公开(公告)号：US20160141476A1

公开(公告)日：2016-05-19

申请号：US14944393

申请日：2015-11-18

Applicant: ACHROLUX INC.

Inventor： Peiching Ling ,  Dutta Vivek ,  Dezhong Liu

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present disclosure provides a method of manufacturing a package structure. The method includes: providing a plurality of conductive portions and a light emitting element; encapsulating the light emitting element and the conductive portions by an encapsulant with a lateral surface of the light emitting element electrically insulated from the conductive portions; electrically connecting the light emitting element to the conductive portions by a conductive element. Accordingly, several methods can be selected to form the conductive element with no conventional limitations. The present disclosure further provides a package structure and a carrier.

Abstract translation: 本公开提供了一种制造封装结构的方法。 该方法包括：提供多个导电部分和发光元件; 通过密封剂封装发光元件和导电部分，其中发光元件的侧表面与导电部分电绝缘; 通过导电元件将发光元件电连接到导电部分。 因此，可以选择几种方法来形成导电元件，而没有常规限制。 本公开进一步提供了封装结构和载体。