light trapping cavity features. Modification of light trapping features includes: deepening the bottom portion, increasing the curvature of the bottom portion, and roughening the bottom portion, all accomplished through etching. Modification may also be by the selective addition of material at the bottom of cavity features. Different types of features in the same wafers may be treated differently. Some may receive a treatment that improves light trapping while another is deliberately excluded from such treatment. Some may be deepened, some roughened, some both. No alignment is needed to achieve this selectively. The masking step achieves self-alignment to previously created light trapping features due to softening and deformation in place.

    Abstract translation: 通过选择性地改变光阱特征的底部的反射特性，工艺增加了对硅晶片的光吸收。 光捕获特征的改进包括：深化底部部分，增加底部部分的曲率，以及粗糙化底部部分，全部通过蚀刻来实现。 修改也可以通过在腔体特征的底部选择性地添加材料。 不同类型的相同晶片中的特征可以被不同地对待。 有些可能会接受改善光线捕获的治疗方法，而另一种方法被故意排除在这种治疗之外。 有些可能会加深，有些粗糙，有的两个。 不需要对准以选择性地实现。 掩蔽步骤由于在现场的软化和变形而实现了先前产生的光捕获特征的自对准。

    Apparatus and Process for Depositing a Thin Layer of Resist on a Substrate
    2.
    发明申请
    Apparatus and Process for Depositing a Thin Layer of Resist on a Substrate 有权
    用于在基板上沉积薄层的薄膜的装置和方法

    公开(公告)号：US20140255615A1

    公开(公告)日：2014-09-11

    申请号：US14349087

    申请日：2012-10-12

    Applicant: 1366 TECHNOLOGIES, INC.

    Inventor： Guy M. Danner ,  Vladimir S. Tarasov ,  Peter E. Kane ,  Peter G. Madden ,  Holly G. Gates ,  Emanuel M. Sachs

    IPC: B05B5/00 ,  B05D1/06

    CPC classification number: B05B5/001 ,  B05B5/005 ,  B05B5/087 ,  B05B7/0012 ,  B05B12/16 ,  B05B13/02 ,  B05D1/04 ,  B05D1/06 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6715 ,  H01L21/6776

    Abstract: The present inventions relate to the formation of a thin polymer film on a substrate. Apparatus is described for transforming a solid polymer resist into an aerosol of small particles, electrostatically charging and depositing the particles onto a substrate, and flowing the particles into a continuous layer. Apparatus is further described for transforming solid resist into an aerosol of small particles by heating the resist to form a low viscosity liquid such as is compatible with nebulization and applying the techniques of jet or impact nebulization and aerosol particle sizing to form the aerosol. A method is further described of using ionized gas to confer charge onto the aerosol particles and using a progression of charging devices establish an electric field directing the flow of charged particles to the substrate. The progression of charging devices and associated apparatus results in high collection efficiency for the aerosol particles.

    Abstract translation: 本发明涉及在基材上形成薄聚合物膜。 描述了用于将固体聚合物抗蚀剂转化成小颗粒气溶胶的装置，将颗粒静电充电并沉积到基底上，并将颗粒流入连续层。 进一步描述了将固体抗蚀剂转化为小颗粒气溶胶的装置，通过加热抗蚀剂以形成与雾化相容的低粘度液体，并应用喷射或冲击雾化和气溶胶颗粒尺寸的技术以形成气溶胶。 进一步描述了使用电离气体将电荷赋予气溶胶颗粒的方法，并且使用充电装置的进展建立了将带电粒子流引导到基底的电场。 充电装置和相关设备的进展导致气溶胶颗粒的高收集效率。

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