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    AROMATIC POLYIMIDE SUBSTRATE FOR OPTICAL DISPLAYS AND METHOD OF MANUFACTURE
    6.
    发明申请
    AROMATIC POLYIMIDE SUBSTRATE FOR OPTICAL DISPLAYS AND METHOD OF MANUFACTURE 有权

    公开(公告)号：US20250122346A1

    公开(公告)日：2025-04-17

    申请号：US18609254

    申请日：2024-03-19

    Applicant: Akron Polymer Systems, Inc.

    Inventor： Zhen Li ,  Lang Hu ,  Limin Sun ,  Frank W. Harris ,  Dong Zhang

    IPC: C08J5/18 ,  C08G73/10 ,  G02B1/04

    Abstract: Disclosed herein is a method for the preparation of an aromatic polyimide substrate for optical displays that can be carried out during the manufacture of the display, The process includes the steps of applying a solution of an aromatic tetracarboxylic acid or an aromatic tetracarboxylic acid derivative and a low molecular weight polyamic acid on a solid support and heating to 425° C. to 450° C. The polyamic acid is prepared from non-stoichiometric amounts of BPDA and PDA. The tetracarboxylic acid is BPTA or PMA. The solution has a solids content of 15 to 25 wt % and an apparent viscosity of 2,000 to 10,000 cPs. The substrate has an elongation to break of greater than 30%, a modulus greater than 8 GPa, a maximum stress to break greater than 400 MPa, and a yellowness factor b*

    SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, ILLUMINATION ELEMENT OR SENSOR ELEMENT
    8.
    发明申请
    SOLUTION OF AROMATIC POLYAMIDE FOR PRODUCING DISPLAY ELEMENT, OPTICAL ELEMENT, ILLUMINATION ELEMENT OR SENSOR ELEMENT 审中-公开
    用于生产显示元件，光学元件，照明元件或传感器元件的芳族聚酰胺的解决方案

    公开(公告)号：US20160075913A1

    公开(公告)日：2016-03-17

    申请号：US14848995

    申请日：2015-09-09

    Applicant: AKRON POLYMER SYSTEMS, INC. ,  SUMITOMO BAKELITE COMPANY LIMITED

    Inventor： Limin Sun ,  Jiaokai Jing ,  Dong Zhang ,  Frank W. Harris ,  Ritsuya Kawasaki ,  Toshihiko Katayama ,  Jun Okada ,  Hideo Umeda

    IPC: C09D177/10 ,  B05D3/00

    CPC classification number: C09D177/10 ,  B32B17/064 ,  B32B27/281 ,  C08G69/265 ,  C08G69/32 ,  H01L51/0097 ,  Y02E10/549 ,  Y02P70/521

    Abstract: The present disclosure, in one aspect, relates to a polyamide solution which can suppress the yellowness. The present disclosure, in one or a plurality of embodiments, relates to a polyamide solution comprising an aromatic polyamide and a solvent, the aromatic polyamide comprising a constitutional unit having one or more free carboxyl groups and having an aromatic ring structure and an alicyclic structure in the main chain. Further, the present disclosure, in one aspect, relates to a laminated composite material, comprising a glass plate and a polyamide resin layer; the polyamide resin layer laminated onto one surface of the glass plate, the polyamide resin layer having yellowness (JIS K7373) of 2.4 or less; and the polyamide resin layer obtained by applying the solution onto the glass plate.

    Abstract translation: 在一个方面，本公开涉及可以抑制黄度的聚酰胺溶液。 在一个或多个实施方案中，本公开涉及包含芳族聚酰胺和溶剂的聚酰胺溶液，所述芳族聚酰胺包含具有一个或多个游离羧基并具有芳环结构和脂环结构的结构单元 主链。 此外，本公开一方面涉及一种层压复合材料，其包括玻璃板和聚酰胺树脂层; 叠层在玻璃板的一个表面上的聚酰胺树脂层，黄色度（JIS K7373）为2.4以下的聚酰胺树脂层; 以及通过将溶液涂布在玻璃板上而获得的聚酰胺树脂层。

    POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHODS OF MAKING SAME
    9.
    发明申请
    POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHODS OF MAKING SAME 有权

    公开(公告)号：US20250130494A1

    公开(公告)日：2025-04-24

    申请号：US18609112

    申请日：2024-03-19

    Applicant: Akron Polymer Systems, Inc.

    Inventor： Yufeng Zhu ,  Lang Hu ,  Zhen Li ,  Limin Sun ,  Dong Zhang ,  Xiaoliang Zheng

    IPC: G03F7/039 ,  C08G73/10 ,  G03F7/004

    Abstract: The components and methods disclosed herein are directed to positive type photosensitive resin compositions, which are comprised of an alkynyl containing polymer, a benzophenone type DNQ, and solvents. The alkynyl containing polymer is prepared by the condensation reaction of alkynyl containing dianhydrides and hydroxyl containing diamines, and alkynyl containing end cappers. The advantage of this formulation is that the resulting photosensitive resin composition is comprised of only a polymer, a benzophenone type DNQ PAC, and solvents that generates high resolution patterned films with good thermal and physical properties without using additional additives. This composition also enables film curing at relatively low temperatures without additional additives, simplifying the composition. After curing, the alkynyl units in the polymer chain and the chain ends give the cured film excellent solvent resistance and film retention due to intra and/or inter-molecular crosslinking.

    Aromatic polyamide films for solvent resistant flexible substrates
    10.
    发明授权
    Aromatic polyamide films for solvent resistant flexible substrates 有权

    公开(公告)号：US10759940B2

    公开(公告)日：2020-09-01

    申请号：US15820868

    申请日：2017-11-22

    Applicant: Akron Polymer Systems, Inc.

    Inventor： Limin Sun ,  Dong Zhang ,  Frank W. Harris ,  Jiaokai Jing

    IPC: C08L77/10 ,  C08G69/32 ,  C08J5/18

    Abstract: Films with optical transmittance of >80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/° C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures >300° C. The films are cross-linked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.

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