公开(公告)号：US20220020663A1

公开(公告)日：2022-01-20

申请号：US17311458

申请日：2019-12-09

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Tomoaki Uchiya ,  Naoyuki Toriumi ,  Eisuke Yamaguchi ,  Guanqiao Li

IPC: H01L23/373 ,  H05K7/20 ,  H01L23/29 ,  H01L23/42 ,  B29C39/10 ,  B32B27/08

Abstract: The production method for a thermally conductive molding includes: preparing a first film that is disposed on a mold having a three-dimensional shape so as to conform to the three-dimensional shape, and that has a first layer and a second layer that is releasably adhered to the first layer on a surface opposite to the mold of the first layer; disposing a curable composition including a thermally conductive material and a (meth)acrylic monomer on the first film; disposing a second film on the curable composition and sandwiching the curable composition between the first film and the second film; radically polymerizing the (meth)acrylic monomer in the curable composition to form a cured product of the curable composition between the first film and the second film; and releasing the first layer from the second layer to obtain a thermally conductive molding including the second layer, the cured product, and the second film.