公开(公告)号：US09648753B2

公开(公告)日：2017-05-09

申请号：US14758753

申请日：2013-12-31

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jong-Soo Kim ,  Kyung-Hoon Lee ,  Jeong-Sang Yu ,  O-Chung Kwon

IPC: H05K1/00 ,  H05K3/20 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/12

CPC classification number: H05K3/207 ,  H05K1/028 ,  H05K1/0287 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/092 ,  H05K1/118 ,  H05K3/12 ,  H05K2201/0145 ,  H05K2201/0154

Abstract: The present invention relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by using the same. A circuit pattern is formed with a conductive paste on one surface of a base material, and the circuit pattern is sintered at a temperature of 290° C. to 420° C. to manufacture the flexible printed circuit board. As such, manufacturing costs can be reduced and productivity can be improved through a simple yet convenient process. Also, the circuit pattern is formed without a plating process, such that the problem of circuit pattern separation occurring during the plating process can be addressed and product reliability can be improved.