THERMALLY CONDUCTIVE MOLDING, PRODUCTION METHOD FOR THE SAME, STRUCTURE, AND MULTILAYER FILM

    公开(公告)号:US20220020663A1

    公开(公告)日:2022-01-20

    申请号:US17311458

    申请日:2019-12-09

    Abstract: The production method for a thermally conductive molding includes: preparing a first film that is disposed on a mold having a three-dimensional shape so as to conform to the three-dimensional shape, and that has a first layer and a second layer that is releasably adhered to the first layer on a surface opposite to the mold of the first layer; disposing a curable composition including a thermally conductive material and a (meth)acrylic monomer on the first film; disposing a second film on the curable composition and sandwiching the curable composition between the first film and the second film; radically polymerizing the (meth)acrylic monomer in the curable composition to form a cured product of the curable composition between the first film and the second film; and releasing the first layer from the second layer to obtain a thermally conductive molding including the second layer, the cured product, and the second film.

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