公开(公告)号：US20160165721A1

公开(公告)日：2016-06-09

申请号：US14897200

申请日：2014-04-11

Applicant: AMOGREENTECH CO., LTD.

Inventor： O-Chung Kwon ,  Jeong-Sang Yu ,  Jae-Sic Kim ,  Yong-Il Kim ,  Hyun-Soo Jang

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/40 ,  H05K3/12 ,  H05K3/28

CPC classification number: H05K3/4664 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/1208 ,  H05K3/1216 ,  H05K3/1283 ,  H05K3/28 ,  H05K3/285 ,  H05K3/381 ,  H05K3/4069 ,  H05K2203/097 ,  H05K2203/1194 ,  H05K2203/1461 ,  H05K2203/1563 ,  H05K2203/1572

Abstract: A method for manufacturing a flexible printed circuit board includes preliminarily thermally deforming s substrate through heating, forming a circuit pattern with a conductive paste on the preliminarily thermally deformed substrate, and firing the circuit pattern. A flexible printed circuit board includes a substrate, and a circuit pattern formed by firing a conductive paste on a first surface of the substrate. The substrate is preliminarily thermally deformed and, thus, a shrinkage variation thereof before and after firing the conductive paste is zero. Dimensional stability when firing the circuit pattern printed with the conductive paste can be ensured, deterioration of adhesion between the circuit pattern and the substrate attributable to film deformation upon firing can be prevented, and stable adhesion of the circuit pattern can be maintained even after firing.

Abstract translation: 柔性印刷电路板的制造方法包括通过加热预先使基板热变形，在预热变形的基板上形成具有导电浆料的电路图案，并且对该电路图案进行点火。 柔性印刷电路板包括基板和通过在基板的第一表面上焙烧导电浆料形成的电路图案。 基板预热变形，因此，在导电浆料烧成前后的收缩变化为零。 可以确保烧制印有导电膏的电路图形时的尺寸稳定性，可以防止由于烧成时的膜变形引起的电路图案与基板之间的粘合性的劣化，即使在烧成后也能够保持电路图案的稳定的粘合。

公开(公告)号：US10512175B2

公开(公告)日：2019-12-17

申请号：US14897200

申请日：2014-04-11

Applicant: AMOGREENTECH CO., LTD.

Inventor： O-Chung Kwon ,  Jeong-Sang Yu ,  Jae-Sic Kim ,  Yong-Il Kim ,  Hyun-Soo Jang

IPC: H05K3/46 ,  H05K3/42 ,  H05K3/12 ,  H05K3/28

Abstract: A method for manufacturing a flexible printed circuit board includes preliminarily thermally deforming s substrate through heating, forming a circuit pattern with a conductive paste on the preliminarily thermally deformed substrate, and firing the circuit pattern. A flexible printed circuit board includes a substrate, and a circuit pattern formed by firing a conductive paste on a first surface of the substrate. The substrate is preliminarily thermally deformed and, thus, a shrinkage variation thereof before and after firing the conductive paste is zero. Dimensional stability when firing the circuit pattern printed with the conductive paste can be ensured, deterioration of adhesion between the circuit pattern and the substrate attributable to film deformation upon firing can be prevented, and stable adhesion of the circuit pattern can be maintained even after firing.

公开(公告)号：US11785713B2

公开(公告)日：2023-10-10

申请号：US17425713

申请日：2020-01-13

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jeong-Sang Yu ,  Young-Suk Oh ,  Taek-Min Kim

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/0201 ,  H05K3/06 ,  H05K3/4644 ,  H05K1/181 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/10189

Abstract: A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer stacked on the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.

公开(公告)号：US09949379B2

公开(公告)日：2018-04-17

申请号：US14897214

申请日：2014-04-30

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jongsoo Kim ,  Jeong-Sang Yu ,  O-Chung Kwon ,  Jae-Sic Kim

IPC: H05K3/36 ,  H05K3/28 ,  H05K3/46 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K1/03

CPC classification number: H05K3/361 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/10 ,  H05K3/285 ,  H05K3/46 ,  H05K3/4664 ,  H05K3/4676 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0317 ,  H05K2203/0759

Abstract: A flexible printed circuit board includes a substrate, a circuit pattern formed on the substrate, and a protective coating layer formed on the substrate by applying and curing a coating solution to cover and protect the circuit pattern. A method for manufacturing forming a circuit pattern on a substrate and forming a protective coating layer for covering and protecting the circuit pattern by applying a coating solution on the substrate. The circuit pattern may be securely attached to the substrate, and damage and deformation of the circuit pattern due to repeated bending or warping of the substrate may be prevented, ultimately improving operational reliability.

公开(公告)号：US20220192004A1

公开(公告)日：2022-06-16

申请号：US17425713

申请日：2020-01-13

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jeong-Sang Yu ,  Young-Suk Oh ,  Taek-Min Kim

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/46

Abstract: A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer device of the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.

公开(公告)号：US09648753B2

公开(公告)日：2017-05-09

申请号：US14758753

申请日：2013-12-31

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jong-Soo Kim ,  Kyung-Hoon Lee ,  Jeong-Sang Yu ,  O-Chung Kwon

IPC: H05K1/00 ,  H05K3/20 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/12

CPC classification number: H05K3/207 ,  H05K1/028 ,  H05K1/0287 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/092 ,  H05K1/118 ,  H05K3/12 ,  H05K2201/0145 ,  H05K2201/0154

Abstract: The present invention relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by using the same. A circuit pattern is formed with a conductive paste on one surface of a base material, and the circuit pattern is sintered at a temperature of 290° C. to 420° C. to manufacture the flexible printed circuit board. As such, manufacturing costs can be reduced and productivity can be improved through a simple yet convenient process. Also, the circuit pattern is formed without a plating process, such that the problem of circuit pattern separation occurring during the plating process can be addressed and product reliability can be improved.

公开(公告)号：US20160135285A1

公开(公告)日：2016-05-12

申请号：US14897214

申请日：2014-04-30

Applicant: AMOGREENTECH CO., LTD.

Inventor： Jongsoo Kim ,  Jeong-Sang Yu ,  O-Chung Kwon ,  Jae-Sic Kim

IPC: H05K1/02 ,  H05K3/10 ,  H05K3/46 ,  H05K3/00 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K3/361 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/10 ,  H05K3/285 ,  H05K3/46 ,  H05K3/4664 ,  H05K3/4676 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0317 ,  H05K2203/0759

Abstract: A flexible printed circuit board includes a substrate, a circuit pattern formed on the substrate, and a protective coating layer formed on the substrate by applying and curing a coating solution to cover and protect the circuit pattern. A method for manufacturing forming a circuit pattern on a substrate and forming a protective coating layer for covering and protecting the circuit pattern by applying a coating solution on the substrate. The circuit pattern may be securely attached to the substrate, and damage and deformation of the circuit pattern due to repeated bending or warping of the substrate may be prevented, ultimately improving operational reliability.

Abstract translation: 柔性印刷电路板包括基板，形成在基板上的电路图案，以及通过施加和固化涂覆溶液来覆盖和保护电路图案而在基板上形成的保护涂层。 一种在衬底上形成电路图案的方法，并且通过在衬底上施加涂布溶液形成用于覆盖和保护电路图案的保护涂层。 电路图案可以牢固地附接到基板，并且可以防止由于基板的反复弯曲或翘曲引起的电路图案的损坏和变形，最终提高了操作可靠性。