公开(公告)号：US09462679B2

公开(公告)日：2016-10-04

申请号：US14256029

申请日：2014-04-18

Applicant: ADVANCED FLEXBLE CIRCUITS CO., LTD.

Inventor： Ching-Cheng Tien ,  Gwun-Jin Lin ,  Chih-Heng Chuo ,  Kuo-Fu Su

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K1/0227 ,  H05K1/0245 ,  H05K3/3421 ,  H05K2201/0949 ,  H05K2201/09727 ,  H05K2201/10189 ,  H05K2201/10689

Abstract: An attenuation reduction grounding pattern structure for connection pads of a flexible circuit board includes a plurality of high frequency connection pads formed on a component surface of a substrate and a plurality of differential mode signal lines arranged on the substrate and connected to the high frequency connection pads. The substrate has a grounding surface forming a grounding layer. The grounding layer includes an attenuation reduction grounding pattern structure formed at a location corresponding to the transition zone and including a hollowed area and a protruded portion. The protruded portion extends a predetermined length in a direction from the grounding layer toward the high frequency connection pads and along the adjacent high frequency connection pads to reach the transition zone. The protruded portion and the high frequency connection pads form a polarization-direction-varying electric field in the transition zone.

Abstract translation: 用于柔性电路板的连接焊盘的衰减减小接地图形结构包括形成在基板的部件表面上的多个高频连接焊盘和布置在基板上的多个差模信号线，并连接到高频连接焊盘 。 基板具有形成接地层的接地面。 接地层包括形成在对应于过渡区域的位置并且包括中空区域和突出部分的衰减减小接地图案结构。 突出部分在从接地层朝向高频连接焊盘的方向上延伸预定长度，并沿着相邻的高频连接焊盘延伸到达过渡区。 突出部分和高频连接焊盘在过渡区域中形成偏振方向变化的电场。